176 Digital Signal Processors (DSPs) 121

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320VC5410ZGW100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	176	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.75 V			23	16	2.5,3.3	GRID ARRAY	BGA176,17X17,32	2.4 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	65536	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	50 MHz	30	260	MULTIPLE	15 mm			CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B176	3	Not Qualified	YES	YES	e1
TMS320F28235ZJZQR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	176	BGA	SQUARE	PLASTIC/EPOXY		YES	1.995 V		AEC-Q100	16			GRID ARRAY		1.805 V	125 Cel	C28X	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	YES	BOTTOM	2.05 mm		15 mm		YES	32	35 MHz	30	260	MULTIPLE	15 mm		69632	CMOS		1.9 V	6	YES			1 mm	FIXED POINT	S-PBGA-B176	3		YES	NO	e1
TMS320F28333PGFA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			16			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel	C28X	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES	QUAD	1.6 mm		24 mm		YES	32	35 MHz	30	260	MULTIPLE	24 mm		69632	CMOS		1.8 V	6	YES			.5 mm	FLOATING POINT	S-PQFP-G176	3		YES	NO	e4
ADSP-21571BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel		-40 Cel			QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176			YES	YES
ADSP-21571BSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.15 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-21571CSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel		-40 Cel			QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176			YES	YES
ADSP-21571CSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	100 Cel		-40 Cel			QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.15 V					.5 mm	FIXED POINT	S-PQFP-G176			YES	YES
ADSP-21571KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel			QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176			YES	YES
ADSP-21571KSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	70 Cel		0 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.15 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570BSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570CSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570CSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570KSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571BSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES							FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS							.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571BSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.15 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571CSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES							FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			105 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS							.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571CSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571CSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	100 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.15 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571KSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES							FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			70 Cel		0 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS							.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571KSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	70 Cel		0 Cel	MATTE TIN		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm			CMOS		1.15 V					.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-BF532SBSTZ4RL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.45 V	8		19			FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	.8 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm	86016	24 mm		YES	16	400 MHz	30	260	MULTIPLE	24 mm	3		CMOS	37.5 mA	1.2 V	8			FLASH	.5 mm	FLOATING POINT	S-PQFP-176	3		YES	YES	e3	8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.