SQUARE Power Management ICs 1,518

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Maximum Switching Frequency	Package Body Material	Maximum Supply Current (Isup)	Maximum Output Current	No. of Functions	No. of Channels	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Switcher Config	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Minimum Supply Voltage (Vsup)	Minimum Input Voltage	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold	Maximum Input Voltage
MC33FS8510A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V			40		260	+7.5V	8 mm	NO
MC33FS8530A4ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8430G1ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8430G1ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8430G2ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8430G4ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8500A0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V			40		260	+7.5V	8 mm	NO
MC33FS8510A2ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8510D3ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8520A0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V			40		260	+7.5V	8 mm	NO
MC33FS8530A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8530A0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8420G0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V			40		260	+7.5V	8 mm	NO
MC33FS8400G0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V			40		260	+7.5V	8 mm	NO
MC33FS8400G5ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8405G0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
MC33FS8415G0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V			40		260	+7.5V	8 mm	NO
MC33FS8425G0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V			40		260	+7.5V	8 mm	NO
MC33FS8425G0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V			40		260	+7.5V	8 mm	NO
MC33FS8500A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	25 mA		1	6	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		e3	40		260	+7.5V	8 mm	NO
BQ298009RUGT	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	8	HVQCCN	SQUARE	YES		PLASTIC/EPOXY	.008 mA		1	1		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC8,.06SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	5.5 V	.4 mm	1.5 mm	1.5 V		e4	30		260	2.9	1.5 mm	NO
BQ25798RQMR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	29	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	1		NO LEAD	15 V	BUCK-BOOST	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC29,.16SQ,16	.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N29	2	24 V	1 mm	4 mm	3.6 V		e4	30		260	+3.2V	4 mm	YES
MCP16501TA-E/RMBVAO	Microchip Technology	POWER SUPPLY SUPPORT CIRCUIT		24	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	4	AEC-Q100	NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N24		5.5 V	.9 mm	4 mm	2.7 V						2.55	4 mm	YES
TPS9901TPZPQ1	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	100	HLFQFP	SQUARE	YES		PLASTIC/EPOXY			1	1	AEC-Q100	GULL WING	3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G100	3	3.6 V	1.2 mm	14 mm	3 V		e4	30		260	+0.98V	14 mm	NO
TPS9901TPZPRQ1	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	100	HLFQFP	SQUARE	YES		PLASTIC/EPOXY			1	1	AEC-Q100	GULL WING	3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G100	3	3.6 V	1.2 mm	14 mm	3 V		e4	30		260	+0.98V	14 mm	NO
INA238AIDGSR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	10	TSSOP	SQUARE	YES		PLASTIC/EPOXY			1	1		BALL	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	2	5.5 V	1.1 mm	3 mm	2.7 V		e3	30		260		3 mm	NO
LP873345RHDT	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	28	HVQCCN	SQUARE	YES	2200 kHz	PLASTIC/EPOXY		3 A	1	5		NO LEAD	3.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N28	2	5.5 V	1 mm	5 mm	2.8 V	2.8 V	e3	30	4	260		5 mm	YES	5.5 V
LP873244RHDTQ1	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT		28	HVQCCN	SQUARE	YES	2200 kHz	PLASTIC/EPOXY		2 A	1	2	AEC-Q100	NO LEAD	3.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N28	2	5.5 V	1 mm	5 mm	2.8 V	2.8 V	e3	30	4	260	+0.36V	5 mm	YES	5.5 V
MVR5510AMBA4ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AVMA4EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMMA0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMMAHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AVMA6EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AVMAHEP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMMA4ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMBA0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMBA6ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMBAHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMDA6ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMDAHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMMA6ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AVMA0EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
TPS65941111RWERQ1	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	56	HVQCCN	SQUARE	YES	2400 kHz	PLASTIC/EPOXY		14 A	1	20	AEC-Q100	NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.32SQ,20	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N56	3	5.5 V	.9 mm	8 mm	2.8 V		e4	30	9	260	2.75	8 mm	YES
TPS65941212RWERQ1	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	56	HVQCCN	SQUARE	YES	2400 kHz	PLASTIC/EPOXY		14 A	1	20	AEC-Q100	NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.32SQ,20	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N56	3	5.5 V	.9 mm	8 mm	2.8 V		e4	30	9	260	2.75	8 mm	YES
TPS6521855RSLR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	VQCCN	SQUARE	YES	2400 kHz	PLASTIC/EPOXY		1.8 A	1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N48	3	5.5 V	1 mm	6 mm	2.2 V		e4	30	7	260	+3V	6 mm	YES
MVR5510AMMAHESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AVMAHEPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES
MVR5510AMDA6ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES		PLASTIC/EPOXY			1	9	AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V			40		260	+7.5V	8 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.