Texas Instruments Microprocessors 370

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
AM3351BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm			YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			23 mm			YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
X66AK2G02ZBB60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.95 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		.85 V	90 Cel		0 Cel		BOTTOM	1.7 mm			21 mm			YES	32	26 MHz			21 mm	CMOS		.9 V				.8 mm	FLOATING POINT	S-PBGA-B625		600 rpm	YES
AM5726BABCXAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			23 mm			YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			23 mm			YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			23 mm			YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			23 mm			YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			23 mm			YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			23 mm			YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			23 mm			YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM3351BZCEA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm			YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3	300 rpm	YES	e1
DM3725CBPDR100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			26		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.08 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm			12 mm			YES	16	54 MHz	30	260	12 mm	CMOS		1.14 V				.4 mm	FLOATING POINT	S-PBGA-B515	3	1000 rpm	YES	e1
DM383AAAR21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V			27	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm			16 mm			YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V				.5 mm	FLOATING POINT	S-PBGA-B609	3	1000 rpm	YES	e1
DM383AAAR21	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V			27	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm			16 mm			YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V				.5 mm	FLOATING POINT	S-PBGA-B609	3	1000 rpm	YES	e1
AM3351BZCE30R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm		ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3	300 rpm	YES	e1
AM3351BZCE60R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm			YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
HPSDM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm		1114112	23 mm			YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72			.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
MTDM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm		1114112	23 mm			YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72			.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
AM5718AZBOXEM	Texas Instruments	MICROPROCESSOR, RISC	MILITARY	BALL	760	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	8	AEC-Q100	16		GRID ARRAY		1.11 V	125 Cel		-55 Cel	TIN LEAD	BOTTOM			524288	23 mm		ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED	YES	32	32 MHz		250	23 mm	CMOS		1.15 V	1				FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e0
AM3358BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V			28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm		ALSO HAVING MULTIPLEXED 16 BIT ADDRESS	YES	16	26 MHz	30	260	13 mm	CMOS		1.1 V				.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
AMIC120BZDNA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	0	524288	17 mm	0	ALSO HAVING 28-BIT ADDRESS AND 16-BIT DATA OF GPMC	YES	32		30	260	17 mm	CMOS	600 mA	1.1 V	64	4	CAN, ETHERNET, I2C, SPI(2), UART, USB	.65 mm	FIXED POINT	S-PBGA-B491	3	300 rpm	YES	e1
66AK2H14DSAAWA24	Texas Instruments	MICROPROCESSOR, RISC																				TIN SILVER COPPER											30	245											4			e1
66AK2H05DAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.05 V					GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm			40 mm						30	245	40 mm	CMOS		1 V				1 mm		R-PBGA-B1517	4			e1
CP3CN37VVAWQX/NOPB	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.7 V			20		FLATPACK, LOW PROFILE, FINE PITCH		2.7 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm			20 mm			YES	16		30	260	20 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-PQFP-G144	3	96 rpm	YES	e3
AM6548BACDXEAF	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA784,28X28,32	1.05 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		2097152	23 mm			YES	16	27 MHz		250	23 mm	CMOS		1.1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B784	3	1100 rpm	YES	e1
AM6526BACDXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA784,28X28,32	1.05 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		2097152	23 mm			YES	16	27 MHz		250	23 mm	CMOS		1.1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B784	3	1100 rpm	YES	e1
AM6526BACDXEAF	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA784,28X28,32	1.05 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		2097152	23 mm			YES	16	27 MHz		250	23 mm	CMOS		1.1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B784	3	1100 rpm	YES	e1
AM6528BACDXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA784,28X28,32	1.05 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		2097152	23 mm			YES	16	27 MHz		250	23 mm	CMOS		1.1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B784	3	1100 rpm	YES	e1
TDA4VM88TGBALFR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		9961472	24 mm			YES	32	27 MHz		250	24 mm	CMOS		.8 V		26		.8 mm	FLOATING-POINT	S-PBGA-B827	3	2000 rpm	YES	e1
DRA829VMTGBALFR	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		3670016	24 mm			YES	32	27 MHz		250	24 mm	CMOS		.8 V		31		.8 mm	FIXED POINT	S-PBGA-B827	3	2000 rpm	YES	e1
TDA4VM88TGBALFRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		9961472	24 mm			YES	32	27 MHz		250	24 mm	CMOS		.8 V		26		.8 mm	FLOATING-POINT	S-PBGA-B827	3	2000 rpm	YES	e1
DRA829JMTGBALFR	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		9961472	24 mm			YES	32	27 MHz		250	24 mm	CMOS		.8 V		31		.8 mm	FIXED POINT	S-PBGA-B827	3	2000 rpm	YES	e1
DRA829JMTGBALFRQ1	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		9961472	24 mm			YES	32	27 MHz		250	24 mm	CMOS		.8 V		31		.8 mm	FIXED POINT	S-PBGA-B827	3	2000 rpm	YES	e1
AM6546BACDXA	Texas Instruments	MICROPROCESSOR, RISC		BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA784,28X28,32	1.05 V	105 Cel	1	-40 Cel		BOTTOM	1.63 mm		2097152	23 mm			YES	16	27 MHz		250	23 mm	CMOS		1.1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B784	3	1100 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.