Onsemi Other Function uPs,uCs & Peripheral ICs 28

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

R3910-CFAB-E1B

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.525 mm

3.81 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

R-XXMA-N25

R3910-CFAB-E1T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.525 mm

3.81 mm

SEATED HGT-NOM

30

260

5.59 mm

CMOS

1.25 V

R-XXMA-N25

3

SA3291A-E1-T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.777 mm

3.68 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

6.35 mm

CMOS

1.25 V

R-XXMA-N32

SB3229-E1-T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.525 mm

3.81 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

R-XXMA-N25

SB3229-E1

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.525 mm

3.81 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

R-XXMA-N25

SB3231-E1-T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.525 mm

3.81 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

R-XXMA-N25

SB3231-E1

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.525 mm

3.81 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

R-XXMA-N25

SA3229-E1-T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

25

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

40 Cel

0 Cel

BOTTOM

1.781 mm

3.18 mm

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

R-PBCC-B25

SA3229-E1

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

25

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

40 Cel

0 Cel

BOTTOM

1.781 mm

3.18 mm

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

R-PBCC-B25

SA3291A-E1

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.777 mm

3.68 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

6.35 mm

CMOS

1.25 V

R-XXMA-N32

R3920-CFAB-E1T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

25

BCC

RECTANGULAR

PLASTIC/EPOXY

NO

YES

CHIP CARRIER

LGA25,3X8,27

40 Cel

0 Cel

BOTTOM

1.781 mm

3.18 mm

NO

4.218 MHz

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

.686 mm

FIXED POINT

R-PBCC-B25

AX8052F151-2-TX30

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.28,20

2.2 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

260

7 mm

CMOS

3 V

.5 mm

R-PQCC-N40

1

e4

AX8052F151-3-TX30

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.28,20

2.2 V

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

1 mm

5 mm

30

260

7 mm

CMOS

3 V

.5 mm

R-PQCC-N40

1

LC898123F40XC-VH

Onsemi

MICROPROCESSOR CIRCUIT

OTHER

BALL

35

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.6 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

.45 mm

2.3 mm

30

260

3.22 mm

CMOS

2.8 V

.4 mm

R-PBGA-B35

1

e1

LC898124EP2XC-MH

Onsemi

MICROPROCESSOR CIRCUIT

OTHER

BALL

27

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.6 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

.33 mm

1.3 mm

30

260

3.89 mm

CMOS

2.8 V

.4 mm

R-PBGA-B27

1

e1

AX-SFUS-1-01-TB05

Onsemi

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

1 mm

5 mm

30

260

7 mm

CMOS

3 V

.5 mm

R-XQCC-N40

1

AX-SFUS-API-1-01-TB05

Onsemi

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

1 mm

5 mm

30

260

7 mm

CMOS

3 V

.5 mm

R-XQCC-N40

1

AX-SIP-SFEU-1-01-TX30

Onsemi

MICROPROCESSOR CIRCUIT

OTHER

BUTT

44

HVBCC

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

85 Cel

-30 Cel

NICKEL GOLD PALLADIUM

BOTTOM

.996 mm

7 mm

30

260

9 mm

CMOS

3 V

R-XBCC-B44

3

AX-SIP-SFEU-API-1-01-TX30

Onsemi

MICROPROCESSOR CIRCUIT

OTHER

BUTT

44

HVBCC

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

85 Cel

-30 Cel

NICKEL GOLD PALLADIUM

BOTTOM

.996 mm

7 mm

30

260

9 mm

CMOS

3 V

R-XBCC-B44

3

AX8052F143-2-TB05

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

LCC28,.35X.55

2.2 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

260

7 mm

CMOS

3 V

.5 mm

R-PQCC-N40

1

e4

AX8052F143-2-TX30

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.28,20

1.8 V

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

1 mm

5 mm

30

260

7 mm

CMOS

3 V

.5 mm

R-PQCC-N40

1

AX8052F143-3-TB05

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

LCC28,.35X.55

2.2 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

260

7 mm

CMOS

3 V

.5 mm

R-PQCC-N40

1

e4

AX8052F131-2-TB05

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

LCC28,.35X.55

2.2 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

260

7 mm

CMOS

3 V

.5 mm

S-PQCC-N28

1

e4

AX8052F131-2-TX30

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

LCC40,.2X.28,20

2.2 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

260

7 mm

CMOS

3 V

.5 mm

R-PQCC-N40

1

e4

AX8052F131-3-TB05

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

LCC28,.35X.55

2.2 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

260

7 mm

CMOS

3 V

.5 mm

S-PQCC-N28

1

e4

AX8052F131-3-TX30

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.28,20

1.8 V

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

1 mm

5 mm

30

260

7 mm

CMOS

3 V

.5 mm

R-PQCC-N40

1

AX8052F151-2-TB05

Onsemi

SYSTEM ON CHIP

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.35X.55

2.2 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

260

7 mm

CMOS

3 V

.5 mm

R-PQCC-N40

1

e4

LC898128DP1XHTBG

Onsemi

MICROPROCESSOR CIRCUIT

TIN SILVER

30

260

1

e2

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.