| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
176 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA176,17X17,32 |
1.35 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
15 mm |
ALSO REQUIRES 3.3V SUPPLY |
0 |
100 MHz |
30 |
260 |
15 mm |
CMOS |
1.5 V |
Bus Controllers |
PCI |
.8 mm |
S-PBGA-B176 |
3 |
Not Qualified |
IEEE1394; IEEE1394A |
e1 |
||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
201 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA201,17X17,32 |
1.35 V |
70 Cel |
250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
15 mm |
ALSO OPERATES AT 3.3V SUPPLY |
32 |
125 MHz |
30 |
260 |
15 mm |
CMOS |
1.5 V |
Bus Controllers |
.8 mm |
S-PBGA-B201 |
3 |
Not Qualified |
e1 |
|||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
1 mm |
7 mm |
25 MHz |
7 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI |
.4 mm |
S-XQCC-N56 |
|||||||||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
100 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
0 |
GRID ARRAY |
1.35 V |
70 Cel |
312.5 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
12 mm |
0 |
30 |
260 |
12 mm |
CMOS |
1.5 V |
PCI |
S-PBGA-B100 |
3 |
e1 |
||||||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.99 V |
70 Cel |
625 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
9 mm |
3.3V SUPPLY ALSO AVAILABLE, 34 MHZ NOMINAL CRYSTAL AVAILABLE |
0 |
30 |
260 |
9 mm |
CMOS |
1.1 V |
I2C |
.5 mm |
S-PQCC-N64 |
3 |
e4 |
|||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
ALSO OPERATES WITH 3.3V SUPPLY |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; I2S; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
|||||||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
.99 V |
70 Cel |
625 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
0 |
30 |
260 |
CMOS |
1.1 V |
I2C; SMBUS |
S-XQCC-N64 |
3 |
e4 |
||||||||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
.99 V |
70 Cel |
625 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
0 |
30 |
260 |
CMOS |
1.1 V |
I2C; SMBUS |
S-XQCC-N64 |
3 |
e4 |
||||||||||||||||||||||||||||||
|
|
FTDI |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK, LOW PROFILE |
4.35 V |
70 Cel |
1 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
7 mm |
AND ALSO DATA RATE TRANSFERE AT 300KILOBYTE/SECOND-VCP DRIVERS |
8 |
6 MHz |
30 |
260 |
7 mm |
CMOS |
5 V |
USB |
.8 mm |
S-PQFP-G32 |
3 |
e3 |
|||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
1.2,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
25 MHz |
40 |
260 |
9 mm |
CMOS |
1.2 V |
Bus Controllers |
I2C; SMBUS; SPI; UART; USB |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
1.2,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
25 MHz |
40 |
260 |
9 mm |
CMOS |
1.2 V |
Bus Controllers |
I2C; SMBUS; SPI; UART; USB |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||
|
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
GULL WING |
120 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
32 |
FLATPACK, THIN PROFILE, FINE PITCH |
2.3 V |
70 Cel |
0 Cel |
QUAD |
1.2 mm |
14 mm |
32 |
260 |
14 mm |
CMOS |
2.5 V |
8051; USB |
.4 mm |
S-PQFP-G120 |
4 |
||||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
7 mm |
25 MHz |
7 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N56 |
e3 |
|||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.1 V |
70 Cel |
625 MBps |
0 Cel |
MATTE TIN |
QUAD |
.9 mm |
6 mm |
ALSO HAVING IEEE 802.1Q AND IEEE 802.3AZ BUS INTERFACE STANDARD |
0 |
25 MHz |
6 mm |
CMOS |
256 mA |
1.2 V |
USB |
.4 mm |
S-XQCC-N48 |
IEEE 802.3; IEEE 802.1 |
e3 |
|||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.1 V |
70 Cel |
625 MBps |
0 Cel |
MATTE TIN |
QUAD |
.9 mm |
6 mm |
ALSO HAVING IEEE 802.1Q AND IEEE 802.3AZ BUS INTERFACE STANDARD |
0 |
25 MHz |
6 mm |
CMOS |
256 mA |
1.2 V |
USB |
.4 mm |
S-XQCC-N48 |
IEEE 802.3; IEEE 802.1 |
e3 |
|||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.1 V |
70 Cel |
625 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
7 mm |
ALSO COMPLIANT WITH IEEE 802.1Q AND IEEE 802.3AZ |
0 |
25 MHz |
7 mm |
CMOS |
256 mA |
1.2 V |
USB |
.5 mm |
S-PQCC-N48 |
IEEE 802.3; IEEE 802.1 |
e3 |
|||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.9 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI |
.4 mm |
S-XQCC-N100 |
e3 |
||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.9 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N100 |
e3 |
||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.9 mm |
12 mm |
0 |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
e3 |
||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
LCC24,.2SQ,25 |
3.6 V |
70 Cel |
1.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
48 MHz |
5 mm |
CMOS |
7.5 mA |
5 V |
SPI; UART; USB |
.65 mm |
S-XQCC-N24 |
e3 |
||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
LCC24,.2SQ,25 |
3.6 V |
70 Cel |
1.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
48 MHz |
5 mm |
CMOS |
7.5 mA |
5 V |
SPI; UART; USB |
.65 mm |
S-XQCC-N24 |
e3 |
||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1 mm |
7 mm |
25 MHz |
7 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI |
.4 mm |
S-XQCC-N56 |
e3 |
|||||||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.99 V |
70 Cel |
625 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
9 mm |
ALSO HAVING SECONDARY DIGITAL SUPPLY 3.3V(TYP), 24 MHZ CRYSTAL INPUT |
0 |
30 |
260 |
9 mm |
CMOS |
1.1 V |
I2C; SMBUS; VBUS |
.5 mm |
S-PQCC-N64 |
3 |
e4 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.99 V |
70 Cel |
625 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
9 mm |
ALSO HAVING SECONDARY DIGITAL SUPPLY 3.3V(TYP), 24 MHZ CRYSTAL INPUT |
