NO LEAD Other Function uPs,uCs & Peripheral ICs 285

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
CC1310F32RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	5 mm			NOT SPECIFIED	260	5 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N32	3		e4
CC1310F32RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	4 mm			NOT SPECIFIED	260	4 mm	28672	CMOS	3.3 V		.4 mm	S-PQCC-N32	3		e4
CC1310F64RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	7 mm			NOT SPECIFIED	260	7 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N48	3		e4
CC1310F64RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	5 mm			NOT SPECIFIED	260	5 mm	28672	CMOS	3.3 V		.5 mm	S-PQCC-N32	3		e4
CC1310F64RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	4 mm			NOT SPECIFIED	260	4 mm	28672	CMOS	3.3 V		.4 mm	S-PQCC-N32	3		e4
EM341-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel	MATTE TIN		QUAD	.9 mm	7 mm			40	260	7 mm		CMOS	1.25 V		.5 mm	S-PQCC-N48	2		e3
6AV2181-8XP00-0AX0	Siemens	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES			UNCASED CHIP			50 Cel		0 Cel			UPPER					NOT SPECIFIED	NOT SPECIFIED			CMOS	3.3 V			R-XUUC-N
EFR32MG1B132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm	5 mm					5 mm		CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32MG1V132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm	5 mm					5 mm		CMOS	3.3 V		.5 mm	S-XQCC-N32
MKW21Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD					40	260			CMOS	3.3 V			S-XQCC-N48	3		e4
MKW31Z512VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD					40	260			CMOS	3.3 V			S-XQCC-N48	3		e4
MKW41Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD					40	260			CMOS	3.3 V			S-XQCC-N48	3		e4
MKW41Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD					40	260			CMOS	3.3 V			S-XQCC-N48	3		e4
UCD3138ARJAR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES	QUAD	1 mm	6 mm			30	260	6 mm		CMOS	3.3 V		.5 mm	S-PQCC-N40	2		e4
UCD3138ARJAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES	QUAD	1 mm	6 mm			30	260	6 mm		CMOS	3.3 V		.5 mm	S-PQCC-N40	2		e4
EFR32MG1V132F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm	5 mm					5 mm		CMOS	3.3 V		.5 mm	S-XQCC-N32
STWBC-WATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	105 Cel		-40 Cel			QUAD	1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS	3.3 V		.5 mm	S-XQCC-N32
STWBC-WA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	105 Cel		-40 Cel			QUAD	1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS	3.3 V		.5 mm	S-XQCC-N32
MF3ICDH2101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel		-25 Cel			UPPER									CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3ICDH4101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel		-25 Cel			UPPER									CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3ICDH8101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel		-25 Cel			UPPER									CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3MODH2101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel		-25 Cel			UNSPECIFIED									CMOS				X-PXMA-N
MF3MODH2101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel		-25 Cel			UNSPECIFIED									CMOS				X-PXMA-N
MF3MODH4101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel		-25 Cel			UNSPECIFIED									CMOS				X-PXMA-N
MF3MODH8101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel		-25 Cel			UNSPECIFIED									CMOS				X-PXMA-N
MF3MODH8101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel		-25 Cel			UNSPECIFIED									CMOS				X-PXMA-N
ATWILC1000B-MU-Y	Microchip Technology	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		85 Cel		-40 Cel	MATTE TIN		QUAD	1 mm	5 mm					5 mm		CMOS	1.1 V		.4 mm	S-XQCC-N40
EFR32FG1P131F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm	7 mm					7 mm		CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32FG1P131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm	7 mm					7 mm		CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32FG1V131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm	7 mm					7 mm		CMOS	3.3 V		.5 mm	S-XQCC-N48
MPXY8510DK016T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel		-40 Cel			QUAD	2.3 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm		CMOS	3 V		.65 mm	S-XQCC-N32
MPXY8600DK6T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel		-40 Cel			QUAD	2.3 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm		CMOS	3 V		.65 mm	S-XQCC-N32
JN5169-001-M03-2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	27		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2 V	85 Cel		-40 Cel			UNSPECIFIED		16 mm					21 mm		CMOS	3.3 V		1.27 mm	R-XXMA-N27
AX-SFUS-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM		QUAD	1 mm	5 mm			30	260	7 mm		CMOS	3 V		.5 mm	R-XQCC-N40	1
AX-SFUS-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM		QUAD	1 mm	5 mm			30	260	7 mm		CMOS	3 V		.5 mm	R-XQCC-N40	1
NRF52810-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel			QUAD	.95 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS	3 V		.4 mm	S-XQCC-N48
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	7 mm	DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF		30	260	7 mm	81920	CMOS	3 V		.5 mm	S-PQCC-N48	3		e4	30
ATWINC1500-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949	MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel		-40 Cel			UNSPECIFIED	2.11 mm	14.73 mm		48 MHz	NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS	3.3 V			R-XXMA-N28
ATWINC1510-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949	MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel		-40 Cel			UNSPECIFIED	2.11 mm	14.73 mm		48 MHz			21.72 mm		CMOS	3.3 V			R-XXMA-N28
EFR32FG12P431F1024IM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	125 Cel		-40 Cel			QUAD	.9 mm	7 mm					7 mm		CMOS	1.8 V		.5 mm	S-XQCC-N48
EFR32FG12P231F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm	8 mm					8 mm		CMOS	1.8 V		.4 mm	S-XQCC-N68
EFR32FG12P231F512GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm	8 mm					8 mm		CMOS	1.8 V		.4 mm	S-XQCC-N68
EFR32FG12P431F1024GM68-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm	8 mm			30	260	8 mm		CMOS	1.8 V		.4 mm	S-XQCC-N68	3
EFR32FG12P431F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm	8 mm					8 mm		CMOS	1.8 V		.4 mm	S-XQCC-N68
EFR32FG12P433F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm	8 mm					8 mm		CMOS	1.8 V		.4 mm	S-XQCC-N68
EFR32BG12P432F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm	7 mm					7 mm		CMOS	1.8 V		.5 mm	S-XQCC-N48
AX8052F143-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	5 mm				260	7 mm		CMOS	3 V		.5 mm	R-PQCC-N40	1		e4
AX8052F143-2-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM		QUAD	1 mm	5 mm			30	260	7 mm		CMOS	3 V		.5 mm	R-PQCC-N40	1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.