256 Digital Signal Processors (DSPs) 73

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMS320C6747BZKBA3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

16

32

1.2,1.8,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

MULTIPLE

17 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

TMS320C6747BZKBT3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

16

32

1.2,1.8,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

MULTIPLE

17 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

TMS320C6747BZKB4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

16

32

1.3,1.8,3.3

GRID ARRAY

BGA256,16X16,40

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

MULTIPLE

17 mm

CMOS

1.3 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

TMS320C6747BZKBD4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

16

32

1.3,1.8,3.3

GRID ARRAY

BGA256,16X16,40

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

MULTIPLE

17 mm

CMOS

1.3 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

TMS320C6743DZKBT3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

256

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

13

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA256,16X16,40

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

SINGLE

17 mm

4

CMOS

1.2 V

40

Digital Signal Processors

.5 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

SM320C6727BHFHM

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

FLAT

256

GQFF

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

13

FLATPACK, GUARD RING

1.14 V

125 Cel

-55 Cel

GOLD

QUAD

3.21 mm

262144

36 mm

YES

32

25 MHz

MULTIPLE

36 mm

1

CMOS

1.2 V

MROM

.5 mm

FIXED POINT

S-PQFP-F256

NO

NO

e4

8

TMS320C6211BGFN150

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY

BGA256,20X20,50

1.71 V

90 Cel

4

0 Cel

TIN LEAD

BOTTOM

2.32 mm

4096

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

150 MHz

20

220

MULTIPLE

27 mm

2

CMOS

1.8 V

16

Digital Signal Processors

1.27 mm

FIXED POINT

S-PBGA-B256

4

Not Qualified

YES

NO

e0

TMS320C6711BGFN100

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY

BGA256,20X20,50

1.71 V

BOTTOM

2.32 mm

18432

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

100 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

27 mm

CMOS

1.8 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

YES

NO

TMS320C6711BGFN150

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

2 V

22

32

1.8,3.3

GRID ARRAY

BGA256,20X20,50

1.8 V

BOTTOM

2.32 mm

18432

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

149.25 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

27 mm

CMOS

1.9 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

YES

NO

TMS32C6211BGFNA150

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY

BGA256,20X20,50

1.71 V

105 Cel

4

-40 Cel

TIN LEAD

BOTTOM

2.32 mm

1024

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

150 MHz

20

220

MULTIPLE

27 mm

2

CMOS

1.8 V

16

Digital Signal Processors

1.27 mm

FIXED POINT

S-PBGA-B256

4

Not Qualified

YES

NO

e0

TMS320C6727BZDHMUD

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

13

GRID ARRAY

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.02 mm

17 mm

YES

32

25 MHz

30

260

MULTIPLE

17 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B256

3

YES

NO

e1

OMAPL137BZKB3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

13

1.2,1.8/3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

17 mm

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

YES

16

375 MHz

30

260

MULTIPLE

17 mm

CMOS

1.2 V

Other Microprocessor ICs

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

OMAPL137BZKBA3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

13

1.2,1.8/3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

17 mm

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

YES

16

375 MHz

30

260

MULTIPLE

17 mm

CMOS

1.2 V

Other Microprocessor ICs

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

OMAPL137BZKBT3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

13

1.2,1.8/3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

17 mm

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

YES

16

375 MHz

30

260

MULTIPLE

17 mm

CMOS

1.2 V

Other Microprocessor ICs

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

XOMAPL137BZKB3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B256

Not Qualified

TMS320C6211BZFN150

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY

BGA256,20X20,50

1.71 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

2.32 mm

4096

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

150 MHz

30

260

MULTIPLE

27 mm

2

CMOS

1.8 V

16

Digital Signal Processors

1.27 mm

FIXED POINT

S-PBGA-B256

4

Not Qualified

YES

NO

e1

TMS320C6211BZFN167

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY

BGA256,20X20,50

1.71 V

90 Cel

4

0 Cel

TIN SILVER COPPER

BOTTOM

2.32 mm

4096

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

167 MHz

30

260

MULTIPLE

27 mm

2

CMOS

1.8 V

16

Digital Signal Processors

1.27 mm

FIXED POINT

S-PBGA-B256

4

Not Qualified

YES

NO

e1

TMS320C6727GDH300

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

32

32

1.2,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

BOTTOM

2.02 mm

262144

17 mm

32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY

YES

32

25 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

NO

NO

TMS320C6727ZDH300

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

32

32

1.2,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

TIN SILVER COPPER

BOTTOM

2.02 mm

262144

17 mm

32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY

YES

32

25 MHz

30

260

MULTIPLE

17 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

NO

NO

e1

TMS320C6727GDHA250

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

32

32

1.2,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

BOTTOM

2.02 mm

262144

17 mm

32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY

YES

32

25 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

NO

NO

TMS320C6727ZDHA250

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

32

32

1.2,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

BOTTOM

2.02 mm

262144

17 mm

32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY

YES

32

25 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

17 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

Not Qualified

NO

NO

ADSP-21368BBPZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

24

32

1.2,3.3

GRID ARRAY, LOW PROFILE

BGA256,20X20,50

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.7 mm

65536

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

55.56 MHz

260

MULTIPLE

27 mm

CMOS

1.2 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

NO

YES

e1

ADSP-21368KBPZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

24

32

1.2,3.3

GRID ARRAY, LOW PROFILE

BGA256,20X20,50

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.7 mm

65536

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

55.56 MHz

260

MULTIPLE

27 mm

CMOS

1.2 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

NO

YES

e1

ADSP-21369BBPZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

24

32

1.2,3.3

GRID ARRAY, LOW PROFILE

BGA256,20X20,50

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.7 mm

65536

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

55.56 MHz

260

MULTIPLE

27 mm

CMOS

1.2 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

NO

YES

e1

ADSP-21369KBPZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

24

32

1.2,3.3

GRID ARRAY, LOW PROFILE

BGA256,20X20,50

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.7 mm

65536

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

55.56 MHz

30

260

MULTIPLE

27 mm

CMOS

1.2 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

NO

YES

e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.