AUTOMOTIVE Other Function uPs,uCs & Peripheral ICs 110

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	DAC Channels	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	PWM Channels	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
L99MM70XPTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	18 V					SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		6 V	125 Cel	-40 Cel	Tin (Sn)			DUAL		2.45 mm			7.5 mm					30	260	10.3 mm		CMOS	13.5 V				.5 mm	R-PDSO-G36	3			e3
UCD3138A64PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			NO		FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	NO	1.2 mm	65536		12 mm	2K	COMPARATOR(7)	0	2 MHz	30	260	12 mm		CMOS	3.3 V	NO		I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4	8	43
UCD3138A64PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			NO		FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	NO	1.2 mm	65536		12 mm	2K	COMPARATOR(7)	0	2 MHz	30	260	12 mm		CMOS	3.3 V	NO		I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4	8	43
SI8250-IQ	Silicon Labs	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	2.75 V					FLATPACK, LOW PROFILE		2.25 V	125 Cel	-40 Cel				QUAD		1.6 mm			7 mm					NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS	2.5 V				.8 mm	S-PQFP-G32		Not Qualified
SI8251-IQ	Silicon Labs	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	2.75 V					FLATPACK, LOW PROFILE		2.25 V	125 Cel	-40 Cel				QUAD		1.6 mm			7 mm					NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS	2.5 V				.8 mm	S-PQFP-G32		Not Qualified
XA7Z010-1CLG225Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32		125 Cel	-40 Cel	TIN SILVER COPPER		N	BOTTOM		1.5 mm			13 mm							13 mm		CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B225	3	Not Qualified		e1
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		N	BOTTOM		1.6 mm			17 mm					30	260	17 mm		CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B400	3	Not Qualified		e1
XA7Z020-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		N	BOTTOM		1.6 mm			17 mm					30	260	17 mm		CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B400	3	Not Qualified		e1
XA7Z020-1CLG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN SILVER COPPER		N	BOTTOM		1.6 mm			19 mm					30	260	19 mm		CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B484	3	Not Qualified		e1
XA7Z030-1FBG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			1,1.8	GRID ARRAY	BGA484,22X22,40		125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		N	BOTTOM		2.54 mm			23 mm					30	250	23 mm		CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified		e1
MCP25050-E/P	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8		5	IN-LINE	DIP14,.3	4.5 V	125 Cel	-40 Cel	MATTE TIN			DUAL		4.318 mm			7.62 mm							19.05 mm		CMOS	5 V		Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified		e3
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)			DUAL		1.75 mm			3.9 mm							8.65 mm		CMOS	5 V		Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)			DUAL		1.75 mm			3.9 mm							8.65 mm		CMOS	5 V		Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified		e3
UCD3138128PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.2 mm			12 mm					30	260	12 mm		CMOS	3.3 V				.5 mm	S-PQFP-G80	3			e4
UCD3138128PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.2 mm			12 mm					30	260	12 mm		CMOS	3.3 V				.5 mm	S-PQFP-G80	3			e4
CC2540TF256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm		8	6 mm					30	260	6 mm	8192	CMOS	3 V			SPI; USART; USB	.5 mm	S-PQCC-N40	3			e4		21
AWR1443FQIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100				GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.17 mm			10.4 mm					30	260	10.4 mm	589824	CMOS	1.2 V				.65 mm	S-PBGA-B161	3			e1
AWR1443FQIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100				GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		1.2 mm			10.4 mm					30	260	10.4 mm	589824	CMOS	1.2 V				.65 mm	S-PBGA-B161	3			e1
UCD3138ARGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES		QUAD		1 mm			9 mm			0	2 MHz	30	260	9 mm		CMOS	3.3 V			I2C; UART	.5 mm	S-PQCC-N64	2			e4
UCD3138ARGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES		QUAD		1 mm			9 mm			0	2 MHz	30	260	9 mm		CMOS	3.3 V			I2C; UART	.5 mm	S-PQCC-N64	2			e4
