| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
1.2 V |
105 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.41 mm |
2097152 |
11 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
11 mm |
64 |
262144 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B100 |
3 |
160 rpm |
YES |
e2 |
8 |
65 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
1.2 V |
105 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.41 mm |
3145728 |
11 mm |
65536 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
11 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B100 |
3 |
160 rpm |
YES |
e2 |
8 |
65 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.2 V |
125 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.7 mm |
3145728 |
17 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
17 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
160 rpm |
YES |
e2 |
8 |
178 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.2 V |
85 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.7 mm |
3145728 |
17 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
17 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
160 rpm |
YES |
e2 |
8 |
178 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.2 V |
125 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.7 mm |
3145728 |
17 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
17 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
160 rpm |
YES |
e2 |
8 |
178 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.2 V |
125 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.7 mm |
3145728 |
17 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
17 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
160 rpm |
YES |
e2 |
8 |
178 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.2 V |
125 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.7 mm |
3145728 |
17 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
17 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
160 rpm |
YES |
e2 |
8 |
178 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
1.2 V |
125 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.41 mm |
3145728 |
11 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
11 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B100 |
3 |
160 rpm |
YES |
e2 |
8 |
65 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.2 V |
125 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.7 mm |
3145728 |
17 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
17 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
160 rpm |
YES |
e2 |
8 |
178 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.2 V |
105 Cel |
E200Z4 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.7 mm |
3145728 |
17 mm |
131072 |
YES |
ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT |
0 |
40 MHz |
40 |
260 |
17 mm |
64 |
393216 |
CMOS |
31-Ch 12-Bit, 68-Ch 10-Bit |
264 mA |
1.25 V |
32 |
NO |
DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
120 rpm |
YES |
e2 |
8 |
178 |
|||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
8 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
2097152 |
12 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
16 |
25 MHz |
260 |
12 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
137 |
|||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
8 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
4194304 |
12 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
16 |
25 MHz |
30 |
260 |
12 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
e1 |
8 |
137 |
||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
100 |
TFBGA |
SQUARE |
YES |
3.6 V |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
9 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
0 |
25 MHz |
260 |
9 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
64 |
||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
12 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
0 |
25 MHz |
260 |
12 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
145 |
||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
8 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
2097152 |
12 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
16 |
25 MHz |
260 |
12 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
137 |
|||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
8 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
4194304 |
12 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
16 |
25 MHz |
260 |
12 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
137 |
|||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
12 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
0 |
25 MHz |
260 |
12 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
145 |
||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY |
BGA516,26X26,40 |
1.2 V |
105 Cel |
CORTEX-A5/M4/M0 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
3145728 |
27 mm |
0 |
YES |
COMPARATOR(2), RTC, TIMER(48), WDT(3) |
0 |
40 MHz |
40 |
260 |
27 mm |
7 |
2411724 |
CMOS |
24-Ch 12-Bit |
1.25 V |
32 |
YES |
0 |
CAN(3), ETHERNET, I2C(2), SPI(5) |
FLASH |
1 mm |
FLOATING-POINT |
S-PBGA-B516 |
3 |
320 rpm |
YES |
e2 |
8 |
||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY |
BGA516,26X26,40 |
1.2 V |
105 Cel |
CORTEX-A5/M4/M0 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
3145728 |
27 mm |
0 |
YES |
COMPARATOR(2), RTC, TIMER(48), WDT(3) |
