| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
16 |
IN-LINE |
DIP64,.9 |
70 Cel |
0 Cel |
DUAL |
MOS |
Microprocessors |
2.54 mm |
R-XDIP-T64 |
Not Qualified |
3.3 rpm |
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|
IXYS Corporation |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
32 |
32 |
5 |
FLATPACK |
QFP100,.7X.9 |
4.75 V |
70 Cel |
5 |
0 Cel |
TIN LEAD |
QUAD |
3.1 mm |
0 |
14 mm |
DYNAMIC BUS SIZING; DRAM REFRESH CONTROLLER |
NO |
16 |
18 MHz |
240 |
20 mm |
CMOS |
5 V |
0 |
0 |
Microprocessors |
.65 mm |
FIXED POINT |
R-PQFP-G100 |
Not Qualified |
18 rpm |
YES |
e0 |
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|
|
IXYS Corporation |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
64 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
20 |
8 |
IN-LINE, SHRINK PITCH |
SDIP64,.75 |
4.5 V |
70 Cel |
3 |
0 Cel |
MATTE TIN |
DUAL |
5.01 mm |
19.05 mm |
DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY |
NO |
8 |
57.785 mm |
CMOS |
60 mA |
5 V |
2 |
2 |
1.778 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
10 rpm |
YES |
e3 |
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|
|
IXYS Corporation |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
20 |
8 |
FLATPACK |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
3.1 mm |
14 mm |
DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY |
NO |
8 |
20 mm |
CMOS |
60 mA |
5 V |
.8 mm |
FIXED POINT |
R-PQFP-G80 |
Not Qualified |
10 rpm |
YES |
e3 |
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|
|
IXYS Corporation |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
0 |
16 |
8 |
IN-LINE |
4.5 V |
100 Cel |
2 |
-40 Cel |
MATTE TIN |
DUAL |
4.75 mm |
0 |
15.24 mm |
DRAM REFRESH COUNTER |
NO |
8 |
6.17 MHz |
52.325 mm |
CMOS |
30 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
6.17 rpm |
YES |
e3 |
||||||||||||||||||||||||
|
|
IXYS Corporation |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
0 |
16 |
8 |
IN-LINE |
4.5 V |
100 Cel |
2 |
-40 Cel |
MATTE TIN |
DUAL |
4.75 mm |
0 |
15.24 mm |
DRAM REFRESH COUNTER |
NO |
8 |
8 MHz |
52.325 mm |
CMOS |
40 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
8 rpm |
YES |
e3 |
||||||||||||||||||||||||
|
|
IXYS Corporation |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
0 |
16 |
8 |
IN-LINE |
4.5 V |
100 Cel |
2 |
-40 Cel |
MATTE TIN |
DUAL |
4.75 mm |
0 |
15.24 mm |
DRAM REFRESH COUNTER |
NO |
8 |
10 MHz |
52.325 mm |
CMOS |
50 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
10 rpm |
YES |
e3 |
||||||||||||||||||||||||
|
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
233 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA233,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
14 mm |
1-Gbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
16 |
.8 mm |
FIXED POINT |
R-PBGA-B233 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
233 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA233,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
14 mm |
512-Mbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
16 |
.8 mm |
FIXED POINT |
R-PBGA-B233 |
3 |
600 rpm |
YES |
e1 |
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|
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,16X16,25 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
11 mm |
64-Mbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
11 mm |
CMOS |
1.8 V |
16 |
.65 mm |
FIXED POINT |
R-PBGA-B196 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,16X16,25 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
11 mm |
64-Mbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
11 mm |
CMOS |
1.8 V |
16 |
.65 mm |
FIXED POINT |
R-PBGA-B196 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.62 mm |
40 mm |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
R-PBGA-B1517 |
4 |
e1 |
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|
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
233 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA233,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
14 mm |
512-Mbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
16 |
.8 mm |
FIXED POINT |
R-PBGA-B233 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
|
Microchip Technology |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
0 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
70 Cel |
0 Cel |
DUAL |
1.1 mm |
4.4 mm |
NO |
0 |
9.7 mm |
CMOS |
3.3 V |
.65 mm |
FIXED POINT |
R-PDSO-G28 |
NO |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.