HVQCCN Multi-functional Peripherals 11

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Part	Manufacturer	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
CY8C5367LTI-003	Cypress Semiconductor	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel		-40 Cel		N	QUAD	1 mm		16384	8 mm		NO		25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	131072 Bits		CMOS		5 V	Other Microprocessor ICs		I2C; USB	.4 mm	S-XQCC-N68		Not Qualified			46
CY8C5466LTI-063	Cypress Semiconductor	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel		-40 Cel		N	QUAD	1 mm		8192	8 mm		NO		25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	524288 Bits		CMOS		5 V	Other Microprocessor ICs		I2C; USB	.4 mm	S-XQCC-N68		Not Qualified			46
CY8C5468LTI-037	Cypress Semiconductor	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel		-40 Cel		N	QUAD	1 mm		32768	8 mm		NO		25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	2097152 Bits		CMOS		5 V	Other Microprocessor ICs		I2C; USB	.4 mm	S-XQCC-N68		Not Qualified			46
CY8C5246LTI-029	Cypress Semiconductor	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0		1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		32768	8 mm		YES	0	40 MHz		260	8 mm	65536 Bits		CMOS		1.8 V	Other Microprocessor ICs			.4 mm	S-XQCC-N68	3	Not Qualified		e4	48
CC1111F16RSPR	Texas Instruments	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						NICKEL PALLADIUM GOLD		QUAD	.9 mm			6 mm					30	260	6 mm			CMOS						.5 mm	S-XQCC-N36	3	Not Qualified		e4
CC1111F16RSP	Texas Instruments	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						NICKEL PALLADIUM GOLD		QUAD	.9 mm			6 mm					30	260	6 mm			CMOS						.5 mm	S-XQCC-N36	3	Not Qualified		e4
CC1111F32RSP	Texas Instruments	OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			85 Cel	8051	0 Cel	NICKEL PALLADIUM GOLD		QUAD	.9 mm			6 mm					30	260	6 mm		4096	CMOS						.5 mm	S-PQCC-N36	3	Not Qualified		e4	21
CC1111F8RSPR	Texas Instruments	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						NICKEL PALLADIUM GOLD		QUAD	.9 mm			6 mm					30	260	6 mm			CMOS						.5 mm	S-XQCC-N36	3	Not Qualified		e4
CC1111F8RSP	Texas Instruments	OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			85 Cel	8051	0 Cel	NICKEL PALLADIUM GOLD		QUAD	.9 mm			6 mm					30	260	6 mm		4096	CMOS						.5 mm	S-PQCC-N36	3	Not Qualified		e4	21
CY7C60323-LTXC	Cypress Semiconductor	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	0	8	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	70 Cel	M8C	0 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	512	5 mm	IT ALSO OPERATES AT 2.4V AT 93KHZ	NO	0	12 MHz	40	260	5 mm		512	CMOS	2 mA	3 V	Microcontrollers	FLASH	I2C; USB	.5 mm	S-XQCC-N32	3	Not Qualified	24.6 rpm	e4	28
LPC47N217N-ABZJ	Microchip Technology		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						MATTE TIN		QUAD	1 mm			8 mm		NO					8 mm			CMOS		3.3 V			PCI; ISA	.5 mm	S-XQCC-N56				e3	13

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.