COMMERCIAL Digital Signal Processors (DSPs) 298

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TAS3103ADBT	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES			0			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			70 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		4.4 mm		NO	0	20 MHz	30	260	MULTIPLE	9.7 mm		CMOS		1.8 V				.5 mm	FIXED POINT	R-PDSO-G38	2	Not Qualified		YES	NO	e4
TAS3108DCPRG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V		0			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		4.4 mm		NO	0	20 MHz	30	260	MULTIPLE	9.7 mm		CMOS		3.3 V				.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified		YES	NO	e4
TAS3108DCP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V		0			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	3072	4.4 mm		NO	0	20 MHz	30	260	MULTIPLE	9.7 mm	0	CMOS		3.3 V	0			.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified		YES	NO	e4
ADSP-BF535PKBZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	260	BGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		26			GRID ARRAY		.95 V	70 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm		YES	32	40 MHz			MULTIPLE	19 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B260	3	Not Qualified		YES	YES	e1
ADSP-21469KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm	163840	19 mm		YES	8	66.66 MHz	30	260	MULTIPLE	19 mm		CMOS	10 mA	1.05 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
ADSP-BF516KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	300 MHz	30	260	MULTIPLE	12 mm		CMOS		1.225 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF516KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	30	260	MULTIPLE	12 mm		CMOS		1.4 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF516KSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel		QUAD	1.6 mm		24 mm		YES	16	300 MHz	30	260	MULTIPLE	24 mm		CMOS		1.225 V		Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	300 rpm	YES	YES
ADSP-BF516KSWZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel		QUAD	1.6 mm		24 mm		YES	16	400 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS		1.4 V		Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified	400 rpm	YES	YES
ADSP-BF516KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel		QUAD	1.6 mm		24 mm		YES	16	400 MHz	30	260	MULTIPLE	24 mm		CMOS		1.4 V		Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES
ADSP-21363KSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21364KSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-BF533SKBCZ-6V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm		CMOS		1.3 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF561SKBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm		CMOS		1.25 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-21368KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz	40	260	MULTIPLE	27 mm		CMOS		1.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21369KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz			MULTIPLE	27 mm		CMOS		1.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-BF561SKBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	17 mm		CMOS		1.35 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
TMS320C6421ZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	22	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	49152	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT 350MHZ	YES	8	400 MHz	30	260	MULTIPLE	16 mm	5	CMOS		1.2 V	72	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		NO	NO	e1	8
TMS320C6421ZWT5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	22	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	49152	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT400MHZ	YES	8	500 MHz	30	260	MULTIPLE	16 mm	5	CMOS		1.2 V	72	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		NO	NO	e1	8
TMS320C6421ZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	22	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	49152	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT 450MHZ	YES	8	600 MHz	30	260	MULTIPLE	16 mm	5	CMOS		1.2 V	72	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		NO	NO	e1	8
ADSP-BF537KBCZ-6AV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V		19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	12 mm		CMOS		1.3 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF537KBCZ-6BV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V		19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	17 mm		CMOS		1.3 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-2185NKCAZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14			GRID ARRAY, LOW PROFILE, FINE PITCH		1.71 V	70 Cel		BOTTOM	1.4 mm		10 mm		NO	24	40 MHz		260	MULTIPLE	10 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES
ADSP21262SKBCZ200R	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	12 mm		YES	16	66.67 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-BF561SKBCZ-5V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		23	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	533 MHz		260	MULTIPLE	12 mm		CMOS		1.25 V		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF561SKBCZ-6V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V		23	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		260	MULTIPLE	12 mm		CMOS		1.35 V		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-2104BPZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				16	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	MATTE TIN	QUAD		256							260				CMOS	31 mA	5 V		Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68	5	Not Qualified				e3
ADSP-21266SKSTZ-1D	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel	MATTE TIN	QUAD	1.6 mm	65536	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	50 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21369KSWZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel	MATTE TIN	QUAD	1.6 mm	65536	28 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	44.44 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-21369KSWZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel	MATTE TIN	QUAD	1.6 mm	65536	28 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-21371KSWZ-2B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel	MATTE TIN	QUAD	1.6 mm	32768	28 mm		YES	32	16.67 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-21375KSWZ-2B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel	MATTE TIN	QUAD	1.6 mm	16384	28 mm		YES	32	16.67 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-BF522KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF522KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF523KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF523KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.8 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF523KBCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel		BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	YES	YES
ADSP-BF524KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF524KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF525KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz			MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF525KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.8 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF525KBCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz			MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF526KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz			MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF526KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz			MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF527KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF527KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.8 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF527KBCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF542KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V		22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.3 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	600 rpm	YES	YES	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.