Digital Signal Processors (DSPs)

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

SM320VC5421PGE20EP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

NO

YES

1.98 V

16

19

32

1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

1.75 V

85 Cel

5

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

262144

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

50 MHz

30

260

MULTIPLE

20 mm

2

CMOS

1.8 V

12

Digital Signal Processors

.5 mm

FIXED POINT

S-PQFP-G144

1

Not Qualified

YES

YES

e4

DSPIC30F2010-30I/SOG

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

5.5 V

8

TS 16949

0

NO

16

3/5

SMALL OUTLINE

SOP28,.4

2.5 V

85 Cel

3

-40 Cel

Matte Tin (Sn)

YES

DUAL

NO

2.65 mm

4096

512

7.5 mm

1K

NO

BOD, POR, PWM(8), QEI, TIMER(3), WDT

0

40 MHz

40

260

MULTIPLE

17.9 mm

3

512

CMOS

6-Ch 10-Bit

300 mA

3 V

YES

Digital Signal Processors

I2C, SPI, UART

FLASH

1.27 mm

FLOATING POINT

R-PDSO-G28

1

Not Qualified

30 rpm

YES

YES

e3

24

20

DSPIC30F2010T-20I/SOG

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

5.5 V

8

TS 16949

0

NO

16

3/5

SMALL OUTLINE

SOP28,.4

2.5 V

85 Cel

3

-40 Cel

Matte Tin (Sn)

YES

DUAL

NO

2.64 mm

4096

512

7.49 mm

1K

OPERATES AT 2.5 V MINIMUM SUPPLY @ 7.5 MHZ

NO

BOD, POR, PWM(8), QEI, TIMER(3), WDT

0

40 MHz

MULTIPLE

17.87 mm

3

512

CMOS

6-Ch 10-Bit

300 mA

3 V

YES

Digital Signal Processors

I2C, SPI, UART

FLASH

1.27 mm

FLOATING POINT

R-PDSO-G28

1

Not Qualified

20 rpm

YES

YES

e3

24

20

TMS320C6713BGDP225

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

22

32

1.2,3.3

GRID ARRAY

BGA272,20X20,50

1.14 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.57 mm

65536

27 mm

ALSO OPERATES AT 3.3V SUPPLY

YES

32

225 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

2

CMOS

1.2 V

16

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e0

TMS320C6713BGDP300

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.47 V

22

32

1.4,3.3

GRID ARRAY

BGA272,20X20,50

1.33 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.57 mm

65536

27 mm

ALSO OPERATES AT 3.3V SUPPLY

YES

32

300 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

2

CMOS

1.4 V

16

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e0

TMS32C6713BGDPA200

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

22

32

1.2,3.3

GRID ARRAY

BGA272,20X20,50

1.14 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.57 mm

65536

27 mm

ALSO OPERATES AT 3.3V SUPPLY

YES

32

200 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

2

CMOS

1.2 V

16

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e0

ADSP-BF531SBBC400

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

.8 V

85 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

1.7 mm

12 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

240

MULTIPLE

12 mm

CMOS

1.2 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B160

3

Not Qualified

400 rpm

YES

YES

e0

ADSP-BF531SBBZ400

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

260

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF532SBBZ400

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

260

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF533SBBC500

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

.8 V

85 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

1.7 mm

12 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

240

MULTIPLE

12 mm

CMOS

1.2 V

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B160

3

Not Qualified

500 rpm

YES

YES

e0

ADSP-BF533SBBZ500

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

30

260

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

500 rpm

YES

YES

e1

TMS320C6411AGLZ

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

23

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

90 Cel

4

0 Cel

TIN LEAD

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75.19 MHz

20

220

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6414EGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6414EGLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6414EGLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6415EGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6415EGLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6416EGLZ5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.14 V

TIN LEAD

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

20

220

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6416EGLZ6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6416EGLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

ADSP-21262SKBCZ200

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

136

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.26 V

32

16

32

1.2,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA136,14X14,32

1.14 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.7 mm

65536

12 mm

YES

16

200 MHz

260

MULTIPLE

12 mm

3

CMOS

1.2 V

22

Digital Signal Processors

MROM

.8 mm

FLOATING POINT

S-PBGA-B136

3

Not Qualified

NO

YES

e1

32

ADSP-21262SKSTZ200

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.26 V

16

32

1.2,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

1.14 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

65536

20 mm

YES

16

66.67 MHz

40

260

MULTIPLE

20 mm

CMOS

1.2 V

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G144

3

Not Qualified

NO

YES

e3

SM32C6713BGDPA20EP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

22

32

1.25,3.3

GRID ARRAY

BGA272,20X20,50

1.2 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.57 mm

4096

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

200 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

2

CMOS

560 mA

1.26 V

16

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e0

TMS32C6414EGLZA5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

125 mA

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS32C6414EGLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

