Xilinx Other Function uPs,uCs & Peripheral ICs 979

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XC7Z100-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z100-2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.1 mm	35 mm			35 mm	CMOS	1 V		1 mm	S-PBGA-B1156
XC7Z100-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XA7Z010-1CLG225Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32		125 Cel	-40 Cel	TIN SILVER COPPER	N	BOTTOM	1.5 mm	13 mm			13 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B225	3	Not Qualified	e1
XA7Z010-1CLG400I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32				Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm	30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm	30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
XA7Z020-1CLG400I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32				Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm	30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
XA7Z020-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm	30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
XA7Z020-1CLG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN SILVER COPPER	N	BOTTOM	1.6 mm	19 mm	30	260	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e1
XA7Z030-1FBG484I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY	BGA484,22X22,40				Tin/Silver/Copper (Sn/Ag/Cu)	N	BOTTOM	2.54 mm	23 mm	30	250	23 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B484	4	Not Qualified	e1
XA7Z030-1FBG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY	BGA484,22X22,40		125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	N	BOTTOM	2.54 mm	23 mm	30	250	23 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B484	4	Not Qualified	e1
XC7Z010-L1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z010-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z015-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z015-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z015-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z015-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z015-3CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z015-L1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z020-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z020-L1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z030-1SBG485C	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	2.44 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-1SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	2.44 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-2SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM	2.44 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	2.44 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-3SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM	2.44 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z030-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-L2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	2.44 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z035-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-1FFG900C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel			BOTTOM	3.35 mm	31 mm			31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-1FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.35 mm	31 mm			31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.35 mm	31 mm			31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.35 mm	31 mm			31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.35 mm	31 mm			31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-L2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.35 mm	31 mm			31 mm	CMOS	1 V		1 mm	S-PBGA-B900

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.