| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.24 V |
20 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
90 Cel |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.25 mm |
4096 |
23 mm |
YES |
64 |
75 MHz |
30 |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2875 V |
20 |
32 |
1.25 |
GRID ARRAY, HEAT SINK/SLUG |
BGA697,29X29,32 |
1.2125 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.242 mm |
8192 |
24 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.6 MHz |
30 |
245 |
MULTIPLE |
24 mm |
4 |
CMOS |
1.25 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2875 V |
20 |
32 |
1.25 |
GRID ARRAY, HEAT SINK/SLUG |
BGA697,29X29,32 |
1.2125 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.242 mm |
8192 |
24 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.6 MHz |
30 |
245 |
MULTIPLE |
24 mm |
4 |
CMOS |
1.25 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
14 |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA529,23X23,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
8192 |
YES |
32 |
900 MHz |
30 |
245 |
MULTIPLE |
8 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
14 |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA529,23X23,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
8192 |
19 mm |
YES |
32 |
720 MHz |
30 |
245 |
MULTIPLE |
19 mm |
8 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
|||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
520 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
14 |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA529,23X23,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
8192 |
19 mm |
YES |
32 |
900 MHz |
30 |
245 |
MULTIPLE |
19 mm |
8 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
|||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
32 |
32 |
1.05,1.5,2.5 |
GRID ARRAY |
BGA576,24X24,40 |
1 V |
85 Cel |
0 Cel |
BOTTOM |
3.1 mm |
131072 |
25 mm |
YES |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
25 mm |
CMOS |
1.05 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B576 |
Not Qualified |
NO |
YES |
||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
30 |
260 |
CMOS |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.35 V |
15 |
32 |
1.3,1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.25 V |
70 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
8192 |
24 mm |
YES |
16 |
30 MHz |
30 |
260 |
SINGLE |
24 mm |
4 |
CMOS |
1.3 V |
40 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
4 |
Not Qualified |
YES |
NO |
e4 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.35 V |
15 |
32 |
1.3,1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.25 V |
70 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
8192 |
17 mm |
YES |
16 |
30 MHz |
30 |
260 |
SINGLE |
17 mm |
4 |
CMOS |
1.3 V |
40 |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.35 V |
8 |
15 |
1.3,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.25 V |
70 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
499712 |
17 mm |
YES |
16 |
30 MHz |
30 |
260 |
SINGLE |
17 mm |
3 |
CMOS |
1.3 V |
40 |
Other Microprocessor ICs |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
456 rpm |
YES |
NO |
e1 |
||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2875 V |
8 |
32 |
32 |
1.25,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.2125 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.242 mm |
8192 |
24 mm |
YES |
32 |
50 MHz |
30 |
245 |
MULTIPLE |
24 mm |
4 |
CMOS |
1.25 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
737 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
8 |
14 |
32 |
1.1,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA737,29X29,32 |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.242 mm |
8192 |
24 mm |
YES |
32 |
50 MHz |
30 |
245 |
MULTIPLE |
24 mm |
14 |
CMOS |
1 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B737 |
4 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
|
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
19 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,23X23,20 |
1.7 V |
70 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
YES |
16 |
50 MHz |
260 |
MULTIPLE |
12 mm |
CMOS |
1.8 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
3 |
Not Qualified |
600 rpm |
YES |
YES |
e1 |
|||||||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
13 |
GRID ARRAY, FINE PITCH |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.02 mm |
17 mm |
YES |
32 |
25 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
.5 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
NO |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
132 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
32 |
5 |
FLATPACK |
SPQFP132,1.1SQ |
4.75 V |
85 Cel |
4 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
1024 |
24.13 mm |
NO |
32 |
50 MHz |
30 |
260 |
MULTIPLE |
24.13 mm |
2 |
CMOS |
425 mA |
5 V |
1 |
1 |
Digital Signal Processors |
