SQUARE Digital Signal Processors (DSPs) 2,107

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-TS201SABP-060	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.2,1.6,2.5	GRID ARRAY	BGA576,24X24,40	1.14 V	85 Cel			-40 Cel	TIN LEAD SILVER		BOTTOM	3.1 mm	786432	25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz		225	MULTIPLE	25 mm			CMOS		1.2 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e0
ADSP-TS203SABP-050	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	1 V	85 Cel			-40 Cel	TIN LEAD SILVER		BOTTOM	3.1 mm	131072	25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	32	125 MHz		225	MULTIPLE	25 mm			CMOS		1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576	3	Not Qualified		NO	YES	e0
TMS320C6416TGLZA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel			-40 Cel			BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm			CMOS		1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified		YES	NO
ADSP-2185NBSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel			-40 Cel	MATTE TIN		QUAD	1.6 mm	16384	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm			CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
TMS320C6413GTSA500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA288,22X22,40	1.14 V	105 Cel		4	-40 Cel	TIN LEAD		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	30 MHz	20	220	MULTIPLE	23 mm	3		CMOS		1.2 V	64		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B288	4	Not Qualified		YES	NO	e0
TMS320C6414TZLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel			0 Cel			BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm			CMOS		1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified		YES	NO
TMS320C6416TZLZ1	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	105 Cel			-40 Cel			BOTTOM	3.25 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	23 mm			CMOS		1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532		Not Qualified		YES	NO
ADSP-2191MKSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22	16	2.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.37 V	70 Cel			0 Cel	MATTE TIN		QUAD	1.6 mm	32768	20 mm		YES	16	100 MHz		260	MULTIPLE	20 mm			CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified		YES	YES	e3
TMS320C6205ZHK200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	288	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	32	32	1.5,3.3,5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA288,19X19,32	1.43 V	90 Cel		4	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	16 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	30	260	MULTIPLE	16 mm	2		CMOS		1.5 V	4		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B288	3	Not Qualified		YES	NO	e1	8
OMAP5910JZZG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.675 V		25	16	1.6,1.8/2.75/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,21X21,20	1.525 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.2 mm	163840	12 mm	ALSO REQUIRES 2.75V OR 3.3V SUPPLY	YES	16	13 MHz	30	260	MULTIPLE	12 mm	8		CMOS		1.6 V	6		Digital Signal Processors	MROM	.5 mm	FIXED POINT	S-PBGA-B289	4	Not Qualified		YES	NO	e1	16
TMS320VC5510AZGWA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	240	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	16	22	16	1.6,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,17X17,32	1.55 V	85 Cel		6	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	163840	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	30	260	MULTIPLE	15 mm	2		CMOS		1.6 V	6		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B240	3	Not Qualified		YES	NO	e1	16
TMS320C6204ZHKA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	22	32	1.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA288,19X19,32	1.43 V	105 Cel		4	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	65536	16 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	30	260	MULTIPLE	16 mm	2		CMOS	290 mA	1.5 V	4		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B288	3	Not Qualified		YES	NO	e1	8
TMS320C6204ZHK200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	288	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	22	32	1.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA288,19X19,32	1.43 V	90 Cel		4	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	65536	16 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	30	260	MULTIPLE	16 mm	2		CMOS	290 mA	1.5 V	4		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B288	3	Not Qualified		YES	NO	e1	8
ADSP-21065LKSZ-264	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		24	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3.13 V	85 Cel			0 Cel	MATTE TIN		QUAD	4.1 mm	17408	28 mm		YES	32	33.33 MHz		260	MULTIPLE	28 mm			CMOS		3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
TMS320C6418ZTSA500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA288,22X22,40	1.14 V	105 Cel		4	-40 Cel	TIN SILVER COPPER		BOTTOM	2.8 mm	16384	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	30 MHz	30	260	MULTIPLE	23 mm	3		CMOS		1.2 V	64		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B288	4	Not Qualified		YES	NO	e1
TMS320C6413ZTS500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA288,22X22,40	1.14 V	90 Cel		4	0 Cel	TIN SILVER COPPER		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	30 MHz	30	260	MULTIPLE	23 mm	3		CMOS		1.2 V	64		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B288	4	Not Qualified		YES	NO	e1
TMS320C6413ZTSA500	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA288,22X22,40	1.14 V	105 Cel		4	-40 Cel	TIN SILVER COPPER		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	30 MHz	30	260	MULTIPLE	23 mm	3		CMOS		1.2 V	64		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B288	4	Not Qualified		YES	NO	e1
TMS32C6414EZLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.2 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6414EZLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6414EZLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6415EZLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.2 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6415EZLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6415EZLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6416EZLZ5E0	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.14 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.2 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6416EZLZ6E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS	125 mA	1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
