SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)
CY8C4547AXI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	14 mm			14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AXQ-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	14 mm			14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AZI-S455	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4547AZI-S473	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4548AZI-S485	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4548AZQ-S483	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4546AXI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	14 mm			14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AZI-S453	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4547AZI-S463	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4547AZQ-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4548AXI-S485	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	14 mm			14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AZQ-S473	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4547AZQ-S455	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4548AZI-S483	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4546AZI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4546AZI-S473	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4548AZQ-S485	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4548AXQ-S485	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	14 mm			14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4548AXI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	14 mm			14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AZQ-S453	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	7 mm			7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4547AZI-S465	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
MIMX8DL1AVNFZBA	NXP Semiconductors	SoC	BALL	388		SQUARE	PLASTIC/EPOXY	YES							BOTTOM	1.7 mm	15 mm	40	260	15 mm	CMOS			S-PBGA-B388	3
SE051A2HQ1/Z01XEZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	QUAD	.33 mm	3 mm		260	3 mm	CMOS	1.8 V	.4 mm	S-XQCC-N20	1
SE051P2HQ1/Z011AZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	QUAD	.33 mm	3 mm		260	3 mm	CMOS	1.8 V	.4 mm	S-XQCC-N20	1
SE051W2HQ1/Z019TZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	QUAD	.33 mm	3 mm		260	3 mm	CMOS	1.8 V	.4 mm	S-XQCC-N20	1
ATSAM4C16CB-AUT	Microchip Technology	SYSTEM ON CHIP	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel	QUAD	1.2 mm	14 mm			14 mm	CMOS	1.2 V	.5 mm	S-PQFP-G100
ATSAM4C8CB-AUT	Microchip Technology	SYSTEM ON CHIP	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel	QUAD	1.2 mm	14 mm			14 mm	CMOS	1.2 V	.5 mm	S-PQFP-G100
ATSAM4C16CB-AUTR	Microchip Technology	SYSTEM ON CHIP	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel	QUAD	1.2 mm	14 mm			14 mm	CMOS	1.2 V	.5 mm	S-PQFP-G100
ATSAM4C8CB-AUTR	Microchip Technology	SYSTEM ON CHIP	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel	QUAD	1.2 mm	14 mm			14 mm	CMOS	1.2 V	.5 mm	S-PQFP-G100
XCVM1302-2MLENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-2MSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-1LSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1402-1LSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1402-2HSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.854 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.88 V	.92 mm	S-PBGA-B1024
XCVM1402-2HSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm			37.5 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVM1302-1LLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1302-1LSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1302-2LLENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1402-2MLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-1LSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1MSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-2LSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	3.83 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1MLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-2MSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-1LLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1502-1LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1502-2HSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVC1702-1LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.