.635 mm |
FLOATING POINT |
S-PQFP-G132 |
4 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
132 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
32 |
5 |
FLATPACK |
SPQFP132,1.1SQ |
4.75 V |
85 Cel |
4 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
1024 |
24.13 mm |
NO |
32 |
60 MHz |
30 |
260 |
MULTIPLE |
24.13 mm |
2 |
CMOS |
475 mA |
5 V |
1 |
1 |
Digital Signal Processors |
.635 mm |
FLOATING POINT |
S-PQFP-G132 |
4 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
PIN/PEG |
325 |
IPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
8 |
31 |
32 |
5 |
GRID ARRAY, INTERSTITIAL PITCH |
SPGA325,35X35MOD |
4.75 V |
85 Cel |
5 |
0 Cel |
GOLD |
PERPENDICULAR |
5.08 mm |
8K |
47.25 mm |
YES |
32 |
60 MHz |
MULTIPLE |
47.25 mm |
2 |
CMOS |
950 mA |
5 V |
6 |
0 |
Digital Signal Processors |
2.54 mm |
FLOATING POINT |
S-CPGA-P325 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
32 |
5 |
FLATPACK |
QFP144,1.2SQ |
4.75 V |
85 Cel |
4 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.1 mm |
512 |
28 mm |
NO |
32 |
40 MHz |
30 |
245 |
MULTIPLE |
28 mm |
2 |
CMOS |
390 mA |
5 V |
2 |
1 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PQFP-G144 |
4 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
32 |
5 |
FLATPACK |
QFP144,1.2SQ |
4.75 V |
85 Cel |
4 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.1 mm |
512 |
28 mm |
NO |
32 |
50 MHz |
30 |
245 |
MULTIPLE |
28 mm |
2 |
CMOS |
425 mA |
5 V |
2 |
1 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PQFP-G144 |
4 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
32 |
5 |
FLATPACK |
QFP144,1.2SQ |
4.75 V |
85 Cel |
4 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.1 mm |
512 |
28 mm |
NO |
32 |
60 MHz |
30 |
245 |
MULTIPLE |
28 mm |
2 |
CMOS |
475 mA |
5 V |
2 |
1 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PQFP-G144 |
4 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||
|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
OTHER |
BALL |
841 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY, FINE PITCH |
.95 V |
115 Cel |
-55 Cel |
TIN SILVER COPPER |
BOTTOM |
3.39 mm |
24 mm |
YES |
16 |
312.5 MHz |
30 |
245 |
SINGLE |
24 mm |
16 |
CMOS |
1 V |
80 |
.8 mm |
FLOATING POINT |
S-PBGA-B841 |
4 |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HLBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.465 V |
8 |
32 |
32 |
3.3 |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE |
BGA352,26X26,50 |
3.135 V |
85 Cel |
4 |
0 Cel |
BOTTOM |
1.7 mm |
25600 |
35 mm |
YES |
64 |
100 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
35 mm |
1 |
CMOS |
2300 mA |
3.3 V |
0 |
0 |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
PIN/PEG |
305 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
8 |
32 |
32 |
3.3 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
HSPGA305,35X35MOD |
3.135 V |
85 Cel |
4 |
0 Cel |
PERPENDICULAR |
5.59 mm |
25600 |
47.245 mm |
YES |
64 |
100 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
47.245 mm |
1 |
CMOS |
2300 mA |
3.3 V |
0 |
0 |
Digital Signal Processors |
2.54 mm |
FLOATING POINT |
S-CPGA-P305 |
Not Qualified |
NO |
YES |
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|
Texas Instruments |
OTHER |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC |
YES |
38535Q/M;38534H;883B |
16 |
CHIP CARRIER |
LDCC68,1.0SQ |
100 Cel |
-55 Cel |
QUAD |
544 |
MOS |
400 mA |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-XQCC-J68 |
Not Qualified |
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|
Texas Instruments |
OTHER |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
38535Q/M;38534H;883B |
16 |
GRID ARRAY |
PGA68,11X11 |
100 Cel |
-55 Cel |
PERPENDICULAR |
544 |
MOS |
400 mA |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-XPGA-P68 |
Not Qualified |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
452 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA452,36X36,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
5.08 mm |
524288 |
46.995 mm |
YES |
48 |
40 MHz |
MULTIPLE |
46.995 mm |
CMOS |
2200 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-CBGA-B452 |
Not Qualified |
YES |
YES |
e0 |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
452 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA452,36X36,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
5.08 mm |
524288 |
46.995 mm |
YES |
48 |
40 MHz |
MULTIPLE |
46.995 mm |
CMOS |
3400 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-CBGA-B452 |
Not Qualified |
YES |
YES |
e0 |
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|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
PIN/PEG |
181 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.25 V |
24 |
32 |
5 |
GRID ARRAY |
PGA181M,15X15 |
4.75 V |
85 Cel |
0 Cel |
PERPENDICULAR |
6.22 mm |
2048 |
39 mm |
NO |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
39 mm |
CMOS |
600 mA |
