SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 347

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX535DVV1B	Freescale Semiconductor	SYSTEM ON CHIP	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.85 mm	19 mm	40	260	19 mm	CMOS	1.25 V	.8 mm	S-PBGA-B529	3	Not Qualified	e2
XC7Z010-1CLG400C	Xilinx	SYSTEM ON CHIP	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V	.8 mm	S-PBGA-B400	3		e1
XC7Z010-1CLG400I	Xilinx	SYSTEM ON CHIP	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V	.8 mm	S-PBGA-B400	3		e1
XC7Z010-2CLG400E	Xilinx	SYSTEM ON CHIP	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V	.8 mm	S-PBGA-B400	3		e1
XC7Z010-2CLG400I	Xilinx	SYSTEM ON CHIP	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V	.8 mm	S-PBGA-B400	3		e1
XC7Z010-3CLG400E	Xilinx	SYSTEM ON CHIP	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V	.8 mm	S-PBGA-B400	3		e1
XC7Z020-1CLG400I	Xilinx	SYSTEM ON CHIP	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V	.8 mm	S-PBGA-B400	3		e1
XC7Z020-1CLG484C	Xilinx	SYSTEM ON CHIP	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
XC7Z020-1CLG484I	Xilinx	SYSTEM ON CHIP	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
XC7Z020-2CLG400E	Xilinx	SYSTEM ON CHIP	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V	.8 mm	S-PBGA-B400	3		e1
XC7Z020-2CLG484E	Xilinx	SYSTEM ON CHIP	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
XC7Z020-2CLG484I	Xilinx	SYSTEM ON CHIP	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
XC7Z020-3CLG400E	Xilinx	SYSTEM ON CHIP	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V	.8 mm	S-PBGA-B400	3		e1
XC7Z020-3CLG484E	Xilinx	SYSTEM ON CHIP	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-2FFG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-1FFG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z010-1CLG225C	Xilinx	SYSTEM ON CHIP	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel	0 Cel		BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V	.8 mm	S-PBGA-B225
XC7Z010-1CLG225I	Xilinx	SYSTEM ON CHIP	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V	.8 mm	S-PBGA-B225
XC7Z010-2CLG225I	Xilinx	SYSTEM ON CHIP	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V	.8 mm	S-PBGA-B225
XC7Z010-3CLG225E	Xilinx	SYSTEM ON CHIP	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel		BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V	.8 mm	S-PBGA-B225
XC7Z030-1FBG484C	Xilinx	SYSTEM ON CHIP	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA484,22X22,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V	1 mm	S-PBGA-B484
XC7Z030-1FBG484I	Xilinx	SYSTEM ON CHIP	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V	1 mm	S-PBGA-B484
XC7Z030-1FBG676C	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-1FBG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-1FFG676C	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-2FBG484E	Xilinx	SYSTEM ON CHIP	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V	1 mm	S-PBGA-B484
XC7Z030-2FBG484I	Xilinx	SYSTEM ON CHIP	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V	1 mm	S-PBGA-B484
XC7Z030-2FBG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-2FBG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-2FFG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-3FBG484E	Xilinx	SYSTEM ON CHIP	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V	1 mm	S-PBGA-B484
XC7Z030-3FBG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z030-3FFG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-1FBG676C	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-1FBG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-1FFG676C	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-1FFG900C	Xilinx	SYSTEM ON CHIP	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z045-1FFG900I	Xilinx	SYSTEM ON CHIP	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z045-2FBG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-2FBG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-2FFG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-2FFG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-2FFG900E	Xilinx	SYSTEM ON CHIP	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z045-2FFG900I	Xilinx	SYSTEM ON CHIP	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z045-3FBG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-3FFG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B676	4		e1
XC7Z045-3FFG900E	Xilinx	SYSTEM ON CHIP	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V	1 mm	S-PBGA-B900

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.