LFBGA Digital Signal Processors (DSPs) 509

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-BF705BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF705KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF707BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.045 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	0	200 MHz	30	260	MULTIPLE	12 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF707BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
ADSP-BF707KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3	YES	YES	e1
SM320F28335GHHAEP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.995 V	16		20	32	1.9,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA179,14X14,32	1.805 V	125 Cel	C28X	8	-55 Cel	TIN LEAD	BOTTOM	1.4 mm	34816	12 mm		YES	32	150 MHz	20	235	MULTIPLE	12 mm	3	69632	CMOS	315 mA	1.9 V	6	YES	5	Digital Signal Processors	FLASH		.8 mm	FLOATING POINT	S-PBGA-B179	1	YES	NO	e0	16
TMS320F2806ZGMSR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V			0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.71 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		10 mm	ALSO REQUIRES 3.3V SUPPLY	YES	0	100 MHz	30	260	MULTIPLE	10 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B100	3	YES	NO	e1
SM320C6748EGWTS3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			23			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel			-55 Cel	TIN LEAD	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES AT 1.1V, 1.2V AND 1.3V NOMINAL SUPLY	YES	16	30 MHz	20	220	SINGLE	16 mm	8		CMOS		1 V	80						.8 mm	FLOATING POINT	S-PBGA-B361	3	YES	NO	e0
ADSP-21587BBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel			-40 Cel		BOTTOM	1.5 mm	917504	19 mm		YES	16	450 MHz	30	260	MULTIPLE	19 mm	8		CMOS		1.1 V	1					SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3	YES	NO		8
ADSP-21587KBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel			0 Cel		BOTTOM	1.5 mm	917504	19 mm		YES	16	450 MHz	30	260	MULTIPLE	19 mm	8		CMOS		1.1 V	1					SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3	YES	NO		8
DFDF2812ZHHAR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	2 V	16		19	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.81 V	85 Cel	C28X	3	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	18432	12 mm	1.8V NOMINAL AVAILBALE @135MHZ	YES	16	35 MHz	30	260	MULTIPLE	12 mm	8	36864	CMOS	230 mA	1.9 V		YES			OTPROM		.8 mm	FIXED POINT	S-PBGA-B179	3	YES	NO	e1	16
TNETV2665FIBZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665FIBZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665FIBZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665FIBZWTA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665FIDZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665FIDZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665FIDZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665VIDZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665VIDZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
TNETV2665VIDZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	32	30 MHz	30	260	MULTIPLE	16 mm			CMOS		1.2 V							.8 mm	FIXED POINT	S-PBGA-B361	3	YES	NO	e1
ADSP-21573BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400		YES	YES
ADSP-21573BBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	85 Cel			-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.15 V							.8 mm	FIXED POINT	S-PBGA-B400		YES	YES
ADSP-21573CBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-21573CBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	95 Cel			-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.15 V							.8 mm	FIXED POINT	S-PBGA-B400		YES	YES
ADSP-21573KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-21573KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	70 Cel			0 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.15 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES
ADSP-SC572BBCZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC572BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC572CBCZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC572CBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC572KBCZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC572KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC573BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES				16			GRID ARRAY, LOW PROFILE, FINE PITCH			85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS									.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC573BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC573BBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	85 Cel			-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.15 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES
ADSP-SC573CBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES				16			GRID ARRAY, LOW PROFILE, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS									.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC573CBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC573CBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	95 Cel			-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.15 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES
ADSP-SC573KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES				16			GRID ARRAY, LOW PROFILE, FINE PITCH			70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS									.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC573KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.1 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES	e1
ADSP-SC573KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	70 Cel			0 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm			CMOS		1.15 V							.8 mm	FIXED POINT	S-PBGA-B400	3	YES	YES
ADBF707WCBCZ411	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		AEC-Q100	14			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	105 Cel			-40 Cel		BOTTOM	1.7 mm		12 mm	3.3V NOMINAL ALSO AVAILABLE @60MHZ FREQUENCY	YES	16	60 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm			CMOS		1.8 V							.8 mm	FIXED POINT	S-PBGA-B184		YES	YES
ADSP-21587KBCZ-5B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.1 V	70 Cel			0 Cel		BOTTOM	1.5 mm	917504	19 mm		YES	16	500 MHz		260	MULTIPLE	19 mm	8		CMOS		1.15 V	1					SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3	YES	NO		8
ADSP-21587BBCZ-5B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.1 V	85 Cel			-40 Cel		BOTTOM	1.5 mm	917504	19 mm		YES	16	500 MHz		260	MULTIPLE	19 mm	8		CMOS		1.15 V	1					SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3	YES	NO		8
TMS320C6204GWTA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA288,19X19,32	1.43 V	105 Cel		4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	65536	16 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	16 mm	2		CMOS	290 mA	1.5 V	4				MROM		.8 mm	FIXED POINT	S-PBGA-B288	3	YES	NO	e0	8
TMS320C6204ZWTA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA288,19X19,32	1.43 V	105 Cel		4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	65536	16 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	30	260	MULTIPLE	16 mm	2		CMOS	290 mA	1.5 V	4				MROM		.8 mm	FIXED POINT	S-PBGA-B288	3	YES	NO	e1	8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.