SQUARE Multi-functional Peripherals 196

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
MIMX8QP6AVUFFAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	1313	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		0	GRID ARRAY, FINE PITCH		1.05 V	125 Cel	-40 Cel	TIN SILVER BISMUTH	BOTTOM	2.52 mm	524288	29 mm	lsio contains 8 GPIO lines	YES	0	24 MHz	40	260	29 mm	CMOS	5000 mA	1.1 V		CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.75 mm	S-PBGA-B1313	3	e6	1
LS1024ASN7ELA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	650 MHz	30	250	21 mm	CMOS	1200 mA	1.1 V			.8 mm	S-PBGA-B625	3
LS1024ASE7MLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.164 V		26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.096 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	1200 MHz	30	250	21 mm	CMOS	1500 mA	1.13 V			.8 mm	S-PBGA-B625	3
LS1024ASE7ELA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	650 MHz	30	250	21 mm	CMOS	1200 mA	1.1 V			.8 mm	S-PBGA-B625	3
LS1024ASN7MLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.164 V		26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.096 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	1200 MHz	30	250	21 mm	CMOS	1500 mA	1.13 V			.8 mm	S-PBGA-B625	3
LS1024ASN7JLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	900 MHz	30	250	21 mm	CMOS	1400 mA	1.1 V			.8 mm	S-PBGA-B625	3
LS1024ASE7JLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	900 MHz	30	250	21 mm	CMOS	1400 mA	1.1 V			.8 mm	S-PBGA-B625	3
MIMX8UX6AVOFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	512K	17 mm		YES		24 MHz	40	260	17 mm	CMOS	5000 mA	1.1 V		CAN(3), SAI(4), SPI(4), UART(6)	.8 mm	S-PBGA-B417	3		75
MIMX8UX6AVLFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	512K	21 mm		YES		24 MHz	40	260	21 mm	CMOS	5000 mA	1.1 V		CAN(3), SAI(4), SPI(4), UART(6)	.8 mm	S-PBGA-B609	3	e2	99
MIMX8UX5AVOFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	512K	17 mm		YES		24 MHz	40	260	17 mm	CMOS	5000 mA	1.1 V		CAN(3), SAI(4), SPI(4), UART(6)	.8 mm	S-PBGA-B417	3		75
MIMX8UX5AVLFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	512K	21 mm		YES		24 MHz	40	260	21 mm	CMOS	5000 mA	1.1 V		CAN(3), SAI(4), SPI(4), UART(6)	.8 mm	S-PBGA-B609	3	e2	99
MIMX8QM5CVUFFAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	1313	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		0	GRID ARRAY, FINE PITCH		1.05 V	105 Cel	-40 Cel	TIN SILVER BISMUTH	BOTTOM	2.52 mm	524288	29 mm		YES	0	24 MHz	40	260	29 mm	CMOS	5000 mA	1.1 V		CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.75 mm	S-PBGA-B1313	3	e6	1
MIMX8ML6CVNKZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.805 V	105 Cel	-40 Cel		BOTTOM	1.481 mm	888832	15 mm	ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE	YES	0	24 MHz	40	260	15 mm	CMOS		.85 V	16	ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3		160
MIMX8ML8CVNKZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.805 V	105 Cel	-40 Cel		BOTTOM	1.481 mm	888832	15 mm	ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE	YES	0	24 MHz	40	260	15 mm	CMOS		.85 V	16	ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3		160
MIMX8ML3CVNKZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.805 V	105 Cel	-40 Cel		BOTTOM	1.481 mm	888832	15 mm	ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE	YES	0	24 MHz	40	260	15 mm	CMOS		.85 V	16	ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3		160
MIMX8ML4CVNKZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.9 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.805 V	105 Cel	-40 Cel		BOTTOM	1.481 mm	888832	15 mm	ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE	YES	0	24 MHz	40	260	15 mm	CMOS		.85 V	16	ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3		160
TDA3MVRBFABFRQ1	Texas Instruments	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	16	GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	524288	15 mm		YES	32	38.4 MHz	30	250	15 mm	CMOS		1.06 V	13	CAN(2), I2C(2), QSPI, SPI(4), UART(3)	.65 mm	S-PBGA-B367	3	e1	126
MIMX8ML3DVNLZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.95 V	95 Cel	0 Cel		BOTTOM	1.481 mm	888832	15 mm		YES	0	24 MHz	40	260	15 mm	CMOS	2200 mA	1 V	16	ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3		136
MIMX8ML8DVNLZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.95 V	95 Cel	0 Cel		BOTTOM	1.481 mm	888832	15 mm		YES	0	24 MHz	40	260	15 mm	CMOS	2200 mA	1 V	16	ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3		136
MIMX8ML6DVNLZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		0	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.95 V	95 Cel	0 Cel		BOTTOM	1.481 mm	888832	15 mm		YES	0	24 MHz	40	260	15 mm	CMOS	2200 mA	1 V	16	ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3		136
LS1027ASE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027AXE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027AXN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027AXN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017ASE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017ASN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017ASN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017AXE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017AXN7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017AXN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017ASE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017ASE7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017AXE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017AXE7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017AXN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027ASE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027ASN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027AXE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027AXN7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027AXN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027ASE7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027ASE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027ASN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027AXE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017ASE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017AXE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1017AXN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68
LS1027ASN7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		14	GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm	S-PBGA-B448	3		68

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.