HLFQFP Power Management ICs 14

Reset All

Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	No. of Functions	No. of Channels	Technology	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MC33771BSA2AE/R2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	8	MOS		GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G64		61.6 V	1.6 mm	10 mm	9.6 V					10 mm	NO
MC33771BSP1AE/R2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	14	MOS		GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G64		61.6 V	1.6 mm	10 mm	9.6 V					10 mm	NO
MC33771BSP2AE/R2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	8	MOS		GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G64		61.6 V	1.6 mm	10 mm	9.6 V					10 mm	NO
MC33771BTA2AE/R2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	8	MOS		GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G64		61.6 V	1.6 mm	10 mm	9.6 V					10 mm	NO
MC33771BTB1AE/R2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	14	MOS		GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G64		61.6 V	1.6 mm	10 mm	9.6 V					10 mm	NO
MC33771BTP2AE/R2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	8	MOS		GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G64		61.6 V	1.6 mm	10 mm	9.6 V					10 mm	NO
AD7284WBSWZ-RL	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	OTHER	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	8			GULL WING		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	120 Cel	-30 Cel		QUAD	S-PQFP-G64	3	40 V	1.6 mm	10 mm	10 V		30	260		10 mm	NO
AD7284WBSWZ	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	OTHER	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	8			GULL WING		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	120 Cel	-30 Cel		QUAD	S-PQFP-G64	3	40 V	1.6 mm	10 mm	10 V		30	260		10 mm	NO
TPS9901TPZPQ1	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	100	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	1		AEC-Q100	GULL WING	3.3 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G100	3	3.6 V	1.2 mm	14 mm	3 V	e4	30	260	+0.98V	14 mm	NO
TPS9901TPZPRQ1	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	100	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	1		AEC-Q100	GULL WING	3.3 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G100	3	3.6 V	1.2 mm	14 mm	3 V	e4	30	260	+0.98V	14 mm	NO
MC33771CTA1AER2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	14	MOS	AEC-Q100	GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	R-PQFP-G64	3	61.6 V	1.6 mm	10 mm	9.6 V		40	260	8.5	10 mm	NO
MC33771CTA2AER2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	8	MOS	AEC-Q100	GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	R-PQFP-G64	3	61.6 V	1.6 mm	10 mm	9.6 V		40	260	8.5	10 mm	NO
MC33771CTP2AER2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	8	MOS	AEC-Q100	GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	R-PQFP-G64	3	61.6 V	1.6 mm	10 mm	9.6 V		40	260	8.5	10 mm	NO
MC33771CTP1AER2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY	1	14	MOS	AEC-Q100	GULL WING	56 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	R-PQFP-G64	3	61.6 V	1.6 mm	10 mm	9.6 V		40	260	8.5	10 mm	NO

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.