624 Microprocessors 31

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
MCIMX6D6AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES			32	GRID ARRAY, FINE PITCH		125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	64-BIT BUS WIDTH AVAILABLE	YES		40	260	21 mm	CMOS		.8 mm	FIXED POINT	S-PBGA-B624	3	1000 rpm	NO	e1
PCIMX6Q6AVT10AC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY		YES			32	GRID ARRAY, HEAT SINK/SLUG				TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3	1000 rpm		e1
MCIMX6DP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32	GRID ARRAY, FINE PITCH	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6DP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32	GRID ARRAY, FINE PITCH	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6QP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32	GRID ARRAY, FINE PITCH	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6QP4AVT8AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32	GRID ARRAY, FINE PITCH	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS	1.4 V	.8 mm	FLOATING POINT	S-PBGA-B624	3	852 rpm	YES	e1
MCIMX6QP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26	32	GRID ARRAY, FINE PITCH	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6S1AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6S4AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6S6AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6U1AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6U4AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6U6AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6Q4AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	32	GRID ARRAY, FINE PITCH	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6DP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, FINE PITCH	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6QP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, FINE PITCH	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6QP4AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, FINE PITCH	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6QP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, FINE PITCH	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6QP6AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V			GRID ARRAY, FINE PITCH	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS		.8 mm		S-PBGA-B624	3			e1
MCIMX6S1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6S4AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S4AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6S6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6U1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6U1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6U4AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6U4AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6U6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6U6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH	1.4 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	40	260	21 mm	CMOS		.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.