VFBGA Other Function uPs,uCs & Peripheral ICs 40

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
LM8330TME/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	128		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm	2.01 mm		30	260	2.01 mm	CMOS	.03 mA	1.8 V			.4 mm	S-PBGA-B25	1		e1	20
LM8330TMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	128		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm	2.01 mm		30	260	2.01 mm	CMOS	.03 mA	1.8 V			.4 mm	S-PBGA-B25	1		e1	20
MTFC32GJVED-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1 mm	14 mm	IT ALSO OPERATES AT 3.3 VOLTS			18 mm	CMOS		1.8 V			.5 mm	R-PBGA-B169			e1
MTFC4GMVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS			13 mm	CMOS		1.8 V			.5 mm	R-PBGA-B153			e1
MTFC8GLVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS			13 mm	CMOS		1.8 V			.5 mm	R-PBGA-B153			e1
MTFC32GJDED-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1 mm	14 mm	IT ALSO OPERATES AT 3.3 VOLTS			18 mm	CMOS		1.8 V			.5 mm	R-PBGA-B169			e1
MTFC8GLDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS			13 mm	CMOS		1.8 V			.5 mm	R-PBGA-B153			e1
OMAP3515DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA515,28X28,16	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm		30	260	12 mm	CMOS		1.8 V	Graphics Processors		.5 mm	S-PBGA-B515	3	Not Qualified	e1
OMAP3515DCBC	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA515,21X21,25	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm		30	260	12 mm	CMOS		1.8 V	Graphics Processors		.5 mm	S-PBGA-B515	3	Not Qualified	e1
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel		BOTTOM		.8 mm	7 mm	3.3V NOM SUPPLY ALSO AVAILABLE			7 mm	CMOS		1.8 V		I2C, QSPI, UART	.65 mm	S-PBGA-B84
DLPC2607ZVB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.95 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM						260		CMOS		1 V				S-PBGA-B176	3		e1
DLPC3439ZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel		BOTTOM		1 mm	13 mm				13 mm	CMOS		1.1 V			.8 mm	S-PBGA-B201
DLPC3438CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		1 mm	13 mm		30	260	13 mm	CMOS		1.1 V			.8 mm	S-PBGA-B201	3		e1
DLPC3439CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		1 mm	13 mm		30	260	13 mm	CMOS		1.1 V			.8 mm	S-PBGA-B201	3		e1
LC898123F40XC-VH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		.45 mm	2.3 mm		30	260	3.22 mm	CMOS		2.8 V			.4 mm	R-PBGA-B35	1		e1
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.8 mm	9 mm				9 mm	CMOS		3 V			.65 mm	S-PBGA-B144			e1
LC898124EP2XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		.33 mm	1.3 mm		30	260	3.89 mm	CMOS		2.8 V			.4 mm	R-PBGA-B27	1		e1
DLPC3437CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		1 mm	13 mm		30	260	13 mm	CMOS		1.1 V			.8 mm	S-PBGA-B201	3		e1
EFR32FG12P431F1024GL125-C	Silicon Labs	SYSTEM ON CHIP		BALL	125	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA125,13X13,20	1.62 V	85 Cel	-40 Cel		BOTTOM		.94 mm	7 mm				7 mm	CMOS		1.8 V			.5 mm	S-PBGA-B125
DLPC3434CZVB	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, VERY THIN PROFILE, FINE PITCH					Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		1 mm	7 mm		30	260	7 mm	CMOS					.4 mm	S-PBGA-B176	3		e1
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel	-40 Cel		BOTTOM		1 mm	7 mm				7 mm	CMOS		3.3 V			.65 mm	S-PBGA-B100
ATMXT224T-CCU027	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,8X8,20	3 V	85 Cel	-40 Cel		BOTTOM		.6 mm	5 mm				5 mm	CMOS		3.3 V			.5 mm	S-PBGA-B64
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM		.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE			9 mm	CMOS		1.8 V			.65 mm	S-PBGA-B144
ATMXT640UD-CCU001	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	3.14 V	85 Cel	-40 Cel		BOTTOM		.6 mm	6 mm				6 mm	CMOS		3.3 V			.5 mm	S-PBGA-B88
CYW54907KWBGT	Infineon Technologies	SYSTEM ON CHIP		BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA316(UNSPEC)	1.14 V	85 Cel	-30 Cel		BOTTOM		.33 mm	4.907 mm	MINIMUM BUMP PITCH IS CONSIDERED			5.848 mm	CMOS		1.2 V			.2 mm	R-PBGA-B316
CYS0644AFNI-S2D43T	Infineon Technologies	PROGRAMMABLE SoC		BALL	100	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,12X17,16	1.7 V	85 Cel	-40 Cel		BOTTOM		.467 mm	3.9025 mm				4.1068 mm	CMOS		1.8 V			.42 mm	R-PBGA-B100
AM6254ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm			250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM6231AKGGHHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel	0 Cel		BOTTOM		.89 mm	13 mm				13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6234ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6254ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6254ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6232ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6231ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6234ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm			250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
CY8C4248BZS-L489	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.71 V	105 Cel	-40 Cel		BOTTOM		1 mm	9 mm				9 mm	CMOS		3.3 V			.65 mm	S-PBGA-B241	3
CYPM1211-42FNXIT	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16	2.7 V	105 Cel	-40 Cel		BOTTOM		.55 mm	2.633 mm				3.184 mm	CMOS		3.3 V			.4 mm	R-PBGA-B42
NRF52805-CAAA-B-R	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM		.535 mm	2.464 mm				2.482 mm	CMOS		3 V			.4 mm	R-PBGA-B28
AM6251ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm			250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM6231ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm			250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM6232ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm			250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.