0 |
40 MHz |
40 |
260 |
27 mm |
7 |
2411724 |
CMOS |
24-Ch 12-Bit |
1.25 V |
32 |
YES |
0 |
CAN(3), ETHERNET, I2C(2), SPI(5) |
FLASH |
1 mm |
FLOATING-POINT |
S-PBGA-B516 |
3 |
320 rpm |
YES |
e2 |
8 |
||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY |
BGA516,26X26,40 |
1.2 V |
105 Cel |
CORTEX-A5/M4/M0 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
4194304 |
27 mm |
0 |
YES |
COMPARATOR(2), RTC, TIMER(48), WDT(3) |
0 |
40 MHz |
40 |
260 |
27 mm |
7 |
2411724 |
CMOS |
24-Ch 12-Bit |
1.25 V |
32 |
YES |
0 |
CAN(3), ETHERNET, I2C(2), SPI(5) |
FLASH |
1 mm |
FLOATING-POINT |
S-PBGA-B516 |
3 |
320 rpm |
YES |
e2 |
8 |
||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY |
BGA516,26X26,40 |
1.2 V |
105 Cel |
CORTEX-A5/M4/M0 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
4194304 |
27 mm |
0 |
YES |
COMPARATOR(2), RTC, TIMER(48), WDT(3) |
0 |
40 MHz |
40 |
260 |
27 mm |
7 |
2411724 |
CMOS |
24-Ch 12-Bit |
1.25 V |
32 |
YES |
0 |
CAN(3), ETHERNET, I2C(2), SPI(5) |
FLASH |
1 mm |
FLOATING-POINT |
S-PBGA-B516 |
3 |
320 rpm |
YES |
e2 |
8 |
||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
416 |
BGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY |
1.2 V |
TIN SILVER |
YES |
BOTTOM |
YES |
27 mm |
0 |
40 MHz |
40 |
260 |
27 mm |
YES |
1 mm |
3 |
264 rpm |
e2 |
||||||||||||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
416 |
BGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY |
1.2 V |
TIN SILVER |
YES |
BOTTOM |
YES |
27 mm |
0 |
40 MHz |
40 |
260 |
27 mm |
YES |
1 mm |
3 |
264 rpm |
e2 |
||||||||||||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY |
1.2 V |
TIN SILVER |
YES |
BOTTOM |
YES |
27 mm |
0 |
40 MHz |
40 |
260 |
27 mm |
YES |
1 mm |
3 |
264 rpm |
e2 |
||||||||||||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY |
1.2 V |
TIN SILVER |
YES |
BOTTOM |
YES |
27 mm |
0 |
40 MHz |
40 |
260 |
27 mm |
YES |
1 mm |
3 |
264 rpm |
e2 |
||||||||||||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
176 |
VFBGA |
SQUARE |
YES |
3.6 V |
32 |
YES |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
12-Ch 12-Bit |
1310720 |
9 mm |
0 |
DMA(16), POR, RTC, TIMER(27), WDT |
32 |
72 MHz |
40 |
260 |
9 mm |
393216 |
12-Ch 12-Bit |
3.3 V |
YES |
I2C(4), I2S, SPI(4), UART(4), USB |
FLASH |
.5 mm |
3 |
72 rpm |
8 |
104 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROCONTROLLER, RISC |
MILITARY |
BALL |
337 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
125 Cel |
CORTEX-R5F |
-55 Cel |
Tin/Lead (Sn/Pb) |
YES |
BOTTOM |
YES |
1.4 mm |
16 mm |
0 |
80 MHz |
NOT SPECIFIED |
220 |
16 mm |
524288 |
CMOS |
1.2 V |
YES |
FLASH |
.8 mm |
S-PBGA-B337 |
3 |
300 rpm |
e0 |
8 |
145 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
84 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
TS 16949 |
0 |
NO |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2 V |
85 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
.8 mm |
7 mm |
0 |
7 mm |
CMOS |
3 V |
YES |
.65 mm |
S-PBGA-B84 |
48 rpm |
65 |
||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
.533 mm |
1048576 |
262144 |
3.513 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
30 |
260 |
3.593 mm |
13 |
262144 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.4 mm |
FLOATING POINT |
R-PBGA-B64 |
120 rpm |
YES |
e3 |
8 |
51 |
||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
120 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
1.2 mm |
524288 |
196608 |
8 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
30 |
260 |
8 mm |
13 |
196608 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B120 |
120 rpm |
YES |
e3 |
8 |
90 |
||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
120 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
1.2 mm |
1048576 |
262144 |
8 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
30 |
260 |
8 mm |
13 |
262144 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B120 |
120 rpm |
YES |
e3 |
8 |
90 |
||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
120 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
1.2 mm |
524288 |
196608 |
8 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
30 |
260 |
8 mm |
13 |
196608 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B120 |
120 rpm |
YES |
e3 |
8 |
90 |
||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
120 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
1.2 mm |
1048576 |
262144 |
8 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
30 |
260 |
8 mm |
13 |
262144 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B120 |
120 rpm |
YES |
e3 |
8 |
90 |
||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.8 V |
YES |
BOTTOM |
NO |
1.1 mm |
4.5 mm |
0 |
25 MHz |
4.5 mm |
CMOS |
3.3 V |
NO |
FLASH |
.5 mm |
S-PBGA-B48 |
50 rpm |
42 |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
24 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.65 V |
YES |
BOTTOM |
NO |
1.2 mm |
12 mm |
ALSO REQUIRES 3.3 V SUPPLY |
32 |
50 MHz |
12 mm |
CMOS |
1.8 V |
YES |
.8 mm |
S-PBGA-B144 |
60 rpm |
76 |
||||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
.533 mm |
1048576 |
262144 |
3.513 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
3.593 mm |
13 |
262144 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.4 mm |
FLOATING POINT |
R-PBGA-B64 |
120 rpm |
YES |
e3 |
8 |
51 |
||||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
