Microchip Technology Microprocessors 27

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
ATSAMA5D27C-LD1G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32		0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1	.8 mm	FIXED POINT	S-PBGA-G361		500 rpm	YES
ATSAMA5D27C-LD1G-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32		0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1	.8 mm	FIXED POINT	S-PBGA-G361		500 rpm	YES
ATSAMA5D27C-LD2G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32		0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1	.8 mm	FIXED POINT	S-PBGA-G361		500 rpm	YES
SAM9X60D1G-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	1-Gbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16		.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
SAM9X60D5MT-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16		.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
SAM9X60D6K-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm	CMOS		1.8 V	16		.65 mm	FIXED POINT	R-PBGA-B196	3	600 rpm	YES	e1
SAM9X60D6KT-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm	CMOS		1.8 V	16		.65 mm	FIXED POINT	R-PBGA-B196	3	600 rpm	YES	e1
AT91SAM9260B-CU-100	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	1.65 V	85 Cel	3	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	8192	15 mm		YES	32	50 MHz			15 mm	CMOS		1.8 V	22		.8 mm	FIXED POINT	S-PBGA-B217		210 rpm	YES	e1
AT91SAM9263B-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	98304	15 mm		YES	32	50 MHz			15 mm	CMOS	73.3 mA	1.2 V	22		.8 mm	FIXED POINT	S-PBGA-B324		240 rpm	YES	e1
ATSAMA5D22C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32		.75 mm	FLOATING POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D22C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32		.75 mm	FLOATING POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D22C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32		.75 mm	FLOATING POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D26C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32		.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D26C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32		.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D27C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32		.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D27C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32		.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D225C-D1M-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16		0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	65536	11 mm		YES	0	24 MHz			11 mm	CMOS		1.2 V	51	1	.75 mm	FIXED POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D41B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm		YES	16	50 MHz			14 mm	CMOS		1.26 V	32	2	.8 mm	FLOATING POINT	S-PBGA-B289		600 rpm	YES
ATSAMA5D42B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2	.8 mm	FLOATING POINT	S-PBGA-B361		600 rpm	YES
ATSAMA5D44B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2	.8 mm	FLOATING POINT	S-PBGA-B361		600 rpm	YES
SAM9X60D5M-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16		.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
AT97SC3205T-G3M4C20B	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		70 Cel		0 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V			.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-H3M4C00B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V			.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-H3M4C10B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V			.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-X3A1C-10	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES				0	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		70 Cel		0 Cel		DUAL	1.1 mm		4.4 mm		NO	0				9.7 mm	CMOS		3.3 V			.65 mm	FIXED POINT	R-PDSO-G28			NO
AT91SAM9G45-CU-999	Microchip Technology	MICROPROCESSOR, RISC		BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	37	7	.8 mm	FIXED POINT	S-PBGA-B324		400 rpm	YES
AT91SAM9G45B-CU-999	Microchip Technology	MICROPROCESSOR, RISC		BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	37	7	.8 mm	FIXED POINT	S-PBGA-B324		400 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.