OTHER Multi-functional Peripherals 37

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
VCE6467TZUTL1	Texas Instruments		OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V	0	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel		0 Cel		BOTTOM	3.3 mm	128	19 mm		YES	0	35 MHz	30	245	19 mm		CMOS		1.3 V		Digital Signal Processors	I2C; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified				33
CC1111F16RSPR	Texas Instruments		OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED		YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						NICKEL PALLADIUM GOLD	QUAD	.9 mm		6 mm					30	260	6 mm		CMOS						.5 mm		S-XQCC-N36	3	Not Qualified			e4
CC1111F16RSP	Texas Instruments		OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED		YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						NICKEL PALLADIUM GOLD	QUAD	.9 mm		6 mm					30	260	6 mm		CMOS						.5 mm		S-XQCC-N36	3	Not Qualified			e4
CC1111F32RSP	Texas Instruments		OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY		YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			85 Cel	8051	0 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm		6 mm					30	260	6 mm	4096	CMOS						.5 mm		S-PQCC-N36	3	Not Qualified			e4	21
CC1111F8RSPR	Texas Instruments		OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED		YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						NICKEL PALLADIUM GOLD	QUAD	.9 mm		6 mm					30	260	6 mm		CMOS						.5 mm		S-XQCC-N36	3	Not Qualified			e4
CC1111F8RSP	Texas Instruments		OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY		YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			85 Cel	8051	0 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm		6 mm					30	260	6 mm	4096	CMOS						.5 mm		S-PQCC-N36	3	Not Qualified			e4	21
STPCC5HEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V	32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel		0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Multifunction Peripherals	PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified			e0
STPCI2GDYI	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	85 Cel		0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	14.31818 MHz			35 mm		CMOS		2.5 V		Other Microprocessor ICs	USB; PCI; ISA; PCMCIA	1.27 mm		S-PBGA-B516		Not Qualified			e0	24
STPCI2HEYC	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	85 Cel		0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	14.31818 MHz			35 mm		CMOS		2.5 V		Other Microprocessor ICs	USB; PCI; ISA; PCMCIA	1.27 mm		S-PBGA-B516		Not Qualified			e0	24
MCIMX6G2DVK05AB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	95 Cel		0 Cel		BOTTOM	1.23 mm		9 mm		YES	16		40	260	9 mm		CMOS						.5 mm	FIXED POINT	S-PBGA-B272	3		528 rpm	YES
MCIMX6G2DVM05AB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm		YES	16		40	260	14 mm		CMOS						.8 mm	FIXED POINT	S-PBGA-B289	3		528 rpm	YES	e1
MCIMX6G3DVM05AB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm		YES	16		40	260	14 mm		CMOS						.8 mm	FIXED POINT	S-PBGA-B289	3		528 rpm	YES	e1
OMAP3530ECBBLPD	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4175 V	26			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.2825 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.9 mm	64K	12 mm		YES	16	38.4 MHz	NOT SPECIFIED	260	12 mm		CMOS		1.35 V			CAN; I2C; IRDA; PCI; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B515	3		720 rpm	YES	e1	188
66AK2H06DAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm		CMOS		1 V			ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
66AK2H06DAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm		CMOS		1 V			ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
66AK2H12DAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm		CMOS		1 V			ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
66AK2H12DAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm		CMOS		1 V			ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
66AK2H14DAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm		CMOS		1 V			ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
MIMX8ML3DVNLZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.95 V	95 Cel		0 Cel		BOTTOM	1.481 mm	888832	15 mm		YES	0	24 MHz	40	260	15 mm		CMOS	2200 mA	1 V	16		ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm		S-PBGA-B548	3					136
MIMX8ML8DVNLZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.95 V	95 Cel		0 Cel		BOTTOM	1.481 mm	888832	15 mm		YES	0	24 MHz	40	260	15 mm		CMOS	2200 mA	1 V	16		ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm		S-PBGA-B548	3					136
MIMX8ML6DVNLZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.95 V	95 Cel		0 Cel		BOTTOM	1.481 mm	888832	15 mm		YES	0	24 MHz	40	260	15 mm		CMOS	2200 mA	1 V	16		ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm		S-PBGA-B548	3					136
LS1027ASE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		.9 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1017ASE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1017ASN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1017ASN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1017ASE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1017ASE7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027ASE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027ASN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027ASE7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027ASE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027ASN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1017ASE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027ASN7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		.9 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027ASN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1017ASN7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1017ASN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm		CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.