HLFQFP Digital Signal Processors (DSPs) 76

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

ADSP-21563BSWZ8

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

120

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

16

32

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP120,.63SQ,16

.95 V

110 Cel

0 Cel

DUAL

1.6 mm

163840

14 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

14 mm

6

CMOS

1 V

FLASH

.4 mm

FLOATING POINT

S-PQFP-G120

YES

YES

ADSP-21563KSWZ8

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

GULL WING

120

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

AEC-Q100

16

32

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP120,.63SQ,16

.95 V

125 Cel

-40 Cel

DUAL

1.6 mm

163840

14 mm

YES

16

30

260

MULTIPLE

14 mm

6

CMOS

1 V

FLASH

.4 mm

FLOATING POINT

S-PQFP-G120

3

YES

YES

ADSP-21565BSWZ10

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

GULL WING

120

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

AEC-Q100

16

32

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP120,.63SQ,16

.95 V

125 Cel

-40 Cel

DUAL

1.6 mm

163840

14 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

14 mm

6

CMOS

1 V

FLASH

.4 mm

FLOATING POINT

S-PQFP-G120

YES

YES

ADSP-21565BSWZ8

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

GULL WING

120

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

AEC-Q100

16

32

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP120,.63SQ,16

.95 V

125 Cel

-40 Cel

DUAL

1.6 mm

163840

14 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

14 mm

6

CMOS

1 V

FLASH

.4 mm

FLOATING POINT

S-PQFP-G120

YES

YES

ADSP-21565KSWZ10

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

GULL WING

120

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

AEC-Q100

16

32

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP120,.63SQ,16

.95 V

125 Cel

-40 Cel

DUAL

1.6 mm

163840

14 mm

YES

16

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

14 mm

6

CMOS

1 V

FLASH

.4 mm

FLOATING POINT

S-PQFP-G120

YES

YES

ADSP-21565KSWZ8

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

GULL WING

120

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

16

32

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP120,.63SQ,16

.95 V

110 Cel

0 Cel

DUAL

1.6 mm

163840

14 mm

YES

16

30

260

MULTIPLE

14 mm

6

CMOS

1 V

FLASH

.4 mm

FLOATING POINT

S-PQFP-G120

3

YES

YES

ADSP-21571BSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

YES

YES

ADSP-21571BSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-21571CSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

105 Cel

-40 Cel

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

YES

YES

ADSP-21571CSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

100 Cel

-40 Cel

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

YES

YES

ADSP-21571KSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

70 Cel

0 Cel

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

YES

YES

ADSP-21571KSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570BSWZ-42

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570BSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570CSWZ-42

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570CSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570KSWZ-42

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570KSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571BSWZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571BSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571BSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571CSWZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571CSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571CSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

100 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571KSWZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571KSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571KSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

AD21477WYSWZ1A02

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

HQFP100,.63SQ,20

1.14 V

105 Cel

-40 Cel

QUAD

1.6 mm

2097152

14 mm

YES

16

16.67 MHz

MULTIPLE

14 mm

1

CMOS

1.2 V

65

1

.5 mm

FLOATING POINT

S-PQFP-G100

YES

YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.