SQUARE Digital Signal Processors (DSPs) 2,107

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
DMF2802PZA-60	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			0	32	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	3072	14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	0	100 MHz	30	260	MULTIPLE	14 mm			CMOS		1.8 V				Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	2	Not Qualified		YES	NO	e4
TMS320C5421GGUA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V			19			GRID ARRAY, LOW PROFILE, FINE PITCH		4.75 V	85 Cel			0 Cel		BOTTOM	1.4 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	12 mm			CMOS		5 V						.8 mm	FIXED POINT	S-PBGA-B144		Not Qualified		YES	YES
TMS320C6418GTSA500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V			23	32	1.2,3.3	GRID ARRAY	BGA288,22X22,40	1.36 V	105 Cel		4	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	30 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3		CMOS		1.4 V	64			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B288	4	Not Qualified		YES	NO	e0
TMS320DM640AZNZA4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			23	32	1.2,3.3	GRID ARRAY	BGA548,26X26,40	1.14 V					TIN SILVER COPPER	BOTTOM	2.8 mm	4096	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	30	260	MULTIPLE	27 mm			CMOS		1.2 V				Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320DM643AZDK5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			20	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.14 V	90 Cel		4	0 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz	30	260	MULTIPLE	23 mm	3		CMOS		1.2 V	64			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320DM647ZUT9	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		32	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	32	900 MHz	30	245	MULTIPLE	19 mm	8		CMOS		1.2 V	64			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		YES	NO	e1	8
TMS320F28015ZGMA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.89 V	16	AEC-Q100	0	32	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	1.71 V	85 Cel	C28X	3	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	3072	10 mm	ALSO REQUIRES 3.3V SUPPLY	YES	0	100 MHz	30	260	MULTIPLE	10 mm	10	12288	CMOS	230 mA	1.8 V		YES		Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PBGA-B100	3	Not Qualified		YES	NO	e1	16
TMS32C6205DZHKA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		32	32	1.5,3.3,5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA288,19X19,32	1.43 V	105 Cel		4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	30	260	MULTIPLE	16 mm	2		CMOS		1.5 V	4			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B288	3	Not Qualified		YES	NO	e1	8
TMS32C6414EZLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V			32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel		4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.25 V	64			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6415EZLZA5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V			32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.19 V	105 Cel		4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.25 V	64			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6416EZLZA6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V			32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	105 Cel		4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.4 V	64			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
DSPIC33FJ128MC202-I/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0	16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel		3	-40 Cel	MATTE TIN	QUAD	1 mm		6 mm		YES	0		40	260		6 mm	5		CMOS	76 mA	3.3 V	8		2	Digital Signal Processors	FLASH	.65 mm	FLOATING POINT	S-PQCC-N28	1	Not Qualified		YES		e3	24
DSPIC33FJ128MC204-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0	16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel		3	-40 Cel	MATTE TIN	QUAD	1 mm		8 mm		YES	0		40	260		8 mm	5		CMOS	76 mA	3.3 V	8		2	Digital Signal Processors	FLASH	.65 mm	FLOATING POINT	S-PQCC-N44	1	Not Qualified		YES		e3	24
DSPIC33FJ128MC802-E/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0	16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	125 Cel		3	-40 Cel	MATTE TIN	QUAD	1 mm		6 mm		YES	0		40	260		6 mm	5		CMOS	76 mA	3.3 V	8		2	Digital Signal Processors	FLASH	.65 mm	FLOATING POINT	S-PQCC-N28	1	Not Qualified		YES		e3	24
DSPIC33FJ128MC804T-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	28	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0	16	3.3	FLATPACK, THIN PROFILE	TQFP44,.47SQ,32	3 V	85 Cel		3	-40 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	0		40	260		10 mm	5		CMOS	76 mA	3.3 V	8		2	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PQFP-G44	3	Not Qualified		YES		e3	24
DSPIC33FJ32MC304T-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V			0	16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel			-40 Cel	MATTE TIN	QUAD	1 mm		8 mm			0	40 MHz	40	260		8 mm			CMOS	75 mA	3.3 V				Digital Signal Processors	FLASH	.65 mm	FLOATING POINT	S-PQCC-N44	1	Not Qualified				e3
DSPIC33FJ32MC304T-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			0	16	3.3	FLATPACK, THIN PROFILE	TQFP44,.39SQ,31	3 V	85 Cel			-40 Cel	MATTE TIN	QUAD	1.2 mm		10 mm			0	40 MHz	40	260		10 mm			CMOS	75 mA	3.3 V				Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PQFP-G44	3	Not Qualified				e3
DSPIC33FJ64MC202-I/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0	16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel		3	-40 Cel	MATTE TIN	QUAD	1 mm		6 mm		YES	0		40	260		6 mm	5		CMOS	76 mA	3.3 V	8		2	Digital Signal Processors	FLASH	.65 mm	FLOATING POINT	S-PQCC-N28	1	Not Qualified		YES		e3	24
DSPIC33FJ64MC204-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0	16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel		3	-40 Cel	MATTE TIN	QUAD	1 mm		8 mm		YES	0		40	260		8 mm	5		CMOS	76 mA	3.3 V	8		2	Digital Signal Processors	FLASH	.65 mm	FLOATING POINT	S-PQCC-N44	1	Not Qualified		YES		e3	24
DSPIC33FJ64MC804-E/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0	16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	125 Cel		3	-40 Cel	MATTE TIN	QUAD	1 mm		8 mm		YES	0		40	260		8 mm	5		CMOS	76 mA	3.3 V	8		2	Digital Signal Processors	FLASH	.65 mm	FLOATING POINT	S-PQCC-N44	1	Not Qualified		YES		e3	24
DSPIC33FJ64MC804-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0	16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel		3	-40 Cel	MATTE TIN	QUAD	1 mm		8 mm		YES	0		40	260		8 mm	5		CMOS	76 mA	3.3 V	8		2	Digital Signal Processors	FLASH	.65 mm	FLOATING POINT	S-PQCC-N44	1	Not Qualified		YES		e3	24
TMS320DM6435ZDU6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		NO	NO	e1	8
TMS320DM6435ZDU7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		NO	NO	e1	8
TMS320DM6435ZDUQ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		NO	NO	e1	8
TMS320DM6435ZWT5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM		81920			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		NO	NO	e1	8
TMS320DM6435ZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM		81920			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		NO	NO	e1	8
TMS320DM6435ZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		NO	NO	e1	8
TMS320DM6435ZWTL	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel			0 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		YES	NO	e1	8
TMS320DM6435ZWTQ5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		81920			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		NO	NO	e1	8
TMS320DM6435ZWTQ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		13	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5		CMOS		1.2 V	72			Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		NO	NO	e1	8
ADSP-BF522BBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF522BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF522KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF522KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF523KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF523KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF523KBCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel		BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	YES	YES
ADSP-BF524BBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF524BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF524KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF524KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF525BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz		260	MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF525KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz			MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF525KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF525KBCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz			MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF526BBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF526BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm			CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF526KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz			MULTIPLE	12 mm			CMOS		1.8 V				Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	YES	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.