144 Digital Signal Processors (DSPs) 182

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-2189NKCAZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.71 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	49152	10 mm		NO	24	40 MHz		260	MULTIPLE	10 mm		CMOS		1.8 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	YES	YES	e1
TMS320VC5402ZGU100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.98 V	16	20	16	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.71 V	100 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	20 MHz	30	260	MULTIPLE	12 mm	2	CMOS		1.8 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	YES	YES	e1	16
TMS320C6722RFP200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		GULL WING	144	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1.32 V		32	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP144,.9SQ	1.14 V				NICKEL PALLADIUM GOLD	QUAD	1.2 mm	262144	20 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	YES	32	25 MHz	30	260	MULTIPLE	20 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	4	Not Qualified	NO	NO	e4
TMS320C6726RFPA225	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		GULL WING	144	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1.32 V		32	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP144,.9SQ	1.14 V				NICKEL PALLADIUM GOLD	QUAD	1.2 mm	262144	20 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	YES	32	25 MHz	30	260	MULTIPLE	20 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	4	Not Qualified	NO	NO	e4
ADSP-21261SKSTZ150	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	49152	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	50 MHz	30	260	MULTIPLE	20 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified	NO	YES	e3
TMS320VC5407ZGU	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		23	16	1.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA169,13X13,32	1.42 V				TIN SILVER COPPER	BOTTOM	1.4 mm	40960	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	20 MHz	30	260	MULTIPLE	12 mm		CMOS		1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	NO	YES	e1
TMS320VC5402ZGUR10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.98 V	16	20	16	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.71 V	100 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	20 MHz	30	260	MULTIPLE	12 mm	2	CMOS		1.8 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	YES	YES	e1	16
TMS320VC5402AGWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY	BGA144,13X13,32	1.55 V	100 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	16384	12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	20 MHz	20	220	MULTIPLE	12 mm	2	CMOS	.8 mA	1.6 V	6		MROM	.8 mm	FIXED POINT	R-PBGA-B144	3		YES	YES	e0	16
TMS320VC5402AZWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY	BGA144,13X13,32	1.55 V	100 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	12 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	20 MHz	30	260	MULTIPLE	12 mm	2	CMOS	.8 mA	1.6 V	6		MROM	.8 mm	FIXED POINT	R-PBGA-B144	3		YES	YES	e1	16
DVC5416PGE160IDWLD	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.65 V		23			FLATPACK, LOW PROFILE, FINE PITCH		1.55 V	100 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		20 mm		YES	16	20 MHz	30	260	MULTIPLE	20 mm		CMOS		1.6 V				.5 mm	FIXED POINT	S-PQFP-G144	1		YES	YES	e4
TMSDVC5402PGE100G4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V		20			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	100 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		20 mm		YES	16	20 MHz	30	260	MULTIPLE	20 mm		CMOS		1.8 V				.5 mm	FIXED POINT	S-PQFP-G144	2		YES	YES	e4
TX5416PGE	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES			23			FLATPACK, LOW PROFILE, FINE PITCH			100 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		20 mm		YES	16	20 MHz	30	260	MULTIPLE	20 mm		CMOS						.5 mm	FIXED POINT	S-PQFP-G144	1		YES	YES	e4
TMS320VC5409AGWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	100 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	32768	12 mm		YES	16	20 MHz	20	220	MULTIPLE	12 mm	1	CMOS		1.6 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e0	16
TMS320VC5409AZWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	100 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1	CMOS		1.6 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e1	16
TMS320VC5409AZWS12	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.42 V	100 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1	CMOS		1.5 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e1	16
TMS320VC5409AGWS12	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.42 V	100 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	32768	12 mm		YES	16	20 MHz	20	220	MULTIPLE	12 mm	1	CMOS		1.5 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e0	16
TMS320C5533AZAY05	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	.998 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	12 mm		YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.05 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5533AZAY10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	1.24 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5534AZAY10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	1.24 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5535AZAYA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	1.24 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	163840	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5533AZAYA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	1.24 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5534AZAYA05	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	.998 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	12 mm		YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.05 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5535AZAYA05	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	.998 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	163840	12 mm		YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.05 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320VC5410AGWS12	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.42 V	100 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	65536	12 mm		YES	16	20 MHz	20	220	MULTIPLE	12 mm	1	CMOS		1.5 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e0	16
TMS320VC5416GWS160	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	131072	12 mm		YES	16	20 MHz	20	220	MULTIPLE	12 mm	1	CMOS		1.6 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e0	16
TMS320C5534AZAYA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	1.24 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320VC5416ZWS160	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1	CMOS		1.6 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e1	16
TMS320VC5410AZWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	100 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1	CMOS		1.6 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e1	16
TMS320VC5416ZWS120	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.42 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1	CMOS		1.5 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e1	16
TMS320C5532AZAYA05	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	.998 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	12 mm		YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.05 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5532AZAYA10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	1.24 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5533AZAYA05	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	.998 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	12 mm		YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.05 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5534AZAY05	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	.998 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	12 mm		YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.05 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320C5535AZAY05	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	.998 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	163840	12 mm		YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.05 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8
TMS320VC5410AGWS16	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.55 V	100 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	65536	12 mm		YES	16	20 MHz	20	220	MULTIPLE	12 mm	1	CMOS		1.6 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e0	16
TMS320VC5410AZWS12	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.42 V	100 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	12 mm		YES	16	20 MHz	30	260	MULTIPLE	12 mm	1	CMOS		1.5 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e1	16
TMS320VC5416GWS120	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V	16	23	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	1.42 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	131072	12 mm		YES	16	20 MHz	20	220	MULTIPLE	12 mm	1	CMOS		1.5 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	YES	e0	16
TMS320C5532AZAY05	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	.998 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	12 mm		YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.05 V	16		MROM	.8 mm	FIXED POINT	S-PBGA-B144	3		YES	NO	e1	8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.