125 mA

1.4 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C6711DGDP200

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

22

32

1.2,3.3

GRID ARRAY

BGA272,20X20,50

1.14 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.57 mm

17408

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

200 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

2

CMOS

1.2 V

16

Digital Signal Processors

FLASH

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e0

DSPIC30F5011T-20I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

4.75 V

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.2 mm

10 mm

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ

0

40 MHz

40

260

10 mm

CMOS

5 V

Digital Signal Processors

FLASH

.5 mm

FIXED POINT

S-PQFP-G64

3

Not Qualified

e3

24

DSPIC30F5011T-30I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

2.5 V

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.2 mm

10 mm

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ

0

40 MHz

40

260

10 mm

CMOS

3.3 V

Digital Signal Processors

FLASH

.5 mm

FIXED POINT

S-PQFP-G64

3

Not Qualified

e3

24

DSPIC30F5013-20E/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

GULL WING

80

TQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

FLATPACK, THIN PROFILE

TQFP80,.55SQ

4.75 V

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.2 mm

12 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 10 MHZ

0

40 MHz

40

260

12 mm

CMOS

5 V

Digital Signal Processors

FLASH

.5 mm

FIXED POINT

S-PQFP-G80

3

Not Qualified

e3

24

DSPIC30F5013-20I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

80

TQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

FLATPACK, THIN PROFILE

TQFP80,.55SQ

4.75 V

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.2 mm

12 mm

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ

0

40 MHz

40

260

12 mm

CMOS

5 V

Digital Signal Processors

FLASH

.5 mm

FIXED POINT

S-PQFP-G80

3

Not Qualified

e3

24

DSPIC30F6014-20E/PF

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

GULL WING

80

TQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

FLATPACK, THIN PROFILE

TQFP80,.63SQ

4.5 V

125 Cel

-40 Cel

MATTE TIN

QUAD

1.2 mm

14 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 10 MHZ

0

40 MHz

260

14 mm

CMOS

5 V

Digital Signal Processors

FLASH

.65 mm

FIXED POINT

S-PQFP-G80

1

Not Qualified

e3

24

DSPIC30F6014-20I/PF

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

80

TQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

FLATPACK, THIN PROFILE

TQFP80,.63SQ

4.5 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.2 mm

14 mm

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ

0

40 MHz

260

14 mm

CMOS

5 V

Digital Signal Processors

FLASH

.65 mm

FIXED POINT

S-PQFP-G80

1

Not Qualified

e3

24

TMS320C6412GNZA500

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.36 V

TIN LEAD

BOTTOM

2.8 mm

262144

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

MULTIPLE

27 mm

CMOS

1.4 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e0

TMS320C6711DGDP250

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.47 V

22

32

1.4,3.3

GRID ARRAY

BGA272,20X20,50

1.33 V

90 Cel

4

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.57 mm

65536

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

250 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

2

CMOS

1.4 V

16

Digital Signal Processors

FLASH

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

YES

NO

e0

ADSP-BF535PBB-200

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

260

BGA

SQUARE

PLASTIC/EPOXY

YES

1.575 V

26

32

1.5,3.3

GRID ARRAY

BGA260,18X18,40

.95 V

85 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

2.5 mm

19 mm

YES

32

40 MHz

MULTIPLE

19 mm

CMOS

1.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B260

3

Not Qualified

200 rpm

YES

YES

e0

ADSP-BF535PBB-300

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

260

BGA

SQUARE

PLASTIC/EPOXY

YES

1.575 V

26

32

1.5,3.3

GRID ARRAY

BGA260,18X18,40

.95 V

85 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

2.5 mm

19 mm

YES

32

40 MHz

MULTIPLE

19 mm

CMOS

1.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B260

3

Not Qualified

300 rpm

YES

YES

e0

ADSP-BF535PKB-300

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

260

BGA

SQUARE

PLASTIC/EPOXY

YES

1.575 V

26

32

1.5,3.3

GRID ARRAY

BGA260,18X18,40

.95 V

70 Cel

0 Cel

TIN LEAD SILVER

BOTTOM

2.5 mm

19 mm

YES

32

40 MHz

MULTIPLE

19 mm

CMOS

1.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B260

3

Not Qualified

300 rpm

YES

YES

e0

ADSP-BF535PKB-350

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

260

BGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

26

32

1.6,3.3

GRID ARRAY

BGA260,18X18,40

.95 V

70 Cel

0 Cel

TIN LEAD SILVER

BOTTOM

2.5 mm

19 mm

YES

32

40 MHz

MULTIPLE

19 mm

CMOS

1.6 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B260

3

Not Qualified

350 rpm

YES

YES

e0

ADSP-BF561SBB500

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

297

BGA

SQUARE

PLASTIC/EPOXY

YES

1.375 V

23

32

1.2,2.5/3.3

GRID ARRAY

BGA297,26X26,40

.8 V

85 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

2.43 mm

27 mm

ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY

YES

32

500 MHz

225

MULTIPLE

27 mm

CMOS

1.25 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B297

3

Not Qualified

500 rpm

YES

YES

e0

DSPIC30F2010-20E/SO

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

5.5 V

8

TS 16949

0

NO

16

3/5

SMALL OUTLINE

SOP28,.4

3 V

125 Cel

3

-40 Cel

Matte Tin (Sn)

