Infineon Technologies Other Function uPs,uCs & Peripheral ICs 142

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Additional Features	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)
CY8C6144AZI-S4F62	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144AZQ-S4F92	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144AZI-S4F12	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D82	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQQ-S4D92	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244LQI-S4D62	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244AZI-S4D83	Infineon Technologies	SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	12 mm		12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6244AZQ-S4D93	Infineon Technologies	SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	12 mm		12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6244AZI-S4D12	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D62	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQI-S4D82	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244AZQ-S4D92	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQI-S4D12	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CYW54907KWBGT	Infineon Technologies	SYSTEM ON CHIP	BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA316(UNSPEC)	1.14 V	85 Cel	-30 Cel	BOTTOM	.33 mm	4.907 mm	MINIMUM BUMP PITCH IS CONSIDERED	5.848 mm	CMOS	1.2 V	.2 mm	R-PBGA-B316
CY8C4147LQS-S295	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	105 Cel	-40 Cel	QUAD	.9 mm	9 mm		9 mm	CMOS	3.3 V	.5 mm	S-XQCC-N64
CY8C4147LQS-S475	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	105 Cel	-40 Cel	QUAD	.9 mm	9 mm		9 mm	CMOS	3.3 V	.5 mm	S-XQCC-N64
CY8C4147LQS-S265	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	105 Cel	-40 Cel	QUAD	.9 mm	9 mm		9 mm	CMOS	3.3 V	.5 mm	S-XQCC-N64
CY8C4548AZI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4547AXI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	14 mm		14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AXQ-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	14 mm		14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AZI-S455	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4547AZI-S473	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4548AZI-S485	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4548AZQ-S483	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4546AXI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	14 mm		14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AZI-S453	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4547AZI-S463	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4547AZQ-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4548AXI-S485	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	14 mm		14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AZQ-S473	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4547AZQ-S455	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4548AZI-S483	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4546AZI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4546AZI-S473	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4548AZQ-S485	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4548AXQ-S485	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	14 mm		14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4548AXI-S475	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	14 mm		14 mm	CMOS	3.3 V	.8 mm	S-PQFP-G64
CY8C4547AZQ-S453	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	3.3 V	.5 mm	S-PQFP-G48
CY8C4547AZI-S465	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	QUAD	1.6 mm	10 mm		10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CYS0644AFNI-S2D43T	Infineon Technologies	PROGRAMMABLE SoC	BALL	100	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,12X17,16	1.7 V	85 Cel	-40 Cel	BOTTOM	.467 mm	3.9025 mm		4.1068 mm	CMOS	1.8 V	.42 mm	R-PBGA-B100
CY8C4248BZS-L489	Infineon Technologies	PROGRAMMABLE SoC	BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.71 V	105 Cel	-40 Cel	BOTTOM	1 mm	9 mm		9 mm	CMOS	3.3 V	.65 mm	S-PBGA-B241	3
CYPM1211-42FNXIT	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16	2.7 V	105 Cel	-40 Cel	BOTTOM	.55 mm	2.633 mm		3.184 mm	CMOS	3.3 V	.4 mm	R-PBGA-B42
CY8C4045AZQ-S413	Infineon Technologies	PSoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel	QUAD	1.6 mm	7 mm		7 mm	CMOS	1.8 V	.5 mm	S-PQFP-G48
CY8C20055-24SXI	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	16		RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				1.71 V	85 Cel	-40 Cel	DUAL					CMOS			R-PDSO-G16	3
CY8C614ALQI-S2F02	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68
CY8C614ALQI-S2F42	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.