| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
0 |
YES |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.31SQ,25 |
3 V |
85 Cel |
4 |
-40 Cel |
MATTE TIN |
YES |
QUAD |
YES |
1-Ch 12-Bit |
1 mm |
131072 |
8192 |
8 mm |
0 |
YES |
COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT |
0 |
60 MHz |
MULTIPLE |
8 mm |
7 |
8192 |
CMOS |
17-Ch 12-Bit |
75 mA |
3.3 V |
4 |
YES |
4 |
CAN(2), I2C(2), SPI(3), UART(2) |
FLASH |
.65 mm |
FIXED POINT |
S-PQCC-N44 |
YES |
YES |
e3 |
24 |
33 |
||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
0 |
YES |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
3 V |
85 Cel |
4 |
-40 Cel |
MATTE TIN |
YES |
QUAD |
YES |
1-Ch 12-Bit |
1.2 mm |
131072 |
8192 |
7 mm |
0 |
YES |
COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT |
0 |
60 MHz |
MULTIPLE |
7 mm |
7 |
8192 |
CMOS |
17-Ch 12-Bit |
75 mA |
3.3 V |
4 |
YES |
4 |
CAN(2), I2C(2), SPI(3), UART(2) |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G48 |
YES |
YES |
e3 |
24 |
33 |
||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
0 |
YES |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
3 V |
85 Cel |
4 |
-40 Cel |
MATTE TIN |
YES |
QUAD |
YES |
2-Ch 12-Bit |
1.2 mm |
131072 |
8192 |
10 mm |
0 |
YES |
COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT |
0 |
60 MHz |
MULTIPLE |
10 mm |
7 |
8192 |
CMOS |
22-Ch 12-Bit |
75 mA |
3.3 V |
4 |
YES |
4 |
CAN(2), I2C(2), SPI(3), UART(2) |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G64 |
YES |
YES |
e3 |
24 |
51 |
||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
80 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
0 |
YES |
16 |
FLATPACK, THIN PROFILE |
TQFP80,.55SQ |
3 V |
85 Cel |
4 |
-40 Cel |
MATTE TIN |
YES |
QUAD |
YES |
2-Ch 12-Bit |
1.2 mm |
131072 |
8192 |
12 mm |
0 |
YES |
COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT |
0 |
60 MHz |
MULTIPLE |
12 mm |
7 |
8192 |
CMOS |
22-Ch 12-Bit |
75 mA |
3.3 V |
4 |
YES |
4 |
CAN(2), I2C(2), SPI(3), UART(2) |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G80 |
YES |
YES |
e3 |
24 |
67 |
||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
0 |
YES |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
3 V |
85 Cel |
4 |
-40 Cel |
MATTE TIN |
YES |
QUAD |
YES |
2-Ch 12-Bit |
1.2 mm |
65536 |
8192 |
10 mm |
0 |
YES |
COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT |
0 |
60 MHz |
MULTIPLE |
10 mm |
7 |
8192 |
CMOS |
22-Ch 12-Bit |
75 mA |
3.3 V |
4 |
YES |
4 |
CAN(2), I2C(2), SPI(3), UART(2) |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G64 |
70 rpm |
YES |
YES |
e3 |
24 |
51 |
|||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
179 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
2 V |
16 |
19 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.81 V |
85 Cel |
C28X |
3 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
18432 |
12 mm |
1.8V NOMINAL AVAILBALE @135MHZ |
YES |
16 |
35 MHz |
30 |
260 |
MULTIPLE |
12 mm |
8 |
36864 |
CMOS |
230 mA |
1.9 V |
YES |
OTPROM |
.8 mm |
FIXED POINT |
S-PBGA-B179 |
3 |
YES |
NO |
e1 |
16 |
|||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.55 V |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
20 mm |
YES |
16 |
20 MHz |
30 |
260 |
MULTIPLE |
20 mm |
CMOS |
1.6 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
1 |
YES |
YES |
e4 |
||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
20 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.71 V |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
20 mm |
YES |
16 |
20 MHz |
30 |
260 |
MULTIPLE |
20 mm |
CMOS |
1.8 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
2 |
YES |
YES |
e4 |
||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
20 mm |
YES |
16 |
20 MHz |
30 |
260 |
MULTIPLE |
20 mm |
CMOS |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
1 |
YES |
YES |
e4 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
YES |
YES |
||||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.1 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.15 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
YES |
YES |
||||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.1 V |
100 Cel |
-40 Cel |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.15 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
YES |
YES |
||||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
YES |
YES |
||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.1 V |
85 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.15 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
YES |
YES |
||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.1 V |
