COMMERCIAL Microprocessors 37

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
HD6417705F133BV	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES				32	1.5,3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel		-20 Cel		QUAD											CMOS	200 mA				Microprocessors	.5 mm		S-PQFP-G208		Not Qualified	133 rpm
HD6417727BP100CV	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	240	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.05 V	8	26	32	1.9,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,19X19,25	1.6 V	70 Cel	6	-20 Cel		BOTTOM	1.4 mm	16384	13 mm		YES	32	50 MHz			13 mm	CMOS	450 mA	1.9 V	4	3	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B240		Not Qualified	100 rpm	YES
ADSP-21488KSWZ-3A1	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
ADSP-21488KSWZ-3A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
ADSP-21488KSWZ-3B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
ADSP-21488KSWZ-4A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	400 rpm	NO	e3
ADSP-21488KSWZ-4B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
ADSP-21489KSWZ-3A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
ADSP-21489KSWZ-3B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
ADSP-21489KSWZ-4B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
MCF5270VM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MCF54450VM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		17 mm		YES	16		40	260	17 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES
OMAP3525ECBC	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20		70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	.95 mm		14 mm					30	260	14 mm	CMOS					Graphics Processors	.5 mm		S-PBGA-B515	3	Not Qualified			e1
ADSP-21488KSWZ-4B1	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		400 rpm	NO	e3
ADSP-21489KSWZ-5B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		450 rpm	NO	e3
ADSP-BF606KBCZ-4	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	400 rpm	YES	e1
ADSP-BF607KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF608KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF609KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel		BOTTOM	1.5 mm		19 mm		YES		60 MHz	NOT SPECIFIED	NOT SPECIFIED	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349		Not Qualified	500 rpm	YES
SB80L186EC-13	Intel	MICROPROCESSOR	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20	16	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	2.7 V	70 Cel	9	0 Cel	TIN LEAD	QUAD	1.66 mm	0	14 mm		NO	16	26 MHz			14 mm	CMOS	36 mA	3 V	4	2	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified	13 rpm	YES	e0
TMS9900JDL	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	CERAMIC		NO				16		IN-LINE	DIP64,.9		70 Cel		0 Cel		DUAL											MOS					Microprocessors	2.54 mm		R-XDIP-T64		Not Qualified	3.3 rpm
Z8038018FSC	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.25 V	0	32	32	5	FLATPACK	QFP100,.7X.9	4.75 V	70 Cel	5	0 Cel	TIN LEAD	QUAD	3.1 mm	0	14 mm	DYNAMIC BUS SIZING; DRAM REFRESH CONTROLLER	NO	16	18 MHz		240	20 mm	CMOS		5 V	0	0	Microprocessors	.65 mm	FIXED POINT	R-PQFP-G100		Not Qualified	18 rpm	YES	e0
MPC5123VY400B	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
GCIXP1250BC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	520	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel		0 Cel		BOTTOM	1.7 mm		40 mm		YES	32	232 MHz	NOT SPECIFIED	NOT SPECIFIED	40 mm	CMOS		2 V				1.27 mm	FIXED POINT	S-PBGA-B520		Not Qualified	232 rpm	NO
GCIXP1200GA	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	432	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA432,31X31,50	1.9 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.67 mm		40 mm		YES	32	166 MHz			40 mm	CMOS		2 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B432		Not Qualified	166 rpm	NO	e0
KMPC8270VRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MC68HC000EI16	Freescale Semiconductor	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	16		CHIP CARRIER		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	4.57 mm		24.2 mm		NO	16	20 MHz	30	245	24.2 mm	HCMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68	3		20 rpm	YES	e3
MC68HC000EI8	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	25 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
MC68EC000EI10	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	30 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	2	Not Qualified	10 rpm		e3
MC68HC000EI8R2	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	25 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
Z8018010PSG	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V		20	8		IN-LINE, SHRINK PITCH	SDIP64,.75	4.5 V	70 Cel	3	0 Cel	MATTE TIN	DUAL	5.01 mm		19.05 mm	DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY	NO	8				57.785 mm	CMOS	60 mA	5 V	2	2		1.778 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	YES	e3
Z8018010FSG	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES			20	8		FLATPACK			70 Cel		0 Cel	MATTE TIN	QUAD	3.1 mm		14 mm	DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY	NO	8				20 mm	CMOS	60 mA	5 V				.8 mm	FIXED POINT	R-PQFP-G80		Not Qualified	10 rpm	YES	e3
AM5746ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5748ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5749ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AT97SC3205T-G3M4C20B	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES			0	8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		70 Cel		0 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQCC-N32				NO
AT97SC3205T-X3A1C-10	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES			0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		70 Cel		0 Cel		DUAL	1.1 mm		4.4 mm		NO	0				9.7 mm	CMOS		3.3 V				.65 mm	FIXED POINT	R-PDSO-G28				NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.