YES

DUAL

NO

2.65 mm

4096

512

7.5 mm

1K

NO

BOD, POR, PWM(8), QEI, TIMER(3), WDT

0

40 MHz

40

250

MULTIPLE

17.9 mm

5

512

CMOS

6-Ch 10-Bit

150 mA

5 V

YES

2

Digital Signal Processors

I2C, SPI, UART

FLASH

1.27 mm

FIXED POINT

R-PDSO-G28

1

Not Qualified

20 rpm

YES

YES

e3

24

20

DSPIC30F2010-20I/SO

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

5.5 V

8

TS 16949

0

NO

16

3/5

SMALL OUTLINE

SOP28,.4

2.5 V

85 Cel

3

-40 Cel

Matte Tin (Sn)

YES

DUAL

NO

2.65 mm

4096

512

7.5 mm

1K

NO

BOD, POR, PWM(8), QEI, TIMER(3), WDT

0

40 MHz

40

250

MULTIPLE

17.9 mm

5

512

CMOS

6-Ch 10-Bit

150 mA

3 V

YES

2

Digital Signal Processors

I2C, SPI, UART

FLASH

1.27 mm

FIXED POINT

R-PDSO-G28

1

Not Qualified

20 rpm

YES

YES

e3

24

20

DSPIC30F2010-20I/SP

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

NO

5.5 V

8

TS 16949

0

NO

16

3/5

IN-LINE

DIP28,.3

2.5 V

85 Cel

3

-40 Cel

MATTE TIN

YES

DUAL

NO

5.08 mm

4096

512

7.62 mm

1K

NO

BOD, POR, PWM(8), QEI, TIMER(3), WDT

0

40 MHz

MULTIPLE

34.671 mm

5

512

CMOS

6-Ch 10-Bit

150 mA

3 V

YES

2

Digital Signal Processors

I2C, SPI, UART

FLASH

2.54 mm

FIXED POINT

R-PDIP-T28

Not Qualified

20 rpm

YES

YES

e3

24

20

DSPIC30F2010-30I/SP

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

NO

5.5 V

8

TS 16949

0

NO

16

3/5

IN-LINE

DIP28,.3

2.5 V

85 Cel

3

-40 Cel

MATTE TIN

YES

DUAL

NO

5.08 mm

4096

512

7.62 mm

1K

NO

BOD, POR, PWM(8), QEI, TIMER(3), WDT

0

40 MHz

MULTIPLE

34.671 mm

5

512

CMOS

6-Ch 10-Bit

150 mA

3 V

YES

2

Digital Signal Processors

I2C, SPI, UART

FLASH

2.54 mm

FIXED POINT

R-PDIP-T28

Not Qualified

30 rpm

YES

YES

e3

24

20

DSPIC30F2010T-20E/SO

Microchip Technology

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

5.5 V

8

TS 16949

0

NO

16

3/5

SMALL OUTLINE

SOP28,.4

3 V

125 Cel

3

-40 Cel

Matte Tin (Sn)

YES

DUAL

NO

2.65 mm

4096

512

7.5 mm

1K

NO

BOD, POR, PWM(8), QEI, TIMER(3), WDT

0

40 MHz

40

260

MULTIPLE

17.9 mm

5

512

CMOS

6-Ch 10-Bit

150 mA

5 V

YES

2

Digital Signal Processors

I2C, SPI, UART

FLASH

1.27 mm

FIXED POINT

R-PDSO-G28

1

Not Qualified

20 rpm

YES

YES

e3

24

20

DSPIC30F3010-20E/SO

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

SMALL OUTLINE

SOP28,.4

4.5 V

125 Cel

-40 Cel

Matte Tin (Sn)

DUAL

2.65 mm

7.5 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ

0

40 MHz

40

250

17.9 mm

CMOS

5 V

Digital Signal Processors

FLASH

1.27 mm

FIXED POINT

R-PDSO-G28

1

Not Qualified

e3

24

DSPIC30F3010-30I/SO

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

SMALL OUTLINE

SOP28,.4

4.5 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

2.65 mm

7.5 mm

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ

0

40 MHz

40

250

17.9 mm

CMOS

5 V

Digital Signal Processors

FLASH

1.27 mm

FIXED POINT

R-PDSO-G28

1

Not Qualified

e3

24

DSPIC30F3010T-30I/ML

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

NO LEAD

44

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC44,.31SQ,25

4.5 V

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1 mm

8 mm

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ

0

40 MHz

40

260

8 mm

CMOS

5 V

Digital Signal Processors

FLASH

.65 mm

FIXED POINT

S-PQCC-N44

1

Not Qualified

e3

24

DSPIC30F3011-20I/PT

Microchip Technology

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

GULL WING

44

TQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

16

3/5

FLATPACK, THIN PROFILE

TQFP44,.39SQ,31

4.5 V

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.2 mm

10 mm

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ

0

40 MHz

40

260

10 mm

CMOS

5 V

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PQFP-G44

3

Not Qualified

e3

24

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.