95 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.15 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
YES |
YES |
||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
||||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.1 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.15 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
||||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.1 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.1 V |
100 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
24 mm |
YES |
30 |
260 |
MULTIPLE |
24 mm |
CMOS |
1.15 V |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
3 |
YES |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.1 V |
85 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.15 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
|||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.05 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.1 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.1 V |
95 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.15 V |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
YES |
YES |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
0 |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
3 V |
85 Cel |
4 |
-40 Cel |
QUAD |
1.2 mm |
16384 |
10 mm |
YES |
0 |
64 MHz |
MULTIPLE |
10 mm |
4 |
CMOS |
63.6 mA |
3.3 V |
8 |
2 |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G64 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
|
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
0 |
16 |
SMALL OUTLINE |
SOP28,.4 |
1.8 V |
105 Cel |
-40 Cel |
TIN |
DUAL |
2.65 mm |
512 |
7.5 mm |
YES |
0 |
64 MHz |
40 |
260 |
MULTIPLE |
17.925 mm |
3 |
CMOS |
53 mA |
3.3 V |
1 |
FLASH |
1.27 mm |
FLOATING POINT |
R-PDSO-G28 |
3 |
YES |
YES |
e3 |
16 |
||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
FLATPACK, LOW PROFILE |
3 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
1.6 mm |
7 mm |
YES |
0 |
20 MHz |
30 |
260 |
MULTIPLE |
7 mm |
CMOS |
3.3 V |
YES |
.8 mm |
FIXED POINT |
S-PQFP-G32 |
3 |
YES |
YES |
e4 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
80 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
0 |
YES |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP80,.55SQ |
3 V |
85 Cel |
DSPIC33CH |
4 |
-40 Cel |
YES |
QUAD |
YES |
4-Ch 12-Bit |
1.2 mm |
174762 |
49152 |
12 mm |
0 |
YES |
ANALOG COMPARATOR(4), BOR, CLC, CRC, CVD, CWG, POR, PTG, PWM(12), TIMER(2), WDT(2) |
0 |
64 MHz |
MULTIPLE |
12 mm |
5 |
49152 |
CMOS |
4-Ch 12-Bit |
98 mA |
3.3 V |
8 |
YES |
2 |
CAN, I2C(3), I2S(3), SPI(3), UART(3) |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G80 |
100 rpm |
YES |
YES |
24 |
69 |
|||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
184 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
AEC-Q100 |
14 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.7 V |
105 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
12 mm |
3.3V NOMINAL ALSO AVAILABLE @60MHZ FREQUENCY |
YES |
16 |
60 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B184 |
YES |
YES |
|||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
3 V |
85 Cel |
4 |
-40 Cel |
QUAD |
.6 mm |
16384 |
6 mm |
YES |
64 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
6 mm |
2 |
CMOS |
35 mA |
3.3 V |
4 |
4 |
FLASH |
.4 mm |
FIXED POINT |
S-PQCC-N48 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
3 V |
85 Cel |
4 |
-40 Cel |
QUAD |
.6 mm |
16384 |
6 mm |
YES |
64 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
6 mm |
2 |
CMOS |
35 mA |
3.3 V |
4 |
4 |
FLASH |
.4 mm |
FIXED POINT |
S-PQCC-N48 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
3 V |
85 Cel |
4 |
-40 Cel |
QUAD |
.6 mm |
24576 |
6 mm |
YES |
64 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
6 mm |
2 |
CMOS |
35 mA |
3.3 V |
4 |
4 |
FLASH |
.4 mm |
FIXED POINT |
S-PQCC-N48 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
3 V |
85 Cel |
4 |
-40 Cel |
QUAD |
.6 mm |
24576 |
6 mm |
YES |
64 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
6 mm |
2 |
CMOS |
35 mA |
3.3 V |
4 |
4 |
FLASH |
.4 mm |
FIXED POINT |
S-PQCC-N48 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
3 V |
85 Cel |
4 |
-40 Cel |
DUAL |
2 mm |
8192 |
5.3 mm |
YES |
64 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
10.2 mm |
2 |
CMOS |
35 mA |
3.3 V |
4 |
4 |
FLASH |
.65 mm |
FIXED POINT |
R-PDSO-G28 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
3 V |
85 Cel |
4 |
-40 Cel |
QUAD |
.6 mm |
8192 |
6 mm |
YES |
64 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
6 mm |
2 |
CMOS |
35 mA |
3.3 V |
4 |
4 |
FLASH |
.4 mm |
FIXED POINT |
S-PQCC-N48 |
YES |
YES |
24 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.