Microprocessors

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
S9S08RNA8W2MLF	NXP Semiconductors	MICROPROCESSOR																			TIN									40	260										3			e3
S9S08RNA8W2MTGR	NXP Semiconductors	MICROPROCESSOR																			TIN									40	260										3			e3
S9S08RNA8W2MTG	NXP Semiconductors	MICROPROCESSOR																			TIN									40	260										3			e3
S9S08RNA8W2MTJ	NXP Semiconductors	MICROPROCESSOR																			TIN									40	260										3			e3
S9S08RNA8W2VLC	NXP Semiconductors	MICROPROCESSOR																			TIN									40	260										3			e3
S9S08RNA8W2VTGR	NXP Semiconductors	MICROPROCESSOR																			TIN									40	260										3			e3
S9S08RNA8W2VTG	NXP Semiconductors	MICROPROCESSOR																			TIN									40	260										3			e3
S9S08RNA8W2VTJ	NXP Semiconductors	MICROPROCESSOR																			TIN									40	260										3			e3
FS32V234CKN1VUBR	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER									40	260										3			e2
FS32V234CON1VUBR	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER									40	260										3			e2
MPC8544CVJANGA	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER									40	260										3			e2
MPC8544CVJAQGA	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER									40	260										3			e2
MPC8544VJALFA	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER									40	260										3			e2
MPC8544VJANGA	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER									40	260										3			e2
MPC8544VJAQGA	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER									40	260										3			e2
SAM9X60D5M-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16		.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
BSC9131NSN1KHKB,557	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V			.8 mm	FIXED POINT	S-PBGA-B520		1000 rpm	YES
P1014NSN5FFA,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32	GRID ARRAY, FINE PITCH		.95 V					BOTTOM	1.9 mm		19 mm		YES	0	100 MHz			19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B425		667 rpm	YES
P5010NXN7TNB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16		GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V			1 mm	FIXED POINT	S-PBGA-B1295		1800 rpm	YES
P5020NSN1QMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16		GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V			1 mm	FIXED POINT	S-PBGA-B1295		1600 rpm	YES
P5020NXN7QMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16		GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V			1 mm	FIXED POINT	S-PBGA-B1295		1600 rpm	YES
HD6417727X100CV	Renesas Electronics	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	2.05 V	8	26	32	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	1.6 V	75 Cel	6	-20 Cel		QUAD	3.95 mm	16384	32 mm		YES	32	50 MHz	NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS	450 mA	1.9 V	4	3	.5 mm	FIXED POINT	S-PQFP-G240		100 rpm	YES
HD6417727X160CV	Renesas Electronics	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	2.05 V	8	26	32	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	1.7 V	75 Cel	6	-20 Cel		QUAD	3.95 mm	16384	32 mm		YES	32	66.67 MHz	NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS	650 mA	1.9 V	4	3	.5 mm	FIXED POINT	S-PQFP-G240		160 rpm	YES
MIMXRT1052CVL5BR	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER									40	260										3			e1
AT97SC3205T-G3M4C20B	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES			0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		70 Cel		0 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V			.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-H3M4C00B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES			0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V			.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-H3M4C10B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES			0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel		QUAD	.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V			.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-X3A1C-10	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES			0	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		70 Cel		0 Cel		DUAL	1.1 mm		4.4 mm		NO	0				9.7 mm	CMOS		3.3 V			.65 mm	FIXED POINT	R-PDSO-G28			NO
FS32R274KSK2MMMR	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER									40	260										3			e2
SPC5606SF2CLU6R	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN									40	260										3			e3
MPC8544CVJALFA	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER									40	260										3			e2
SVF331R3K1CKU2R	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN									40	260										3			e3
SVF332R3K1CKU2R	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN									40	260										3			e3
SVF532R2K1CMK4R	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER									40	260										3			e1
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T2080NXE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				64	GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel		BOTTOM					NO			30	250		CMOS						FIXED POINT	S-PBGA-B896	3	1200 rpm	NO
T2080NXN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				64	GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM					NO			30	250		CMOS						FIXED POINT	S-PBGA-B896	3	1533 rpm	NO	e1
MIMXRT1051DVJ6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel	0	0 Cel	TIN SILVER	BOTTOM	1.52 mm	524288	12 mm		YES	0	24 MHz	40	260	12 mm	CMOS	105 mA		32	29	.8 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES	e2
STM32MP151AAD3T	STMicroelectronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		32	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.18 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm	"TERM PITCH-MAX"	YES		48 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	100 mA	1.2 V	48	8	.65 mm	FLOATING-POINT	S-PBGA-B257		650 rpm	YES
STM32MP151AAB3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	1.18 V	125 Cel		-40 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	940 mA	1.2 V	48	8	.8 mm	FLOATING POINT	S-PBGA-B354		650 rpm	YES
STM32MP151AAC3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,23X23,25/20	1.18 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	940 mA	1.2 V	48	8	.65 mm	FLOATING POINT	S-PBGA-B361		650 rpm	YES
STM32MP151AAD3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.18 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	940 mA	1.2 V	48	8	.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES
STM32MP151AAA3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	1.18 V	125 Cel		-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	BOTTOM	1.32 mm	724992	18 mm		YES	16	48 MHz	30	260	18 mm	CMOS	940 mA	1.2 V	48	8	.8 mm	FLOATING POINT	S-PBGA-B448	3	650 rpm	YES	e2
STM32MP151DAA1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	1.3 V	105 Cel		-20 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	16	48 MHz			18 mm	CMOS	955 mA	1.34 V	48	8	.8 mm	FLOATING POINT	S-PBGA-B448		800 rpm	YES
STM32MP151DAB1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	1.3 V	105 Cel		-20 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	48 MHz			16 mm	CMOS	955 mA	1.34 V	48	8	.8 mm	FLOATING POINT	S-PBGA-B354		800 rpm	YES
STM32MP157DAC1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	865 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B361		800 rpm	YES
STM32MP157DAA1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	865 mA	.9 V	48		.8 mm	FLOATING POINT	S-PBGA-B448		800 rpm	YES
EFR32FG22C121F512GM40-C	Silicon Labs	MICROPROCESSOR, RISC																			Matte Tin (Sn)									40	260										2			e3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.