TMS32C6416EZLZ7E3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	532	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.44 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA532,26X26,32	1.36 V					TIN SILVER COPPER		BOTTOM	3.3 mm	16384	23 mm	ALSO REQUIRES 3.3VI/O SUPPLY	YES	64	75.18 MHz	30	260	MULTIPLE	23 mm			CMOS	125 mA	1.4 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
OMAP5912ZDY	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		26	16	1.6,1.8/2.75/3.3	GRID ARRAY	BGA289,17X17,40	1.525 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	2.32 mm	163840	19 mm	ALSO REQUIRES 2.75V OR 3.3V SUPPLY	YES	16	19.2 MHz	30	260	MULTIPLE	19 mm	8		CMOS		1.6 V	6		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	192 rpm	YES	NO	e1
OMAP5912ZZG	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		26	16	1.6,1.8/2.75/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,21X21,20	1.525 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.2 mm	163840	12 mm	ALSO REQUIRES 2.75V OR 3.3V SUPPLY	YES	16	19.2 MHz	30	260	MULTIPLE	12 mm	8		CMOS		1.6 V	6		Digital Signal Processors		.5 mm	FIXED POINT	S-PBGA-B289	4	Not Qualified		YES	NO	e1
POMAP5912ZDY	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY		YES	1.65 V		26	16	1.6,1.8/2.75/3.3	GRID ARRAY	BGA289,17X17,40	1.525 V	85 Cel			-40 Cel			BOTTOM	2.32 mm	163840	19 mm		YES	16	19.2 MHz			MULTIPLE	19 mm			CMOS		1.6 V			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B289		Not Qualified		YES	NO
ADSP-2188NKSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel			0 Cel	MATTE TIN		QUAD	1.6 mm	57344	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm			CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-21266SKBCZ-2D	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm	65536	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	66.67 MHz		260	MULTIPLE	12 mm			CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-21266SKSTZ-2D	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel			0 Cel	MATTE TIN		QUAD	1.6 mm	65536	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	66.67 MHz		260	MULTIPLE	20 mm			CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
SM320F2812PGFMEPG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	2 V	16	19	32	1.9,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.81 V	125 Cel	C28X	3	-55 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	18432	24 mm	ALSO OPERATES AT 1.8V SUPPLY AT 135MHZ	YES	16	150 MHz	30	260	MULTIPLE	24 mm	8	36864	CMOS	230 mA	1.9 V		YES	Digital Signal Processors	FLASH	.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified		YES	NO	e4	16
SM320C6424GDUQ6EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	376	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,1.8,3.3	GRID ARRAY	BGA376,22X22,40	1.14 V	125 Cel			-40 Cel	TIN LEAD		BOTTOM	2.48 mm	20480	23 mm		YES	32	30 MHz	20	220	MULTIPLE	23 mm	5		CMOS		1.2 V	72		Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		YES	NO	e0
ADSP-BF531SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz		260	MULTIPLE	12 mm			CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF532SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz		260	MULTIPLE	12 mm			CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF533SBBCZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm			CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	500 rpm	YES	YES	e1
TMS320DM648ZUTA8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel			-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.3 mm	8192	19 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	32	800 MHz	30	245	MULTIPLE	19 mm	8		CMOS		1.2 V	64		Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		YES	NO	e0	8
TMS320C6412AGDK5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.14 V	90 Cel		4	0 Cel	Tin/Lead (Sn/Pb)		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3		CMOS		1.2 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e0
TMS320C6412AGDK7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.36 V	90 Cel		4	0 Cel	Tin/Lead (Sn/Pb)		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3		CMOS		1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e0
TMS320C6412AGDKA5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.36 V	105 Cel		4	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	220	MULTIPLE	23 mm	3		CMOS		1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e0
TMS320C6412AGNZ5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA548,26X26,40	1.14 V	90 Cel		4	0 Cel	Tin/Lead (Sn/Pb)		BOTTOM	2.8 mm	262144	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	3		CMOS		1.2 V	64		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e0
TMS320C6412AGNZA5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	548	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		23	32	1.4,3.3	GRID ARRAY	BGA548,26X26,40	1.36 V	105 Cel		4	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	2.8 mm	262144	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	3		CMOS		1.4 V	64		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e0
TMS320C6412AZDK5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	548	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		23	32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.14 V					TIN SILVER COPPER		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	30	260	MULTIPLE	23 mm			CMOS		1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320C6412AZDK6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.36 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS		1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320C6412AZDK7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.36 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS		1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320C6412AZDKA5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	548	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.44 V		23	32	1.4,3.3	GRID ARRAY, FINE PITCH	BGA548,26X26,32	1.36 V	105 Cel		4	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.8 mm	262144	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	260	MULTIPLE	23 mm	3		CMOS		1.4 V	64		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1
TMS320C6412AZNZ5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	548	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		23	32	1.2,3.3	GRID ARRAY	BGA548,26X26,40	1.14 V	90 Cel		4	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.8 mm	262144	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75.19 MHz	NOT SPECIFIED	260	MULTIPLE	27 mm	3		CMOS		1.2 V	64		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B548	4	Not Qualified		YES	NO	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.