0 |
30 |
260 |
9 mm |
CMOS |
1.1 V |
I2C; SMBUS; VBUS; VGA |
.5 mm |
S-PQCC-N64 |
3 |
e4 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.99 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
9 mm |
ALSO CAN USE 3V-3.6V SUPPLY RANGE. |
0 |
30 |
260 |
9 mm |
CMOS |
1.1 V |
I2C; SMBUS |
.5 mm |
S-PQCC-N64 |
3 |
e4 |
||||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.99 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
9 mm |
ALSO CAN USE 3V-3.6V SUPPLY RANGE. |
0 |
30 |
260 |
9 mm |
CMOS |
1.1 V |
I2C; SMBUS |
.5 mm |
S-PQCC-N64 |
3 |
e4 |
||||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.4 V |
70 Cel |
60.03 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
3.5 mm |
30 |
260 |
3.5 mm |
CMOS |
.03 mA |
5 V |
I2C |
.5 mm |
S-PQCC-N14 |
2 |
e3 |
|||||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
14 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
4.4 V |
70 Cel |
60.03 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
3.5 mm |
0 |
30 |
260 |
3.5 mm |
CMOS |
.03 mA |
5 V |
I2C |
.5 mm |
S-PQCC-N14 |
2 |
e3 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
14 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
4.4 V |
70 Cel |
60.03 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
3.5 mm |
0 |
30 |
260 |
3.5 mm |
CMOS |
.03 mA |
5 V |
I2C |
.5 mm |
S-PQCC-N14 |
2 |
e3 |
|||||||||||||||||||||||||
|
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
1156 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1156,34X34,40 |
.95 V |
70 Cel |
.0125 MBps |
0 Cel |
BOTTOM |
2.85 mm |
35 mm |
0 |
245 |
35 mm |
CMOS |
1 V |
I2C; SMBUS; SPI; VGA |
1 mm |
S-PBGA-B1156 |
4 |
IEEE 1149.6; IEEE 1149.1 |
|||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
AEC-Q100 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
3 V |
70 Cel |
0 Cel |
QUAD |
1 mm |
7 mm |
0 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
167 mA |
3.3 V |
I2S, SMBUS, SPI, UART, USB |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||
|
|
Renesas Electronics |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
76 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
70 Cel |
625 MBps |
0 Cel |
TIN BISMUTH |
QUAD |
.9 mm |
9 mm |
0 |
24 MHz |
9 mm |
CMOS |
5 V |
SPI |
.4 mm |
S-XQCC-N76 |
e6 |
||||||||||||||||||||||||||||||
|
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
.95 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
19 mm |
19 mm |
CMOS |
1 V |
I2C; ISA; SMBUS; SPI; VGA |
1 mm |
S-PBGA-B324 |
4 |
IEEE 1149.1; IEEE 1149.6 |
e1 |
|||||||||||||||||||||||||||||
|
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
.95 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
19 mm |
0 |
19 mm |
CMOS |
1 V |
I2C; SMBUS; SPI; USB |
1 mm |
S-PBGA-B324 |
4 |
IEEE 1149.6; IEEE 1149.1 |
e1 |
||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
676 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
.95 V |
70 Cel |
0 Cel |
BOTTOM |
2.48 mm |
27 mm |
0 |
27 mm |
CMOS |
1 V |
I2C; SMBUS; SPI; USB |
1 mm |
S-PBGA-B676 |
IEEE 1149.6; IEEE 1149.1 |
||||||||||||||||||||||||||||||||
|
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
676 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA676,26X26,40 |
.95 V |
70 Cel |
.0125 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
27 mm |
0 |
27 mm |
CMOS |
1 V |
I2C; SMBUS; SPI; USB |
1 mm |
S-PBGA-B676 |
4 |
IEEE 1149.6; IEEE 1149.1 |
e1 |
||||||||||||||||||||||||||
|
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
1156 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1156,34X34,40 |
.95 V |
70 Cel |
.0125 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.85 mm |
35 mm |
0 |
35 mm |
CMOS |
1 V |
I2C; SMBUS; SPI; USB |
1 mm |
S-PBGA-B1156 |
4 |
IEEE 1149.6; IEEE 1149.1 |
e1 |
||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
ALSO OPERATES WITH 3.3V SUPPLY |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; I2S; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
|||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.21 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.09 V |
70 Cel |
1250 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
1.15 V |
I2C; I2S; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N100 |
|||||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.21 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.09 V |
70 Cel |
1250 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
1.15 V |
I2C; I2S; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N100 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
1 mm |
7 mm |
ALSO OPERATES AT 3.3 V |
0 |
7 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N56 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
1 mm |
7 mm |
ALSO OPERATES AT 3.3 V |
0 |
7 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N56 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
28 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG |
LCC28,.16SQ,16 |
1.62 V |
70 Cel |
0 Cel |
QUAD |
.9 mm |
4 mm |
48 MHz |
4 mm |
CMOS |
15 mA |
1.8 V |
I2C; SPI; USB |
.4 mm |
S-PQCC-N28 |
|||||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; UART |
.4 mm |
S-XQCC-N100 |
|||||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; UART |
.4 mm |
S-XQCC-N100 |
||||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
also available with 3.3v supply |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
|||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
0 |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N100 |
|||||||||||||||||||||||||||||
|
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
also available with 3.3v supply |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.