416 Microcontrollers 33

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

SAK-TC1197-512F180EAC

Infineon Technologies

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.5,2.5/3.3,3.3,5

GRID ARRAY

BGA416,26X26,40

125 Cel

-40 Cel

MATTE TIN

BOTTOM

4194304

250

131072

CMOS

600 mA

Microcontrollers

FLASH

1 mm

S-PBGA-B416

3

Not Qualified

180 rpm

e3

SAK-TC1797-512F180EAC

Infineon Technologies

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

32

NO

32

1.5,2.5/3.3,3.3

GRID ARRAY

BGA416,26X26,40

1.42 V

125 Cel

-40 Cel

TIN LEAD

YES

BOTTOM

YES

2.5 mm

4194304

27 mm

32

40 MHz

250

27 mm

131072

CMOS

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B416

3

Not Qualified

180 rpm

e0

221

TC1796256F150EBEKDUMA1

Infineon Technologies

MICROCONTROLLER

OTHER

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

24

NO

32

GRID ARRAY

1.42 V

125 Cel

-10 Cel

YES

BOTTOM

YES

2.5 mm

2097152

27 mm

128K

DMA(16), TIMER(2)

32

40 MHz

27 mm

65536

CMOS

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

1.5 V

NO

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

FLASH

1 mm

S-PBGA-B416

3

150 rpm

8

127

TC1197256F180EACKXUMA1

Infineon Technologies

MICROCONTROLLER, RISC

BALL

416

BGA

SQUARE

YES

1.58 V

24

NO

32

GRID ARRAY

1.42 V

YES

BOTTOM

YES

27 mm

32

40 MHz

NOT SPECIFIED

NOT SPECIFIED

27 mm

CMOS

1.5 V

NO

1 mm

180 rpm

221

SAK-TC1796-256F150EBD

Infineon Technologies

MICROCONTROLLER

OTHER

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

24

NO

32

1.5,2.5/3.3,3.3

GRID ARRAY

BGA416,26X26,40

1.42 V

125 Cel

-10 Cel

YES

BOTTOM

YES

2.5 mm

2097152

27 mm

32

40 MHz

NOT SPECIFIED

NOT SPECIFIED

27 mm

65536

CMOS

700 mA

1.5 V

NO

Microcontrollers

FLASH

1 mm

S-PBGA-B416

Not Qualified

150 rpm

127

TC1797512F180EFACKXUMA1

Infineon Technologies

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

32

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.42 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.4 mm

27 mm

32

90 MHz

NOT SPECIFIED

NOT SPECIFIED

27 mm

CMOS

1.5 V

NO

FLASH

1 mm

S-PBGA-B416

180 rpm

221

SPC5777CCK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CCK3MME3

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

0

NO

32

GRID ARRAY

BGA416,26X26,40

1.2 V

125 Cel

E200Z7

1

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

YES

POR

0

40 MHz

40

260

27 mm

0

524288

CMOS

1350 mA

128

YES

5

CAN(4), SCI(5), SPI(5)

FLASH

1 mm

FLOATING-POINT

S-PBGA-B416

3

264 rpm

YES

e2

8

SPC5777CK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CK3MME3

NXP Semiconductors

MICROCONTROLLER

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

0

NO

32

GRID ARRAY

BGA416,26X26,40

1.2 V

125 Cel

E200Z7

1

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

YES

POR

0

40 MHz

40

260

27 mm

0

524288

CMOS

1350 mA

128

YES

5

CAN(4), SCI(5), SPI(5)

FLASH

1 mm

FLOATING-POINT

S-PBGA-B416

3

264 rpm

YES

e2

8

SPC5777MK0MVU8R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.38 V

ISO 26262

32

NO

32

GRID ARRAY

1.19 V

125 Cel

-40 Cel

TIN SILVER COPPER

YES

BOTTOM

YES

2.55 mm

8388608

27 mm

544K

INCLUDES GTM104, ETHERNET SUPPORT, 74KB(ADDITIONAL RAM)

DMA(128), TIMER(8), WDT(4)

32

40 MHz

40

260

27 mm

413696

CMOS

12-Ch 12-Bit, 10-Ch 16-Bit

1.325 V

NO

CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3)

FLASH

1 mm

S-PBGA-B416

3

300 rpm

e1

8

0

SPC5777MK0MVU8

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.38 V

ISO 26262

32

NO

32

GRID ARRAY

1.19 V

125 Cel

-40 Cel

TIN SILVER COPPER

YES

BOTTOM

YES

2.55 mm

8388608

27 mm

544K

INCLUDES GTM104, ETHERNET SUPPORT, 74KB(ADDITIONAL RAM)

DMA(128), TIMER(8), WDT(4)

32

40 MHz

40

260

27 mm

413696

CMOS

12-Ch 12-Bit, 10-Ch 16-Bit

1.325 V

NO

CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3)

FLASH

1 mm

S-PBGA-B416

3

300 rpm

e1

8

0

TC1796256F150EBEKDUMA2

Infineon Technologies

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

24

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.42 V

125 Cel

-40 Cel

TIN SILVER COPPER

YES

BOTTOM

YES

2.5 mm

2097152

27 mm

128K

DMA(16), TIMER(2)

32

40 MHz

27 mm

65536

CMOS

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

1.5 V

NO

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

FLASH

1 mm

S-PBGA-B416

3

150 rpm

e1

8

127

TC1796256F150EBEKXUMA2

Infineon Technologies

MICROCONTROLLER

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

24

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.42 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.5 mm

2097152

27 mm

128K

DMA(16), TIMER(2)

