DIGITAL SIGNAL PROCESSOR, MIXED Digital Signal Processors (DSPs) 85

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

ADSP-21478BSWZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.14 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

1.6 mm

3145728

14 mm

YES

16

16.67 MHz

30

260

MULTIPLE

14 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.5 mm

FLOATING POINT

S-PQFP-G100

3

Not Qualified

YES

YES

e3

8

ADSP-21478KSWZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.14 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

1.6 mm

3145728

14 mm

YES

16

16.67 MHz

30

260

MULTIPLE

14 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.5 mm

FLOATING POINT

S-PQFP-G100

3

Not Qualified

YES

YES

e3

8

ADSP-21478KSWZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.14 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

1.6 mm

3145728

14 mm

YES

16

16.67 MHz

30

260

MULTIPLE

14 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.5 mm

FLOATING POINT

S-PQFP-G100

3

Not Qualified

YES

YES

e3

8

ADSP-21479BSWZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.14 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

1.6 mm

5242880

14 mm

YES

16

16.67 MHz

30

260

MULTIPLE

14 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.5 mm

FLOATING POINT

S-PQFP-G100

3

Not Qualified

YES

YES

e3

8

ADSP-21479KSWZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.14 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

1.6 mm

5242880

14 mm

YES

16

16.67 MHz

30

260

MULTIPLE

14 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.5 mm

FLOATING POINT

S-PQFP-G100

3

Not Qualified

YES

YES

e3

8

TMS320C6670CYPA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

.95 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

32768

24 mm

YES

64

312.5 MHz

30

245

MULTIPLE

24 mm

16

CMOS

1 V

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

YES

e1

TMS320DM8165BCYG0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167BCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168BCYG0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168BCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168BCYGA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320C6670ACYP2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

32768

24 mm

YES

30

245

SINGLE

24 mm

16

CMOS

1 V

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

TMS320C6670ACYPA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

.95 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

32768

24 mm

YES

30

245

SINGLE

24 mm

16

CMOS

1 V

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

TMS320C6670ACYPA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

.95 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

32768

24 mm

YES

30

245

SINGLE

24 mm

16

CMOS

1 V

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

TMS320C6670AXCYP2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

32768

24 mm

YES

30

245

SINGLE

24 mm

16

CMOS

1 V

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

TMS320C6670AXCYPA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

.95 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

32768

24 mm

YES

30

245

SINGLE

24 mm

16

CMOS

1 V

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

TMS320C6670AXCYPA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

.95 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

32768

24 mm

YES

30

245

SINGLE

24 mm

16

CMOS

1 V

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

TMS320C6670AXCYP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

841

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

1,1.5,1.8

GRID ARRAY, FINE PITCH

BGA841,29X29,32

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.39 mm

32768

24 mm

YES

30

245

SINGLE

24 mm

16

CMOS

1 V

80

Digital Signal Processors

.8 mm

FLOATING POINT

S-PBGA-B841

4

Not Qualified

YES

NO

e1

TMS320DM8165SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8165SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8165SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYGA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

27 MHz

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYGH

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYGA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320TCI6608ACYPA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

TIN SILVER COPPER

30

245

CMOS

4

e1

TMS320TCI6608ACYP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

TIN SILVER COPPER

30

245

CMOS

4

e1

ADSP-21469BBC-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

24

32

1.05,1.8,3.3

GRID ARRAY

BGA324,18X18,40

1 V

85 Cel

-40 Cel

BOTTOM

1.8 mm

163840

19 mm

YES

8

25 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

19 mm

CMOS

10 mA

1.05 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

NO

YES

ADSP-21477BCPZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

YES

1.26 V

8

24

40

1.2,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.47SQ,20

1.14 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.9 mm

2097152

12 mm

YES

16

16.67 MHz

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

.5 mm

FLOATING POINT

S-XQCC-N88

3

Not Qualified

YES

YES

e3

ADSP-21477KCPZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

YES

1.26 V

8

24

40

1.2,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.47SQ,20

1.14 V

70 Cel

0 Cel

MATTE TIN

QUAD

.9 mm

2097152

12 mm

YES

16

16.67 MHz

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

.5 mm

FLOATING POINT

S-XQCC-N88

3

Not Qualified

YES

YES

e3

ADSP-21477KSWZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.14 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

2097152

14 mm

YES

16

16.67 MHz

MULTIPLE

14 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G100

3

Not Qualified

YES

YES

e3

ADSP-21478BCPZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

YES

1.26 V

8

24

40

1.2,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.47SQ,20

1.14 V

85 Cel

-40 Cel

QUAD

.9 mm

3145728

12 mm

YES

16

16.67 MHz

30

260

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.5 mm

FLOATING POINT

S-XQCC-N88

3

Not Qualified

YES

YES

8

ADSP-21478KCPZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

YES

1.26 V

8

24

40

1.2,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.47SQ,20

1.14 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

.9 mm

3145728

12 mm

YES

16

16.67 MHz

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.5 mm

FLOATING POINT

S-XQCC-N88

3

Not Qualified

YES

YES

e3

8

ADSP-21479KBCZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.1,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

5242880

12 mm

YES

16

16.67 MHz

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.8 mm

FLOATING POINT

S-PBGA-B196

3

Not Qualified

YES

YES

e1

8

ADSP-21479KBCZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.2,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

5242880

12 mm

YES

16

16.67 MHz

30

260

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.8 mm

FLOATING POINT

S-PBGA-B196

3

Not Qualified

YES

YES

e1

8

ADSP-21479KBCZ-3A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

1.3,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

5242880

12 mm

YES

16

16.67 MHz

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.8 mm

FLOATING POINT

S-PBGA-B196

3

Not Qualified

YES

YES

e1

8

ADSP-21479KCPZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

NO LEAD

88

HVQCCN

SQUARE

UNSPECIFIED

YES

YES

1.26 V

8

24

40

1.2,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC88,.47SQ,20

1.14 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

.9 mm

5242880

12 mm

YES

16

16.67 MHz

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

Digital Signal Processors

FLASH

.5 mm

FLOATING POINT

S-XQCC-N88

3

Not Qualified

YES

YES

e3

8

ADSP-21478BBCZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

3145728

12 mm

YES

16

16.67 MHz

260

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

FLASH

.8 mm

FLOATING POINT

S-PBGA-B196

3

YES

YES

e1

8

ADSP-21478KBCZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

3145728

12 mm

YES

16

16.67 MHz

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

FLASH

.8 mm

FLOATING POINT

S-PBGA-B196

3

YES

YES

e1

8

ADSP-21478KBCZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

24

40

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

3145728

12 mm

YES

16

16.67 MHz

MULTIPLE

12 mm

1

CMOS

1.2 V

65

1

FLASH

.8 mm

FLOATING POINT

S-PBGA-B196

3

YES

YES

e1

8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.