UCD3138ARMHR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES		QUAD		.8 mm			6 mm			0	2 MHz	30	260	6 mm		CMOS	3.3 V			I2C; UART	.5 mm	S-PQCC-N40	2			e4
UCD3138ARMHT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES		QUAD		.8 mm			6 mm			0	2 MHz	30	260	6 mm		CMOS	3.3 V			I2C; UART	.5 mm	S-PQCC-N40	2			e4
DRA746APGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES		AEC-Q100				GRID ARRAY					TIN SILVER COPPER			BOTTOM										30	250			CMOS						X-PBGA-B760	3		1500 rpm	e1
MCIMX6DP4AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel				BOTTOM		2.16 mm			21 mm					40	260	21 mm		CMOS	1.4 V				.8 mm	S-PBGA-B624	3
MCIMX6DP6AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm					40	260	21 mm		CMOS	1.4 V				.8 mm	S-PBGA-B624	3			e1
MCIMX6G1AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel				BOTTOM		1.32 mm			14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3
MCIMX6G1AVM07AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	125 Cel	-40 Cel				BOTTOM		1.32 mm			14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3
MCIMX6G2AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel				BOTTOM		1.32 mm			14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3
MCIMX6G2AVM07AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	125 Cel	-40 Cel				BOTTOM		1.32 mm			14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100				GRID ARRAY			125 Cel	-40 Cel				BOTTOM														CMOS						S-PBGA-B484
DRA744BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm			64	32 MHz	30	250	23 mm		CMOS	1.15 V			CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1000 rpm	e1
DRA744BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm			64	32 MHz	30	250	23 mm		CMOS	1.15 V			CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1000 rpm	e1
DRA745BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm			64	32 MHz	30	250	23 mm		CMOS	1.15 V			CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1176 rpm	e1
DRA745BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm			64	32 MHz	30	250	23 mm		CMOS	1.15 V			CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1176 rpm	e1
DRA746BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm			64	32 MHz	30	250	23 mm		CMOS	1.15 V			CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1500 rpm	e1
DRA746BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm			64	32 MHz	30	250	23 mm		CMOS	1.15 V			CAN; I2C; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1500 rpm	e1
DRA750BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm			48	32 MHz	30	250	23 mm		CMOS	1.15 V			CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1000 rpm	e1
DRA752BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm					30	250	23 mm		CMOS	1.15 V				.8 mm	S-PBGA-B760	3			e1
DRA752BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm					30	250	23 mm		CMOS	1.15 V				.8 mm	S-PBGA-B760	3			e1
DRA756BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm			64	32 MHz	30	250	23 mm		CMOS	1.15 V			CAN; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B760	3		1500 rpm	e1
UCD3138128APFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.2 mm			12 mm			0	2 MHz	30	260	12 mm		CMOS	3.3 V			I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4
UCD3138128APFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.2 mm			12 mm			0	2 MHz	30	260	12 mm		CMOS	3.3 V			I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4
UCD3138ARJAR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES		QUAD		1 mm			6 mm					30	260	6 mm		CMOS	3.3 V				.5 mm	S-PQCC-N40	2			e4
UCD3138ARJAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES		QUAD		1 mm			6 mm					30	260	6 mm		CMOS	3.3 V				.5 mm	S-PQCC-N40	2			e4
MPXY8510DK016T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel	-40 Cel				QUAD		2.3 mm			9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm		CMOS	3 V				.65 mm	S-XQCC-N32
MPXY8600DK6T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel	-40 Cel				QUAD		2.3 mm			9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm		CMOS	3 V				.65 mm	S-XQCC-N32
XAZU2EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		2.61 mm			19 mm					30	250	19 mm		CMOS	.85 V				.8 mm	S-PBGA-B484	3			e1
XAZU2EG-1SFVA625Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER			BOTTOM		3.43 mm			21 mm					30	250	21 mm		CMOS	.85 V				.8 mm	S-PBGA-B625	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.