GULL WING Multi-functional Peripherals 19

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	Maximum Standby Current	No. of I/O Lines
MCIMX233CAG4B	Freescale Semiconductor	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.55 V	13			FLATPACK, LOW PROFILE, FINE PITCH		1 V	85 Cel		-40 Cel	Matte Tin (Sn)		QUAD	1.6 mm			14 mm	IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY	YES	16	24 MHz	40	260	14 mm			CMOS		1.35 V					.4 mm	FIXED POINT	S-PQFP-G128	3		454 rpm	YES	e3
MCIMX233DAG4B	Freescale Semiconductor	MULTIFUNCTION PERIPHERAL	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.55 V	13			FLATPACK, LOW PROFILE, FINE PITCH		1 V	70 Cel		-10 Cel	Matte Tin (Sn)		QUAD	1.6 mm			14 mm	IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY	YES	16	24 MHz	40	260	14 mm			CMOS		1.35 V					.4 mm	FIXED POINT	S-PQFP-G128	3		454 rpm	YES	e3
BTS6460SFXUMA1	Infineon Technologies			GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	0			SMALL OUTLINE, SHRINK PITCH		3 V						DUAL	2.65 mm			7.6 mm		NO	0		NOT SPECIFIED	NOT SPECIFIED	12.8 mm			CMOS		5 V					.65 mm		R-PDSO-G36							0
CY8C3865AXI-204	Cypress Semiconductor		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	Matte Tin (Sn)	N	QUAD	1.6 mm		4096	14 mm		YES		33 MHz	30	260	14 mm	262144 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2; 8051	.5 mm		S-PQFP-G100	3	Not Qualified			e3		72
CY8C28513-24AXI	Cypress Semiconductor		INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	4.75 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1.6 mm	16384	512	10 mm	ALSO OPERATES AT 3V MINIMUM SUPPLY	NO	0	24 MHz	20	260	10 mm		1024	CMOS	14 mA	5 V		Microcontrollers	FLASH	USB	.8 mm		S-PQFP-G44	3	Not Qualified	24 rpm		e4		40
LH75401N0Q100C0,55	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel		-40 Cel	Tin (Sn)		QUAD	1.6 mm		32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz	40	250	20 mm			CMOS	70 mA	1.8 V	5			CAN, SSP, UART(3)	.5 mm		S-PQFP-G144	3	Not Qualified			e3		76
LH75411N0Q100C0,55	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel		-40 Cel	TIN		QUAD	1.6 mm		32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm			CMOS	70 mA	1.8 V	5			CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified			e3		76
LH75401N0Q100C0	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel		-40 Cel	TIN		QUAD	1.6 mm		32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm			CMOS	70 mA	1.8 V	5			CAN, SSP, UART(3)	.5 mm		S-PQFP-G144	3	Not Qualified			e3		76
CY8C24223A-24SXI	Cypress Semiconductor		INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	2.7/5	SMALL OUTLINE	SOP20,.4	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.67 mm	4096	256	7.505 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	20	260	12.8265 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	1.27 mm		R-PDSO-G20	3	Not Qualified	24 rpm		e4		16
CY8C29466-24PVXA	Cypress Semiconductor		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	32768	1024	5.3 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	20	260	10.2 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH	USB	.65 mm		R-PDSO-G28	3	Not Qualified	24 rpm		e4		24
CY8C27243-24SXIT	Cypress Semiconductor		INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	SMALL OUTLINE	SOP20,.4	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.667 mm	16384	256	7.505 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz	20	260	12.8265 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	1.27 mm		R-PDSO-G20	3	Not Qualified	24 rpm		e4		16
CY8C27243-24SXI	Cypress Semiconductor		INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	SMALL OUTLINE	SOP20,.4	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.667 mm	16384	256	7.505 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz	20	260	12.8265 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	1.27 mm		R-PDSO-G20	3	Not Qualified	24 rpm		e4		16
CY8C26233-24SXI	Cypress Semiconductor		INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0		3.3/5	SMALL OUTLINE	SOP20,.4	3 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	N	DUAL	2.667 mm		256	7.505 mm		NO	0	.032768 MHz	20	260	12.8265 mm	8192 Bits		CMOS		3.3 V		Other Microprocessor ICs			1.27 mm		R-PDSO-G20	3	Not Qualified			e4	.000005 Amp	16
CY8C4124PVI-432T	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel		-40 Cel			DUAL	2 mm		2048	5.3 mm		NO	0	24 MHz	NOT SPECIFIED	NOT SPECIFIED	10.2 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.65 mm		R-PDSO-G28		Not Qualified					24
BTS5460SFXUMA1	Infineon Technologies			GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	0			SMALL OUTLINE, SHRINK PITCH		3 V						DUAL	2.65 mm			7.6 mm		NO	0		NOT SPECIFIED	NOT SPECIFIED	12.8 mm			CMOS		5 V					.65 mm		R-PDSO-G36
CY8C5666AXQ-LP004	Cypress Semiconductor		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	0		1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	105 Cel		-40 Cel		N	QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz			14 mm	524288 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; I2S, LIN; PS/2; SPI, USB	.5 mm		S-PQFP-G100		Not Qualified					62
SCH5027E-NW	Microchip Technology		COMMERCIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY		YES					FLATPACK			70 Cel		0 Cel			QUAD						NO			NOT SPECIFIED	NOT SPECIFIED				CMOS						8042; IBM PC-XT; IBM PC-AT; IRDA; PCI; SMBUS			R-PQFP-G128							25
W83627DHG-PT	Nuvoton Technology		INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY		YES	3.465 V			3.3	FLATPACK, FINE PITCH	QFP128,.67X.93,20	3.135 V	85 Cel		-40 Cel			QUAD	3.4 mm			14 mm	MULTIPROTOCOL PARALLEL PORT TYPE	NO				260	20 mm			CMOS	25 mA	3.3 V		Other Microprocessor ICs		I2C; IRDA; PCI; PS/2; SMBUS; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified					40
XS1-L4A-64-TQ48-C4	Xmos		COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V	0			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH		.95 V	70 Cel		0 Cel			QUAD	1.2 mm		32768	7 mm		YES	0	100 MHz			7 mm			CMOS		1 V				SPI, USB	.5 mm		S-PQFP-G48							28

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.