32

40 MHz

30

260

27 mm

65536

CMOS

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

1.5 V

NO

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

FLASH

1 mm

S-PBGA-B416

3

150 rpm

8

127

SPC5674FAMVR3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.55 mm

4194304

27 mm

0

DMA(96), POR, PWM(32), TIMER(64)

0

40 MHz

40

260

27 mm

262144

CMOS

64-Ch 12-Bit

1.2 V

YES

CAN(4), SCI(3), SPI(4)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5674FAMVR3

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.55 mm

4194304

27 mm

0

DMA(96), POR, PWM(32), TIMER(64)

0

40 MHz

40

260

27 mm

262144

CMOS

64-Ch 12-Bit

1.2 V

YES

CAN(4), SCI(3), SPI(4)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

TC1793F512F270EFABKXUMA2

Infineon Technologies

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.43 V

32

NO

32

GRID ARRAY

1.17 V

125 Cel

-40 Cel

TIN SILVER COPPER

YES

BOTTOM

YES

2.15 mm

4194304

27 mm

192K

DMA(24), POR, TIMER(3)

32

40 MHz

27 mm

294912

CMOS

44-Ch 12-Bit, 4-Ch 10-Bit

1.3 V

NO

ASC, CAN(4), MLI, SENT, SSC(2)

FLASH

1 mm

S-PBGA-B416

3

270 rpm

e1

8

221

TC1796256F150EBCKDUMA1

Infineon Technologies

MICROCONTROLLER

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

24

NO

32

GRID ARRAY

1.42 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.5 mm

2097152

27 mm

128K

DMA(16), POR, TIMER(4), WDT

32

40 MHz

NOT SPECIFIED

NOT SPECIFIED

27 mm

196608

CMOS

32-Ch 12-Bit, FADC 4-Ch 10-Bit

1.5 V

NO

ASC(2), CAN(4), MLI(2), MSC(2), SSC(2)

FLASH

1 mm

S-PBGA-B416

150 rpm

8

127

TC1797384F150EACKDUMA1

Infineon Technologies

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

32

NO

32

GRID ARRAY

1.42 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.5 mm

3145728

27 mm

64K

DMA(16), POR, TIMER(4), WDT

32

40 MHz

NOT SPECIFIED

NOT SPECIFIED

27 mm

180224

CMOS

44-Ch 12-Bit, FADC 4-Ch 10-Bit

1.5 V

NO

ASC(2), CAN(4), MLI(2), MSC(2), SSC(2)

FLASH

1 mm

S-PBGA-B416

180 rpm

8

221

TC1797384F150EACKXUMA1

Infineon Technologies

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.58 V

32

NO

32

GRID ARRAY

1.42 V

125 Cel

-40 Cel

YES

BOTTOM

YES

2.5 mm

3145728

27 mm

64K

DMA(16), POR, TIMER(4), WDT

32

40 MHz

NOT SPECIFIED

NOT SPECIFIED

27 mm

180224

CMOS

44-Ch 12-Bit, FADC 4-Ch 10-Bit

1.5 V

NO

ASC(2), CAN(4), MLI(2), MSC(2), SSC(2)

FLASH

1 mm

S-PBGA-B416

180 rpm

8

221

SPC5777CAK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CAK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CDK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CDK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CLK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CLK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CRK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CSK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5777CSK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC

AUTOMOTIVE

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

0

NO

32

GRID ARRAY

1.2 V

125 Cel

-40 Cel

TIN SILVER

YES

BOTTOM

YES

2.02 mm

8388608

27 mm

0

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

DMA(128), PWM, TEMPERATURE SENSOR

0

40 MHz

40

260

27 mm

524288

CMOS

YES

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

FLASH

1 mm

S-PBGA-B416

3

264 rpm

e2

8

SPC5645SF1CVU

NXP Semiconductors

MICROCONTROLLER, RISC

BALL

416

BGA

SQUARE

YES

1.32 V

0

32

GRID ARRAY

1.08 V

Tin/Silver (Sn/Ag)

YES

BOTTOM

YES

27 mm

0

16 MHz

40

260

27 mm

1.2 V

YES

1 mm

3

125 rpm

e2

177

SPC5777CDK3MME4R

NXP Semiconductors

MICROCONTROLLER, RISC

BALL

416

BGA

SQUARE

YES

1.32 V

0

32

GRID ARRAY

1.2 V

TIN SILVER

YES

BOTTOM

YES

27 mm

0

40 MHz

40

260

27 mm

YES

1 mm

3

264 rpm

e2

SPC5777CDK3MME4

NXP Semiconductors

MICROCONTROLLER, RISC

BALL

416

BGA

SQUARE

YES

1.32 V

0

32

GRID ARRAY

1.2 V

TIN SILVER

YES

BOTTOM

YES

27 mm

0

40 MHz

40

260

27 mm

YES

1 mm

3

264 rpm

e2

SAL-TC298TP-128F300NBC

Infineon Technologies

MICROCONTROLLER

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.43 V

8

ISO 26262

NO

32

GRID ARRAY

BGA416,26X26,40

1.235 V

150 Cel

TC29X

-40 Cel

NICKEL GOLD

YES

BOTTOM

YES

2.15 mm

8388608

27 mm

131072

YES

DMA(128), POR, RTC, TIMER(3), WDT

40 MHz

27 mm

3

745472

CMOS

94-Ch 12-Bit

290 mA

1.3 V

128

YES

ASCLIN(4), CAN(6), I2C(2), I2S, LIN(6), PSI5(5), PSI5S, SPI,(4), QSPI(5)

FLASH

1 mm

FLOATING-POINT

S-PBGA-B416

3

300 rpm

YES

e4

8

Microcontrollers

A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.

Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.

Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.

One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.