FBGA Digital Signal Processors (DSPs) 278

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6414TBZLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320C6414TBZLZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320C6414TBZLZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320C6414TBZLZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320C6415TBGLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0	8
TMS320C6415TBGLZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0	8
TMS320C6415TBZLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320C6415TBZLZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320C6415TBZLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320C6416TBGLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0	8
TMS320C6416TBZLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
SM320VC5510AZPHA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	205	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	16	22	16	1.6,3.3	GRID ARRAY, FINE PITCH	BGA205,17X17,20	1.55 V	85 Cel	7	-40 Cel	TIN SILVER COPPER	BOTTOM		163840			YES	32		30	260	SINGLE		2	CMOS	1.6 V	6	Digital Signal Processors	MROM	.5 mm	FIXED POINT	S-PBGA-B205	3	Not Qualified		YES	NO	e1	16
ADSP-BF534BBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF534BBCZ-5B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	500 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF536BBCZ-3B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	300 MHz		260	MULTIPLE	17 mm		CMOS	1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF536BBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz		260	MULTIPLE	17 mm		CMOS	1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
TMS320DM640AZDKA4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.14 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	30	260	MULTIPLE	23 mm	3	CMOS	1.2 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320TCI100BCLZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320TCI100BCLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320TCI100BCLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320TCI100BGLZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	90 Cel		0 Cel		BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	20	220	MULTIPLE	23 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO
TMS320TCI100BZLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320TCI100BZLZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		23	32	1.1,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320TCI100BZLZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
SM32C6414EGLZ50AEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.31 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	33 MHz	20	220	MULTIPLE	23 mm		CMOS	1.25 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0
SM32C6415EGLZ50AEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel	4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	33 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3	CMOS	1.25 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e0
TMS320C6202BZNY250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	22	32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32	1.43 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	2.35 mm	131072	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	30	260	MULTIPLE	18 mm	2	CMOS	1.5 V	4	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B384	4	Not Qualified		YES	NO	e1	8
TMS320C6416TBZLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS320C6454BCTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V		32			GRID ARRAY, FINE PITCH		1.2125 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm		24 mm		YES	32	50 MHz	30	245	MULTIPLE	24 mm		CMOS	1.25 V				.8 mm	FIXED POINT	S-PBGA-B697	4			YES	NO	e1
TMS320C6474FCUN2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14			GRID ARRAY, FINE PITCH			85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		23 mm	0.9-1.2V CORE NOMINAL VALUE AVAILABLE	YES	32		30	245	MULTIPLE	23 mm	12	CMOS		64		MROM	.8 mm	FIXED POINT	S-PBGA-B561	4			YES	NO	e1	8
TMS320C6474FCUN8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14			GRID ARRAY, FINE PITCH			85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		23 mm	0.9-1.2V CORE NOMINAL VALUE AVAILABLE	YES	32		30	245	MULTIPLE	23 mm	12	CMOS		64		MROM	.8 mm	FIXED POINT	S-PBGA-B561	4			YES	NO	e1	8
TMS320C6474FCUNA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14			GRID ARRAY, FINE PITCH			95 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		23 mm	0.9-1.2V CORE NOMINAL VALUE AVAILABLE	YES	32		30	245	MULTIPLE	23 mm	12	CMOS		64		MROM	.8 mm	FIXED POINT	S-PBGA-B561	4			YES	NO	e1	8
TMS320C6474FCUNA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14			GRID ARRAY, FINE PITCH			100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		23 mm	0.9-1.2V CORE NOMINAL VALUE AVAILABLE	YES	32		30	245	MULTIPLE	23 mm	12	CMOS		64		MROM	.8 mm	FIXED POINT	S-PBGA-B561	4			YES	NO	e1	8
TMS320C6652CZH6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES			16			GRID ARRAY, FINE PITCH			85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.99 mm		21 mm		YES	32		30	245	MULTIPLE	21 mm		CMOS					.8 mm	FLOATING POINT	S-PBGA-B625	3			YES	NO	e1
TMS320C6652CZHA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES			16			GRID ARRAY, FINE PITCH			100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.99 mm		21 mm		YES	32		30	245	MULTIPLE	21 mm		CMOS					.8 mm	FLOATING POINT	S-PBGA-B625	3			YES	NO	e1
TMS320C6654CZH7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES			16			GRID ARRAY, FINE PITCH			85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.99 mm		21 mm		YES	32		30	245	MULTIPLE	21 mm		CMOS					.8 mm	FLOATING POINT	S-PBGA-B625	3			YES	NO	e1
TMS320C6654CZHA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES			16			GRID ARRAY, FINE PITCH			100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.99 mm		21 mm		YES	32		30	245	MULTIPLE	21 mm		CMOS					.8 mm	FLOATING POINT	S-PBGA-B625	3			YES	NO	e1
R3920-CFAB-E1B	Onsemi	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	25	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES						GRID ARRAY, FINE PITCH	LGA25,3X8,27	.77 V	40 Cel		0 Cel		BOTTOM	1.83 mm		3.18 mm				4.218 MHz		240		5.59 mm		CMOS	1.25 V				.686 mm	FIXED POINT	R-PBGA-B25	4

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.