HSSOP Power Management ICs 40

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	Maximum Output Current	No. of Functions	No. of Channels	Technology	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
TLE7368-3E	Infineon Technologies	POWER SUPPLY MANAGEMENT CIRCUIT		36	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	CMOS		GULL WING	13.5 V	4.5/45	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP36,.56	Power Management Circuits	.65 mm			MATTE TIN	DUAL	R-PDSO-G36	3	45 V	2.55 mm	7.6 mm	Not Qualified	4.5 V		e3				12.8 mm	YES
LM5064PMH/NOPB	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	28	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	8 mA	500 A	1	1			GULL WING	48 V	48	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	TSSOP28,.25	Power Management Circuits	.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	80 V	1 mm	4.4 mm	Not Qualified	10 V		e3	30	260		9.7 mm	YES
LM5064PMHE/NOPB	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	28	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	8 mA	500 A	1	1			GULL WING	48 V	48	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	TSSOP28,.25	Power Management Circuits	.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	80 V	1.2 mm	4.4 mm	Not Qualified	10 V		e3	30	260		9.7 mm	YES
LM5064PMHX/NOPB	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	28	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	8 mA	500 A	1	1			GULL WING	48 V	48	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	TSSOP28,.25	Power Management Circuits	.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	80 V	1.2 mm	4.4 mm	Not Qualified	10 V		e3	30	260		9.7 mm	YES
TLE7368EXUMA1	Infineon Technologies	POWER SUPPLY MANAGEMENT CIRCUIT		36	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	CMOS		GULL WING	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm				DUAL	R-PDSO-G36		45 V	2.55 mm	7.6 mm	Not Qualified	4.5 V			NOT SPECIFIED	NOT SPECIFIED		12.8 mm	YES
TLE7368GNUMA1	Infineon Technologies	POWER SUPPLY MANAGEMENT CIRCUIT		36	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	CMOS		GULL WING	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm				DUAL	R-PDSO-G36		45 V	3.5 mm	11 mm	Not Qualified	4.5 V			NOT SPECIFIED	NOT SPECIFIED		15.9 mm	YES
TLE73682EXUMA1	Infineon Technologies	POWER SUPPLY MANAGEMENT CIRCUIT		36	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	CMOS		GULL WING	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm				DUAL	R-PDSO-G36		45 V	2.55 mm	7.6 mm		4.5 V			NOT SPECIFIED	NOT SPECIFIED		12.8 mm	YES
BTS500801EGAAUMA1	Infineon Technologies	POWER SUPPLY SUPPORT CIRCUIT		12	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	24 mA		1	1		AEC-Q100	GULL WING	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP12,.4,39		1 mm	150 Cel	-40 Cel		DUAL	R-PDSO-G12		16 V	2.6 mm	6.4 mm		9 V					+2.8V	7.5 mm	NO
L9952GXPTR	STMicroelectronics	POWER SUPPLY MANAGEMENT CIRCUIT		36	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	CMOS		GULL WING	13.5 V	6/18	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP36,.4,20	Power Management Circuits	.5 mm			MATTE TIN	DUAL	R-PDSO-G36	3	18 V	2.47 mm	7.5 mm	Not Qualified	6 V		e3		260		10.3 mm	NO
L9952GXP	STMicroelectronics	POWER SUPPLY MANAGEMENT CIRCUIT		36	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	CMOS		GULL WING	13.5 V	6/18	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP36,.4,20	Power Management Circuits	.5 mm			MATTE TIN	DUAL	R-PDSO-G36	3	18 V	2.47 mm	7.5 mm	Not Qualified	6 V		e3		260		10.3 mm	NO
MAX5907UEE	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	OTHER	16	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	2.3 mA		1	2	BICMOS		GULL WING	3.3 V	1/13.2	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Power Management Circuits	.635 mm	85 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	13.2 V	1.75 mm	3.9 mm	Not Qualified	1 V	CHANNEL 1 SUPPLY INPUT IS 5V NOMINAL	e0		245		4.89 mm	YES
MCZ33903D3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903D3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903D5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DD3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DD3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DD5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DD5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DP3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DP5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DP5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DS5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33904D3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33904D3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33904D5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33904D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33905DD3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		17.9 mm	YES
MCZ33905DD3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		17.9 mm	YES
MCZ33905DD5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		17.9 mm	YES
MCZ33905DD5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		17.9 mm	YES
MCZ33905DS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33905DS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33905DS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33905DS5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
L9001	STMicroelectronics	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	24	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	3		AEC-Q100	GULL WING			SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SOP24,.41,32		.8 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G24	3	18 V	2.45 mm	7.5 mm		5.5 V					+3.25V	10.3 mm	YES
TCB010FNG	Toshiba	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	36	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY			1	1	CMOS		GULL WING	13.2 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G36		18 V	3.41 mm	11 mm		4.9 V			NOT SPECIFIED	NOT SPECIFIED		15.9 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.