HBGA Microprocessors 38

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8569EVTAUNLB	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32	1.1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.067 V			TIN SILVER COPPER OVER NICKEL	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz	30	245	29 mm	CMOS	1.1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1333 rpm	YES
MPC5123VY400B	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS	1.4 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8544CVTALF	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V			TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	0	133 MHz	40	260	29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8544CVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V			TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	0	133 MHz	40	260	29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
D6417750RBA240HVU0	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	26	32		GRID ARRAY, HEAT SINK/SLUG		1.35 V	85 Cel	-40 Cel		BOTTOM	2.6 mm	27 mm		YES	64	34 MHz			27 mm	CMOS	1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B256	3		240 rpm	YES
PCIMX6Q6AVT10AC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY		YES			32		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm					40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3		1000 rpm		e1
T4081NSE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
T4081NSE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
T4081NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4081NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
T4081NSN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
T4081NSN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4081NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
T4081NXE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
T4081NXE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4081NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
T4081NXN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
T4081NXN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4160NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4160NSN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4161NSE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
T4161NSE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
T4161NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4161NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
T4161NSN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
T4161NSN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4161NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
T4161NXE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
T4161NXE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
T4161NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
T4161NXN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
T4161NXN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
LS1046ASE8Q1A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	HBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm					30	250	23 mm	CMOS				.8 mm		S-PBGA-B780	3		64 rpm		e1
MC8640HJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel	0 Cel		BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	1.05 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO
MC8640DTHJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel	-40 Cel		BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	1.05 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO
MC8640DHJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel	0 Cel		BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	.95 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.