PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 168

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU49DR-L1FSVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU49DR-L2FFVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

CY8C4247AZS-M485

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.89 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

1.8 V

.5 mm

S-PQFP-G64

3

CY8C4246AZS-M443

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.89 V

AEC-Q100

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

1.8 V

.5 mm

S-PQFP-G48

3

CY8C6144AZI-S4F92

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

HQFP64,.47SQ,20

1.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

1.8 V

.5 mm

S-PQFP-G64

3

CY8C6144AZI-S4F93

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

1.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

12 mm

12 mm

CMOS

1.8 V

.5 mm

S-PQFP-G80

3

CY8C6144AZI-S4F83

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

1.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

12 mm

12 mm

CMOS

1.8 V

.5 mm

S-PQFP-G80

3

CY8C6144AZQ-S4F93

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

1.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

12 mm

12 mm

CMOS

1.8 V

.5 mm

S-PQFP-G80

3

CY8C6144LQI-S4F92

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.7 V

85 Cel

-40 Cel

QUAD

1 mm

8 mm

8 mm

CMOS

1.8 V

.4 mm

S-XQCC-N68

3

CY8C6144LQI-S4F12

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.7 V

85 Cel

-40 Cel

QUAD

1 mm

8 mm

8 mm

CMOS

1.8 V

.4 mm

S-XQCC-N68

3

CY8C6144AZI-S4F82

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

HQFP64,.47SQ,20

1.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

1.8 V

.5 mm

S-PQFP-G64

3

CY8C6144LQQ-S4F92

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.7 V

85 Cel

-40 Cel

QUAD

1 mm

8 mm

8 mm

CMOS

1.8 V

.4 mm

S-XQCC-N68

3

CY8C6144AZI-S4F62

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

HQFP64,.47SQ,20

1.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

1.8 V

.5 mm

S-PQFP-G64

3

CY8C6144AZQ-S4F92

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

HQFP64,.47SQ,20

1.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

1.8 V

.5 mm

S-PQFP-G64

3

CY8C6144AZI-S4F12

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

HQFP64,.47SQ,20

1.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

1.8 V

.5 mm

S-PQFP-G64

3

CY8C4147LQS-S295

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.8 V

105 Cel

-40 Cel

QUAD

.9 mm

9 mm

9 mm

CMOS

3.3 V

.5 mm

S-XQCC-N64

CY8C4147LQS-S475

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.8 V

105 Cel

-40 Cel

QUAD

.9 mm

9 mm

9 mm

CMOS

3.3 V

.5 mm

S-XQCC-N64

CY8C4147LQS-S265

Infineon Technologies

PROGRAMMABLE SoC

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.8 V

105 Cel

-40 Cel

QUAD

.9 mm

9 mm

9 mm

CMOS

3.3 V

.5 mm

S-XQCC-N64

CY8C4548AZI-S475

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CY8C4547AXI-S475

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP64,.63SQ,32

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

3.3 V

.8 mm

S-PQFP-G64

CY8C4547AXQ-S475

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP64,.63SQ,32

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

3.3 V

.8 mm

S-PQFP-G64

CY8C4547AZI-S455

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CY8C4547AZI-S473

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

CY8C4548AZI-S485

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CY8C4548AZQ-S483

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

CY8C4546AXI-S475

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP64,.63SQ,32

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

3.3 V

.8 mm

S-PQFP-G64

CY8C4547AZI-S453

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

CY8C4547AZI-S463

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

CY8C4547AZQ-S475

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CY8C4548AXI-S485

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP64,.63SQ,32

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

3.3 V

.8 mm

S-PQFP-G64

CY8C4547AZQ-S473

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

CY8C4547AZQ-S455

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CY8C4548AZI-S483

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

CY8C4546AZI-S475

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CY8C4546AZI-S473

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

CY8C4548AZQ-S485

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CY8C4548AXQ-S485

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP64,.63SQ,32

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

3.3 V

.8 mm

S-PQFP-G64

CY8C4548AXI-S475

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP64,.63SQ,32

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

3.3 V

.8 mm

S-PQFP-G64

CY8C4547AZQ-S453

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.71 V

105 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

CY8C4547AZI-S465

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1.6 mm

10 mm

10 mm

CMOS

3.3 V

.5 mm

S-PQFP-G64

CYS0644AFNI-S2D43T

Infineon Technologies

PROGRAMMABLE SoC

BALL

100

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA100,12X17,16

1.7 V

85 Cel

-40 Cel

BOTTOM

.467 mm

3.9025 mm

4.1068 mm

CMOS

1.8 V

.42 mm

R-PBGA-B100

MPFS025T-1FCSG325E

Microchip Technology

PROGRAMMABLE SoC

BALL

325

RECTANGULAR

PLASTIC/EPOXY

YES

1.03 V

.97 V

100 Cel

0 Cel

BOTTOM

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

CMOS

1 V

R-PBGA-B325

MPFS025T-FCVG484I

Microchip Technology

PROGRAMMABLE SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.97 V

100 Cel

-40 Cel

BOTTOM

2.92 mm

19 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

19 mm

CMOS

1 V

.8 mm

S-PBGA-B484

MPFS160T-1FCVG784E

Microchip Technology

PROGRAMMABLE SoC

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, FINE PITCH

BGA784,28X28,32

.97 V

100 Cel

0 Cel

BOTTOM

2.92 mm

23 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

23 mm

CMOS

1 V

.8 mm

S-PBGA-B784

MPFS250T-1FCSG536E

Microchip Technology

PROGRAMMABLE SoC

BALL

536

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA536,30X30,20

.97 V

100 Cel

0 Cel

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

16 mm

CMOS

1 V

.5 mm

S-PBGA-B536

MPFS250T-1FCVG784I

Microchip Technology

PROGRAMMABLE SoC

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, FINE PITCH

BGA784,28X28,32

.97 V

100 Cel

-40 Cel

BOTTOM

2.92 mm

23 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

23 mm

CMOS

1 V

.8 mm

S-PBGA-B784

MPFS250T-FCSG536I

Microchip Technology

PROGRAMMABLE SoC

BALL

536

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA536,30X30,20

.97 V

100 Cel

-40 Cel

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

16 mm

CMOS

1 V

.5 mm

S-PBGA-B536

MPFS250TS-FCG1152I

Microchip Technology

PROGRAMMABLE SoC

BALL

1152

BGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY

BGA1152,34X34,40

.97 V

100 Cel

-40 Cel

BOTTOM

2.99 mm

35 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

35 mm

CMOS

1 V

1 mm

S-PBGA-B1152

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.