LBGA Microprocessors 10

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MCF5328CVM240J

Freescale Semiconductor

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

1.5,1.8/3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

1.4 V

85 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

1.6 mm

17 mm

YES

32

80 MHz

40

260

17 mm

CMOS

1.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

240 rpm

YES

MCF5208CVM166J

Freescale Semiconductor

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

1.5,1.8/3.3

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1.4 V

85 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

1.6 mm

15 mm

YES

32

40 MHz

40

260

15 mm

CMOS

1.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

166.67 rpm

YES

MCF5232CVM150J

Freescale Semiconductor

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

1.5,3.3

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1.4 V

85 Cel

COLDFIRE

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

1.6 mm

15 mm

YES

32

40

260

15 mm

65536

CMOS

150 mA

Microcontrollers

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

150 rpm

YES

MCF5270VM100J

Freescale Semiconductor

MICROPROCESSOR, RISC

COMMERCIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

1.5,3.3

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1.4 V

70 Cel

0 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

1.6 mm

15 mm

YES

32

40

260

15 mm

CMOS

Microprocessors

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

100 rpm

YES

MCF5271CVM100J

Freescale Semiconductor

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

1.5,3.3

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1.4 V

85 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

1.6 mm

15 mm

YES

32

40

260

15 mm

CMOS

Microprocessors

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

100 rpm

YES

MCF54450VM240J

Freescale Semiconductor

MICROPROCESSOR, RISC

COMMERCIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

14

32

1.5,1.8,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

70 Cel

0 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

1.6 mm

17 mm

YES

16

40

260

17 mm

CMOS

Microprocessors

1 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

240 rpm

YES

KMPC8347VVAJFB

Freescale Semiconductor

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, LOW PROFILE

1.14 V

105 Cel

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

40

260

35 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B672

3

Not Qualified

533 rpm

YES

e2

GCIXP1250BC

Intel

MICROPROCESSOR, RISC

COMMERCIAL

BALL

520

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.1 V

32

32

GRID ARRAY, LOW PROFILE

1.9 V

70 Cel

0 Cel

BOTTOM

1.7 mm

40 mm

YES

32

232 MHz

NOT SPECIFIED

NOT SPECIFIED

40 mm

CMOS

2 V

1.27 mm

FIXED POINT

S-PBGA-B520

Not Qualified

232 rpm

NO

GCIXP1200GA

Intel

MICROPROCESSOR, RISC

COMMERCIAL

BALL

432

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.1 V

32

32

2,3.3

GRID ARRAY, LOW PROFILE

BGA432,31X31,50

1.9 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

1.67 mm

40 mm

YES

32

166 MHz

40 mm

CMOS

2 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B432

Not Qualified

166 rpm

NO

e0

KMPC8270CZUQLDA

Freescale Semiconductor

MICROPROCESSOR, RISC

BALL

480

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY, LOW PROFILE

1.45 V

BOTTOM

1.65 mm

37.5 mm

YES

64

83.33 MHz

40

260

37.5 mm

CMOS

1.5 V

1.27 mm

FLOATING POINT

S-PBGA-B480

4

Not Qualified

333 rpm

NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.