INDUSTRIAL Digital Signal Processors (DSPs) 1,106

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

DSPIC33EP128GS804T-I/ML

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

NO LEAD

44

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

TS 16949

0

YES

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC44,.31SQ,25

3 V

85 Cel

4

-40 Cel

MATTE TIN

YES

QUAD

YES

1-Ch 12-Bit

1 mm

131072

8192

8 mm

0

YES

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

0

60 MHz

MULTIPLE

8 mm

7

8192

CMOS

17-Ch 12-Bit

75 mA

3.3 V

4

YES

4

CAN(2), I2C(2), SPI(3), UART(2)

FLASH

.65 mm

FIXED POINT

S-PQCC-N44

YES

YES

e3

24

33

DSPIC33EP128GS805-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

48

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

TS 16949

0

YES

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP48,.35SQ

3 V

85 Cel

4

-40 Cel

MATTE TIN

YES

QUAD

YES

1-Ch 12-Bit

1.2 mm

131072

8192

7 mm

0

YES

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

0

60 MHz

MULTIPLE

7 mm

7

8192

CMOS

17-Ch 12-Bit

75 mA

3.3 V

4

YES

4

CAN(2), I2C(2), SPI(3), UART(2)

FLASH

.5 mm

FIXED POINT

S-PQFP-G48

YES

YES

e3

24

33

DSPIC33EP128GS806-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

TS 16949

0

YES

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

4

-40 Cel

MATTE TIN

YES

QUAD

YES

2-Ch 12-Bit

1.2 mm

131072

8192

10 mm

0

YES

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

0

60 MHz

MULTIPLE

10 mm

7

8192

CMOS

22-Ch 12-Bit

75 mA

3.3 V

4

YES

4

CAN(2), I2C(2), SPI(3), UART(2)

FLASH

.5 mm

FIXED POINT

S-PQFP-G64

YES

YES

e3

24

51

DSPIC33EP128GS808T-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

80

TQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

TS 16949

0

YES

16

FLATPACK, THIN PROFILE

TQFP80,.55SQ

3 V

85 Cel

4

-40 Cel

MATTE TIN

YES

QUAD

YES

2-Ch 12-Bit

1.2 mm

131072

8192

12 mm

0

YES

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

0

60 MHz

MULTIPLE

12 mm

7

8192

CMOS

22-Ch 12-Bit

75 mA

3.3 V

4

YES

4

CAN(2), I2C(2), SPI(3), UART(2)

FLASH

.5 mm

FIXED POINT

S-PQFP-G80

YES

YES

e3

24

67

DSPIC33EP64GS806-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

TS 16949

0

YES

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

4

-40 Cel

MATTE TIN

YES

QUAD

YES

2-Ch 12-Bit

1.2 mm

65536

8192

10 mm

0

YES

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

0

60 MHz

MULTIPLE

10 mm

7

8192

CMOS

22-Ch 12-Bit

75 mA

3.3 V

4

YES

4

CAN(2), I2C(2), SPI(3), UART(2)

FLASH

.5 mm

FIXED POINT

S-PQFP-G64

70 rpm

YES

YES

e3

24

51

DFDF2812ZHHAR

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

179

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

2 V

16

19

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.81 V

85 Cel

C28X

3

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

18432

12 mm

1.8V NOMINAL AVAILBALE @135MHZ

YES

16

35 MHz

30

260

MULTIPLE

12 mm

8

36864

CMOS

230 mA

1.9 V

YES

OTPROM

.8 mm

FIXED POINT

S-PBGA-B179

3

YES

NO

e1

16

DVC5416PGE160IDWLD

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.65 V

23

FLATPACK, LOW PROFILE, FINE PITCH

1.55 V

100 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

20 mm

YES

16

20 MHz

30

260

MULTIPLE

20 mm

CMOS

1.6 V

.5 mm

FIXED POINT

S-PQFP-G144

1

YES

YES

e4

TMSDVC5402PGE100G4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.98 V

20

FLATPACK, LOW PROFILE, FINE PITCH

1.71 V

100 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

20 mm

YES

16

20 MHz

30

260

MULTIPLE

20 mm

CMOS

1.8 V

.5 mm

FIXED POINT

S-PQFP-G144

2

YES

YES

e4

TX5416PGE

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

23

FLATPACK, LOW PROFILE, FINE PITCH

100 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

20 mm

YES

16

20 MHz

30

260

MULTIPLE

20 mm

CMOS

.5 mm

FIXED POINT

S-PQFP-G144

1

YES

YES

e4

ADSP-21571BSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

YES

YES

ADSP-21571BSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-21571CSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

105 Cel

-40 Cel

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

YES

YES

ADSP-21571CSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

100 Cel

-40 Cel

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

YES

YES

ADSP-21573BBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.1 V

.8 mm

FIXED POINT

S-PBGA-B400

YES

YES

ADSP-21573BBCZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.1 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.15 V

.8 mm

FIXED POINT

S-PBGA-B400

YES

YES

ADSP-21573CBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.1 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-21573CBCZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.1 V

95 Cel

-40 Cel

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.15 V

.8 mm

FIXED POINT

S-PBGA-B400

YES

YES

ADSP-SC570BSWZ-42

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570BSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570CSWZ-42