5 V |
Digital Signal Processors |
2.54 mm |
FLOATING POINT |
S-CPGA-P181 |
Not Qualified |
NO |
YES |
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|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
132 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
24 |
32 |
3.3 |
FLATPACK, BUMPER |
SPQFP132,1.1SQ |
3.13 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
2048 |
24.13 mm |
NO |
32 |
40 MHz |
MULTIPLE |
24.13 mm |
CMOS |
300 mA |
3.3 V |
Digital Signal Processors |
.635 mm |
FLOATING POINT |
S-PQFP-G132 |
Not Qualified |
YES |
YES |
e0 |
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|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
PIN/PEG |
181 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
32 |
24 |
32 |
5 |
GRID ARRAY |
PGA181M,15X15 |
4.75 V |
85 Cel |
4 |
0 Cel |
PERPENDICULAR |
6.22 mm |
1024 |
39 mm |
NO |
32 |
50 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
39 mm |
2 |
CMOS |
600 mA |
5 V |
1 |
2 |
Digital Signal Processors |
MROM |
2.54 mm |
FLOATING POINT |
S-CPGA-P181 |
Not Qualified |
NO |
YES |
32 |
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|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
13 |
1.2,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.25 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
17 mm |
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
YES |
16 |
456 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.3 V |
Other Microprocessor ICs |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
YES |
NO |
e1 |
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|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
8192 |
19 mm |
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
YES |
32 |
1100 MHz |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B529 |
4 |
Not Qualified |
YES |
NO |
e1 |
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|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
8192 |
19 mm |
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
YES |
32 |
1100 MHz |
30 |
245 |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B529 |
4 |
Not Qualified |
YES |
NO |
e1 |
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|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
20 |
GRID ARRAY, FINE PITCH |
1.16 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
23 mm |
ALSO REQUIRES 3.3V SUPPLY FOR I/O |
YES |
64 |
850 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
4 |
Not Qualified |
YES |
NO |
e1 |
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|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
19 |
16 |
1.6,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.55 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
65536 |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
133 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
CMOS |
1.6 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B169 |
Not Qualified |
YES |
YES |
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|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
24 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
8192 |
16 mm |
YES |
64 |
50 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B361 |
3 |
Not Qualified |
YES |
NO |
e1 |
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|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
24 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
8192 |
16 mm |
YES |
64 |
50 MHz |
30 |
260 |
MULTIPLE |
16 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B361 |
3 |
Not Qualified |
YES |
NO |
e1 |
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|
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
841 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.39 mm |
24 mm |
YES |
16 |
30 |
245 |
MULTIPLE |
24 mm |
16 |
CMOS |
1 V |
80 |
.8 mm |
FIXED POINT |
S-PBGA-B841 |
4 |
NO |
NO |
e1 |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA225,15X15,50 |
3.15 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
131072 |
23 mm |
YES |
48 |
40 MHz |
30 |
225 |
MULTIPLE |
23 mm |
CMOS |
600 mA |
3.3 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
BGA225,15X15,50 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.7 mm |
65536 |
23 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
23 mm |
CMOS |
850 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
YES |
YES |
e0 |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
33.33 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
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|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
1 |
32 |
32 |
3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
3.15 V |
85 Cel |
3 |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
4M |
32 mm |
YES |
48 |
40 MHz |
225 |
MULTIPLE |
32 mm |
1 |
CMOS |
530 mA |
3.3 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e0 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.