BALL Other Function uPs,uCs & Peripheral ICs 1,582

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XOMAPL137AZKB3

Texas Instruments

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2,1.8/3.3

GRID ARRAY

BGA256,16X16,40

70 Cel

0 Cel

BOTTOM

Other Microprocessor ICs

1 mm

S-PBGA-B256

Not Qualified

TDA8026ET/C2,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

TIN SILVER COPPER

BOTTOM

30

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

e1

TDA8026ET/C2,551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

TDA8026ET/C2,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

PN7120A0EV/C10801E

NXP Semiconductors

OTHER

BALL

49

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8

GRID ARRAY, FINE PITCH

BGA49,7X7,20

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

30

260

1.8 V

Other uPs/uCs/Peripheral ICs

.5 mm

S-PBGA-B49

3

Not Qualified

e1

TMS320DM335CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM335DZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM335DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

MCIMX535DVV1B

Freescale Semiconductor

SYSTEM ON CHIP

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.3 V

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.2 V

85 Cel

-20 Cel

Tin/Silver (Sn/Ag)

BOTTOM

1.85 mm

19 mm

40

260

19 mm

CMOS

1.25 V

.8 mm

S-PBGA-B529

3

Not Qualified

e2

OMAPL132BZWTA2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

1.2,1.8/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

.95 V

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

30

260

16 mm

CMOS

1 V

Other Microprocessor ICs

.8 mm

S-PBGA-B361

3

Not Qualified

e1

TMS320DM368ZCEDF

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.28 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.35 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

OMAPL132BZWT2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

1.2,1.8/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

.95 V

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

30

260

16 mm

CMOS

1 V

Other Microprocessor ICs

.8 mm

S-PBGA-B361

3

Not Qualified

e1

OMAPL132BZWTA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

1.2,1.8/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

.95 V

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.2 V TYP

30

260

16 mm

CMOS

1 V

Other Microprocessor ICs

.8 mm

S-PBGA-B361

3

Not Qualified

e1

TMS320DM6441BZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

316

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

32

1.05/1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

20480

16 mm

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

48

30

260

16 mm

CMOS

1.05 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B316

3

Not Qualified

e1

TMS320DM6443BZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

316

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

20480

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B316

3

Not Qualified

e1

XC7Z010-1CLG400C

Xilinx

SYSTEM ON CHIP

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1 V

.8 mm

S-PBGA-B400

3

e1

XC7Z010-1CLG400I

Xilinx

SYSTEM ON CHIP

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1 V

.8 mm

S-PBGA-B400

3

e1

XC7Z010-2CLG400E

Xilinx

SYSTEM ON CHIP

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1 V

.8 mm

S-PBGA-B400

3

e1

XC7Z010-2CLG400I

Xilinx

SYSTEM ON CHIP

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1 V

.8 mm

S-PBGA-B400

3

e1

XC7Z010-3CLG400E

Xilinx

SYSTEM ON CHIP

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1 V

.8 mm

S-PBGA-B400

3

e1

XC7Z020-1CLG400I

Xilinx

SYSTEM ON CHIP

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1 V

.8 mm

S-PBGA-B400

3

e1

XC7Z020-1CLG484C

Xilinx

SYSTEM ON CHIP

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

.95 V

85 Cel

0 Cel

BOTTOM

1.6 mm

19 mm

19 mm

CMOS

1 V

.8 mm

S-PBGA-B484

XC7Z020-1CLG484I

Xilinx

SYSTEM ON CHIP

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

.95 V

100 Cel

-40 Cel

BOTTOM

1.6 mm

19 mm

19 mm

CMOS

1 V

.8 mm

S-PBGA-B484

XC7Z020-2CLG400E

Xilinx

SYSTEM ON CHIP

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1 V

.8 mm

S-PBGA-B400

3

e1

XC7Z020-2CLG484E

Xilinx

SYSTEM ON CHIP

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

.95 V

100 Cel

0 Cel

BOTTOM

1.6 mm

19 mm

19 mm

CMOS

1 V

.8 mm

S-PBGA-B484

XC7Z020-2CLG484I

Xilinx

SYSTEM ON CHIP

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

.95 V

100 Cel

-40 Cel

BOTTOM

1.6 mm

19 mm

19 mm

CMOS

1 V

.8 mm

S-PBGA-B484

XC7Z020-3CLG400E

Xilinx

SYSTEM ON CHIP

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1 V

.8 mm

S-PBGA-B400

3

e1

XC7Z020-3CLG484E

Xilinx

SYSTEM ON CHIP

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

.95 V

100 Cel

0 Cel

BOTTOM

1.6 mm

19 mm

19 mm

CMOS

1 V

.8 mm

S-PBGA-B484

TMS320DM368ZCE48

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

30

260

13 mm

CMOS

1.35 V

.65 mm

S-PBGA-B338

3

e1

TMS320DM368ZCED48F

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.28 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.35 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320DM6467CCUT4

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUTAV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUTD7

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUTV

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CGUTA6

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

20

220

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e0

TMS320DM6467TCUT1

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TCUT9

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TCUTD1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TZUT9

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS32DM6467CCUTAV6

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

XC7Z030-1FFG676I

Xilinx

SYSTEM ON CHIP

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA676,26X26,40

.95 V

100 Cel

-40 Cel

BOTTOM

3.24 mm

27 mm

27 mm

CMOS

1 V

1 mm

S-PBGA-B676

LM8330TME/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

128

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

1.62 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

20

.675 mm

2.01 mm

30

260

2.01 mm

CMOS

.03 mA

1.8 V

.4 mm

S-PBGA-B25

1

e1

20

LM8330TMX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

128

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

1.62 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

20

.675 mm

2.01 mm

30

260

2.01 mm

CMOS

.03 mA

1.8 V

.4 mm

S-PBGA-B25

1

e1

20

TMS320DM6467CCUTA6

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUTA

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUTV6

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

XC7Z030-2FFG676I

Xilinx

SYSTEM ON CHIP

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA676,26X26,40

.95 V

100 Cel

-40 Cel

BOTTOM

3.24 mm

27 mm

27 mm

CMOS

1 V

1 mm

S-PBGA-B676

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.