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC570CSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571BSWZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571BSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571BSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571CSWZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571CSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC571CSWZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.2 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.1 V

100 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.15 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-SC572BBCZ-42

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.1 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-SC572BBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.1 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-SC572CBCZ-42

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.1 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-SC572CBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.1 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-SC573BBCZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

16

GRID ARRAY, LOW PROFILE, FINE PITCH

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-SC573BBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.1 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-SC573BBCZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.1 V

85 Cel

-40 Cel

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.15 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

ADSP-SC573CBCZ-3

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

16

GRID ARRAY, LOW PROFILE, FINE PITCH

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-SC573CBCZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.1 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

e1

ADSP-SC573CBCZ-5

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.1 V

95 Cel

-40 Cel

BOTTOM

1.5 mm

17 mm

YES

16

30

260

MULTIPLE

17 mm

CMOS

1.15 V

.8 mm

FIXED POINT

S-PBGA-B400

3

YES

YES

DSPIC33CH128MP506-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

TS 16949

0

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

4

-40 Cel

QUAD

1.2 mm

16384

10 mm

YES

0

64 MHz

MULTIPLE

10 mm

4

CMOS

63.6 mA

3.3 V

8

2

FLASH

.5 mm

FIXED POINT

S-PQFP-G64

YES

YES

24

MC56F8002VWLR

NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

3.6 V

16

0

16

SMALL OUTLINE

SOP28,.4

1.8 V

105 Cel

-40 Cel

TIN

DUAL

2.65 mm

512

7.5 mm

YES

0

64 MHz

40

260

MULTIPLE

17.925 mm

3

CMOS

53 mA

3.3 V

1

FLASH

1.27 mm

FLOATING POINT

R-PDSO-G28

3

YES

YES

e3

16

TMS320LF2401AVFAR

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

FLATPACK, LOW PROFILE

3 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

7 mm

YES

0

20 MHz

30

260

MULTIPLE

7 mm

CMOS

3.3 V

YES

.8 mm

FIXED POINT

S-PQFP-G32

3

YES

YES

e4

DSPIC33CH512MP508-I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

80

TFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

TS 16949

0

YES

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP80,.55SQ

3 V

85 Cel

DSPIC33CH

4

-40 Cel

YES

QUAD

YES

4-Ch 12-Bit

1.2 mm

174762

49152

12 mm

0

YES

ANALOG COMPARATOR(4), BOR, CLC, CRC, CVD, CWG, POR, PTG, PWM(12), TIMER(2), WDT(2)

0

64 MHz

MULTIPLE

12 mm

5

49152

CMOS

4-Ch 12-Bit

98 mA

3.3 V

8

YES

2

CAN, I2C(3), I2S(3), SPI(3), UART(3)

FLASH

.5 mm

FIXED POINT

S-PQFP-G80

100 rpm

YES

YES

24

69

ADBF707WCBCZ411

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

184

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

AEC-Q100

14

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 V

105 Cel

-40 Cel

BOTTOM

1.7 mm

12 mm

3.3V NOMINAL ALSO AVAILABLE @60MHZ FREQUENCY

YES

16

60 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

12 mm

CMOS

1.8 V

.8 mm

FIXED POINT

S-PBGA-B184

YES

YES

DSPIC33CK128MP205-I/M4

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

3 V

85 Cel

4

-40 Cel

QUAD

.6 mm

16384

6 mm

YES

64 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

6 mm

2

CMOS

35 mA

3.3 V

4

4

FLASH

.4 mm

FIXED POINT

S-PQCC-N48

YES

YES

24

DSPIC33CK128MP505-I/M4

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

3 V

85 Cel

4

-40 Cel

QUAD

.6 mm

16384

6 mm

YES

64 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

6 mm

2

CMOS

35 mA

3.3 V

4

4

FLASH

.4 mm

FIXED POINT

S-PQCC-N48

YES

YES

24

DSPIC33CK256MP205-I/M4

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

3 V

85 Cel

4

-40 Cel

QUAD

.6 mm

24576

6 mm

YES

64 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

6 mm

2

CMOS

35 mA

3.3 V

4

4

FLASH

.4 mm

FIXED POINT

S-PQCC-N48

YES

YES

24

DSPIC33CK256MP505-I/M4

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

3 V

85 Cel

4

-40 Cel

QUAD

.6 mm

24576

6 mm

YES

64 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

6 mm

2

CMOS

35 mA

3.3 V

4

4

FLASH

.4 mm

FIXED POINT

S-PQCC-N48

YES

YES

24

DSPIC33CK32MP202-I/SS

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

3.6 V

8

16

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

3 V

85 Cel

4

-40 Cel

DUAL

2 mm

8192

5.3 mm

YES

64 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

10.2 mm

2

CMOS

35 mA

3.3 V

4

4

FLASH

.65 mm

FIXED POINT

R-PDSO-G28

YES

YES

24

DSPIC33CK32MP505-I/M4

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

NO

YES

3.6 V

8

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

3 V

85 Cel

4

-40 Cel

QUAD

.6 mm

8192

6 mm

YES

64 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

6 mm

2

CMOS

35 mA

3.3 V

4

4

FLASH

.4 mm

FIXED POINT

S-PQCC-N48

YES

YES

24

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.