120 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
AEC-Q100; ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
125 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
1.2 mm |
524288 |
196608 |
8 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
8 mm |
13 |
196608 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B120 |
100 rpm |
YES |
e3 |
8 |
90 |
||||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
120 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
AEC-Q100; ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
125 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
1.2 mm |
1048576 |
262144 |
8 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
8 mm |
13 |
262144 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B120 |
100 rpm |
YES |
e3 |
8 |
90 |
||||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
120 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
8 |
AEC-Q100; ISO/TS-16949 |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
125 Cel |
CORTEX-M4F |
16 |
-40 Cel |
MATTE TIN |
YES |
BOTTOM |
YES |
2 Ch 12-Bit |
1.2 mm |
524288 |
196608 |
8 mm |
0 |
NO |
BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT |
0 |
48 MHz |
8 mm |
13 |
196608 |
CMOS |
16-Ch 12-Bit |
60 mA |
3.3 V |
32 |
YES |
CAN(2), ETHERNET, I2C, LIN, QSPI, USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B120 |
100 rpm |
YES |
e3 |
8 |
90 |
||||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
TS 16949 |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
2.3 V |
105 Cel |
PIC32 |
5 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
131072 |
10 mm |
0 |
YES |
BOR, COMPARATOR(2), DMA(4), POR, RTCC, TIMER(7), WDT |
0 |
50 MHz |
30 |
260 |
10 mm |
7 |
32768 |
CMOS |
16-Ch 10-Bit |
100 mA |
3.3 V |
4 |
YES |
2 |
EUSART(2), I2C(2), SPI(2), USB |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B121 |
80 rpm |
YES |
e1 |
8 |
85 |
||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
TS 16949 |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
2.3 V |
105 Cel |
PIC32 |
5 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
524288 |
10 mm |
0 |
YES |
BOR, COMPARATOR(2), DMA(4), POR, RTCC, TIMER(7), WDT |
0 |
50 MHz |
30 |
260 |
10 mm |
7 |
32768 |
CMOS |
16-Ch 10-Bit |
100 mA |
3.3 V |
4 |
YES |
2 |
EUSART(2), I2C(2), SPI(2), USB |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B121 |
80 rpm |
YES |
e1 |
8 |
85 |
||||||||||||||
|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
TS 16949 |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
2.3 V |
105 Cel |
PIC32 |
5 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
524288 |
10 mm |
0 |
YES |
BOR, COMPARATOR(2), DMA(4), POR, RTCC, TIMER(7), WDT |
0 |
50 MHz |
30 |
260 |
10 mm |
7 |
32768 |
CMOS |
16-Ch 10-Bit |
100 mA |
3.3 V |
4 |
YES |
2 |
EUSART(2), I2C(2), SPI(2), USB |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B121 |
80 rpm |
YES |
e1 |
8 |
85 |
||||||||||||||
|
|
Infineon Technologies |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
292 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
2.97 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.7 mm |
17 mm |
IT ALSO OPERATES AT 5V NOM SUPPLY |
0 |
160 MHz |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
.8 mm |
S-PBGA-B292 |
3 |
160 rpm |
8 |
||||||||||||||||||||||||||||||||||||
|
|
Infineon Technologies |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
292 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
2.97 V |
150 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1.7 mm |
17 mm |
IT ALSO OPERATES AT 5V NOM SUPPLY |
0 |
160 MHz |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
.8 mm |
S-PBGA-B292 |
3 |
160 rpm |
e2 |
8 |
||||||||||||||||||||||||||||||||||
|
|
Infineon Technologies |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
180 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
NO |
32 |
GRID ARRAY |
125 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
12 mm |
ALSO AVAILABLE WITH 5 V NOMINAL |
0 |
12 mm |
CMOS |
3.3 V |
YES |
FLASH |
.8 mm |
R-PBGA-B180 |
3 |
200 rpm |
e2 |
8 |
||||||||||||||||||||||||||||||||||||||
|
|
Infineon Technologies |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
180 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
NO |
32 |
GRID ARRAY |
125 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
12 mm |
ALSO AVAILABLE WITH 5 V NOMINAL |
0 |
12 mm |
CMOS |
3.3 V |
YES |
FLASH |
.8 mm |
R-PBGA-B180 |
3 |
300 rpm |
e2 |
8 |
||||||||||||||||||||||||||||||||||||||
|
|
Infineon Technologies |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
180 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
NO |
32 |
GRID ARRAY |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
12 mm |
ALSO AVAILABLE WITH 5 V NOMINAL |
0 |
12 mm |
CMOS |
3.3 V |
YES |
FLASH |
.8 mm |
R-PBGA-B180 |
3 |
200 rpm |
8 |
||||||||||||||||||||||||||||||||||||||||
|
|
Infineon Technologies |
MICROCONTROLLER |
BALL |
180 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
NO |
32 |
GRID ARRAY |
YES |
BOTTOM |
YES |
12 mm |
ALSO AVAILABLE WITH 5 V NOMINAL |
0 |
12 mm |
CMOS |
3.3 V |
YES |
FLASH |
.8 mm |
R-PBGA-B180 |
3 |
200 rpm |
8 |
A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.
Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.
Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.
One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.