352 Digital Signal Processors (DSPs) 26

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6203BZNZ173	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V			22	32	1.7,3.3	GRID ARRAY	BGA352,26X26,40	1.43 V					BOTTOM	2.8 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz			MULTIPLE	27 mm		CMOS		1.5 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C80GGP50	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.465 V	8		32	32	3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA352,26X26,50	3.135 V	85 Cel	4	0 Cel		BOTTOM	1.7 mm	25600	35 mm		YES	64	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	35 mm	1	CMOS	2300 mA	3.3 V	0	0	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	NO	YES
SMJ320MCM41DHFHM40	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	FLAT	352	GQFF	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		38535Q/M;38534H;883B	32	32	5	FLATPACK, GUARD RING	TPAK352,3.0SQ	4.75 V	125 Cel		-55 Cel		QUAD	3.34 mm	131072	48 mm		YES	32	40 MHz	NOT SPECIFIED	NOT SPECIFIED	SINGLE	48 mm		CMOS	600 mA	5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-CQFP-F352		Not Qualified	NO	NO
TMS320C6701GJC150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,50	1.71 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	149.25 MHz	20	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6701GJCA120	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,50	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	120.48 MHz	20	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6201GGP167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			22	32	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.71 V					BOTTOM	1.7 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	167 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	35 mm		CMOS		1.8 V			Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C82GGP50	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V			32	32	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,50	3.165 V	85 Cel		0 Cel		BOTTOM	1.7 mm	4096	35 mm		YES	64	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	35 mm		CMOS	2100 mA	3.3 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	NO	YES
TMS320C6201GJC200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4		Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6201GJCA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4		Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6201GJL200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,40	1.71 V	90 Cel		0 Cel	TIN LEAD	BOTTOM	3.8 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm		CMOS		1.8 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6201GJLA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,40	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.8 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm	2	CMOS		1.8 V	4		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6202GJL200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	8		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	3.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm	2	CMOS		1.8 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
TMS320C6202GJL250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V				TIN LEAD	BOTTOM	3.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	20	220	MULTIPLE	27 mm		CMOS		1.8 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6202GJLA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	8		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm	2	CMOS		1.8 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
TMSC6701GJC16719V	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.99 V			22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,50	1.81 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	166.67 MHz	20	220	MULTIPLE	35 mm	2	CMOS		1.9 V	4		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C80GGP60	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V			32			GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		3.135 V	85 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm		35 mm		YES	64	120 MHz	20	220	MULTIPLE	35 mm		CMOS		3.3 V					1.27 mm	FLOATING POINT	S-PBGA-B352	4	Not Qualified	NO	YES	e0
TMS320C6202BZNZ250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,40	1.43 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	30	260	MULTIPLE	27 mm	2	CMOS		1.5 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e1	8
TMS32C6203BZNZA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V			22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,40	1.43 V	105 Cel		-40 Cel		BOTTOM	2.8 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS		1.5 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202GJLA233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	8		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	233 MHz	20	220	MULTIPLE	27 mm	2	CMOS		1.8 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
TMS320C6203BGNZ300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,40	1.43 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm	524288	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2	CMOS		1.5 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
TMS320C6202BGNZ250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V			22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,40	1.43 V				TIN LEAD	BOTTOM	2.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	20	220	MULTIPLE	27 mm		CMOS		1.5 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS32C6202BGNZA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,40	1.43 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	2.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	20	220	MULTIPLE	27 mm	2	CMOS		1.5 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
TMS32C6203BGNZA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,50	1.43 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm	524288	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2	CMOS		1.5 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
SM320C6201GJCA20EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	32		22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.5 mm	65536	35 mm		YES	32	50 MHz	NOT SPECIFIED	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4		Digital Signal Processors	FLASH	1.27 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
SM320C6701GJCA12EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			22	32	1.8,3.3	GRID ARRAY	BGA352,26X26,50	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	167 MHz	20	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6202BZNZ300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22	32	1.5,3.3	GRID ARRAY	BGA352,26X26,40	1.43 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	30	260	MULTIPLE	27 mm	2	CMOS		1.5 V	4		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e1	8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.