361 Digital Signal Processors (DSPs) 109

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
XOMAPL138ZWT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	24	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V				BOTTOM	1.4 mm	16 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	16 mm		CMOS	1.2 V		Other Microprocessor ICs	.8 mm	FLOATING POINT	S-PBGA-B361		Not Qualified	YES	NO
TMS320C6748EZCED4E	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	14		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	13 mm	1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE	YES	16	30 MHz	30	260	MULTIPLE	13 mm		CMOS	1 V			.65 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
SM320C6748EGWTS3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	23		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel	-55 Cel	TIN LEAD	BOTTOM	1.4 mm	16 mm	IT ALSO OPERATES AT 1.1V, 1.2V AND 1.3V NOMINAL SUPLY	YES	16	30 MHz	20	220	SINGLE	16 mm	8	CMOS	1 V	80		.8 mm	FLOATING POINT	S-PBGA-B361	3		YES	NO	e0
TNETV2665FIBZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIBZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIBZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIBZWTA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIDZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIDZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIDZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665VIDZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665VIDZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665VIDZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V	13		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm		CMOS	1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.