Microchip Technology Other Function uPs,uCs & Peripheral ICs 88

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
AR1100T-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm	ALSO OPERATES AT 5V SUPPLY					5 mm	CMOS		3.3 V			.65 mm	S-PQCC-N20			e3
MCP2221-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949		3.3/5	IN-LINE	DIP14,.3	3 V	85 Cel	-40 Cel	MATTE TIN	DUAL	5.334 mm	7.62 mm						19.05 mm	CMOS	15 mA	3.3 V	Serial IO/Communication Controllers		2.54 mm	R-PDIP-T14		Not Qualified	e3
MTCH6102-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	TS 16949			SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm				40	260	10.2 mm	CMOS		3 V			.65 mm	R-PDSO-G28	2		e3
MCP25020-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN	DUAL	4.318 mm	7.62 mm						19.05 mm	CMOS		5 V	Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified	e3
MCP25020-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm					260	8.65 mm	CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MCP25025-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MCP25025T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MCP25050-E/P	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	5	IN-LINE	DIP14,.3	4.5 V	125 Cel	-40 Cel	MATTE TIN	DUAL	4.318 mm	7.62 mm						19.05 mm	CMOS		5 V	Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified	e3
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MCP25050-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN	DUAL	4.318 mm	7.62 mm					260	19.05 mm	CMOS		5 V	Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified	e3
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MCP25055-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN	DUAL	4.318 mm	7.62 mm						19.05 mm	CMOS		5 V	Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified	e3
MCP25055-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MCP25055T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
ATWINC1500B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			48 MHz			5 mm	CMOS		3.3 V			.4 mm	S-PQCC-N40			e3
ATWINC1510B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			48 MHz			5 mm	CMOS		3.3 V			.4 mm	S-PQCC-N40			e3
ATECC608A-TFLXTLSS	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS					1.27 mm	R-PDSO-G8			e4
ATTPM20P-G3MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	1.8 V	70 Cel	0 Cel		DUAL	.6 mm	2 mm						3 mm	CMOS				SPI	.5 mm	R-PDSO-N8
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	7 mm	3.3V NOM SUPPLY ALSO AVAILABLE					7 mm	CMOS		1.8 V		I2C, QSPI, UART	.65 mm	S-PBGA-B84
MPFS250TL-FCG1152I	Microchip Technology	SoC FPGA		BALL	1152		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel	-40 Cel		BOTTOM									CMOS						R-PBGA-B1152
BM83SM1-00TB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel		UNSPECIFIED	2.5 mm	15 mm						32 mm	CMOS		3.8 V			1 mm	R-XXMA-N50
ATWINC1500-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS		3.3 V				R-XXMA-N28
ATWINC1500-MR210UB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS		3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS		3.3 V				R-XXMA-N28
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	9 mm						9 mm	CMOS		3 V			.65 mm	S-PBGA-B144			e1
ATWILC1000B-MU-Y	Microchip Technology	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm						5 mm	CMOS		1.1 V			.4 mm	S-XQCC-N40
ATWINC1500-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949			MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel	-40 Cel		UNSPECIFIED	2.11 mm	14.73 mm			48 MHz	NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949			MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel	-40 Cel		UNSPECIFIED	2.11 mm	14.73 mm			48 MHz			21.72 mm	CMOS		3.3 V				R-XXMA-N28
RN2903A-I/RM098	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949			MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel	-40 Cel	NICKEL GOLD	UNSPECIFIED	3.34 mm	17.78 mm					250	26.67 mm	CMOS		3.3 V			1.27 mm	R-XXMA-N47			e4
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel	-40 Cel		BOTTOM	1 mm	7 mm						7 mm	CMOS		3.3 V			.65 mm	S-PBGA-B100
ATMXT224S-MAUR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm						6 mm	CMOS		1.8 V			.35 mm	S-XQCC-N56
ATWINC1500-MR210PB1952-T	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm				NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.3 V			1.016 mm	R-XXMA-N28
ATMXT224T-CCU027	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,8X8,20	3 V	85 Cel	-40 Cel		BOTTOM	.6 mm	5 mm						5 mm	CMOS		3.3 V			.5 mm	S-PBGA-B64
ATWINC1500-MR210PB1172	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS		3.3 V				R-XXMA-N28
ATWINC1500-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm				NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS		3.3 V				R-XXMA-N28
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE					9 mm	CMOS		1.8 V			.65 mm	S-PBGA-B144
ATSAMA5D27-WLSOM1	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	188	DIE	SQUARE	UNSPECIFIED	YES	5.5 V				UNCASED CHIP		3 V	85 Cel	-40 Cel		UPPER						NOT SPECIFIED	NOT SPECIFIED		CMOS		3.3 V				S-XUUC-N188
ATWINC1500-MR210PB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.6 V				R-XXMA-N28
ATWINC1500-MR210UB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.6 V				R-XXMA-N28
ECE1200-I/LD	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm						5 mm	CMOS		1.8 V			.4 mm	S-PQCC-N40
BM83SM1-00AB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS		3.8 V			1 mm	R-XXMA-N50	1
BM83SM1-00TA	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS		3.8 V			1 mm	R-XXMA-N50	1
ATECC608B-TNGTLSS-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS					1.27 mm	R-PDSO-G8			e4
ATECC608B-TFLXTLSS-PROTO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS					1.27 mm	R-PDSO-G8			e4
ATECC608B-TNGTLSU-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS					.5 mm	R-PDSO-N8			e4
ATECC608B-TFLXTLSU	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS					.5 mm	R-PDSO-N8			e4
ATECC608B-TNGTLSU-C	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS					.5 mm	R-PDSO-N8			e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.