128 Serial Communication Controllers 17

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
TSB42AB4PDTG4	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES			0	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		70 Cel	50 MBps	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1.2 mm	14 mm		NO	0		ASYNC, BIT		NOT SPECIFIED	260	14 mm	CMOS		3.3 V		Bus Controllers	68000; 68020	.4 mm	S-PQFP-G128	3	Not Qualified	NO	e4
LAN91C111I-NS	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	TS 16949	16		FLATPACK, FINE PITCH	QFP128,.70x.94,20	2.97 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	3.4 mm	14 mm		NO	32	NRZ; BIPH-LEVEL(MANCHESTER)	SYNC, BIT, BYTE, ETHERNET	25 MHz		245	20 mm	CMOS	140 mA	3.3 V	4		680X0; 683XX	.5 mm	R-PQFP-G128	3	Not Qualified	YES	e3
LAN91C111I-NU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V	TS 16949	16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	2.97 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm	14 mm		NO	32	NRZ; BIPH-LEVEL(MANCHESTER)	SYNC, BIT, BYTE, ETHERNET	25 MHz		260	14 mm	CMOS	140 mA	3.3 V	4		680X0; 683XX	.4 mm	S-PQFP-G128	3	Not Qualified	YES	e3
STE10/100A	STMicroelectronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.46 V		32	5	FLATPACK, FINE PITCH	QFP128,.67X.93,20	3.14 V	70 Cel	12.5 MBps	0 Cel	NICKEL PALLADIUM GOLD	QUAD	3.4 mm	14 mm		NO	32	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz			20 mm	CMOS		3.3 V	1	Serial IO/Communication Controllers	PCI	.5 mm	R-PQFP-G128		Not Qualified	YES	e4
TSB43AA22PDT	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32		FLATPACK, THIN PROFILE, FINE PITCH		3 V	70 Cel	50 MBps	0 Cel		QUAD	1.2 mm	14 mm		NO	32			24.576 MHz			14 mm	CMOS		3.3 V	2		PCI	.4 mm	S-PQFP-G128	3	Not Qualified	YES
LAN91C111-NC	Standard Microsystems	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V		16	3.3	FLATPACK, FINE PITCH	QFP128,.67X.93,20	2.97 V	85 Cel	12.5 MBps	0 Cel	TIN LEAD	QUAD	3.4 mm	14 mm		NO	32	NRZ; BIPH-LEVEL(MANCHESTER)		25 MHz		235	20 mm	CMOS	140 mA	3.3 V	2	Serial IO/Communication Controllers	ARM; SH; POWERPC; COLDFIRE; 680X0; 683XX; MIPS R3000	.5 mm	R-PQFP-G128	3	Not Qualified	YES	e0
TSB43AB22APDT	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32	1.8,3,3.3,3.3/5	FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	3 V	70 Cel	50 MBps	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.2 mm	14 mm		NO	32		IEEE1394	24.576 MHz	30	260	14 mm	CMOS		3.3 V	1	Bus Controllers	PCI	.4 mm	S-PQFP-G128	3	Not Qualified	YES	e4	2
TSB43AB21PDT	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	2 V		32	1.8,3,3.3,3.3/5	FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	1.6 V	70 Cel	50 MBps	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.05 mm	14 mm		NO	32			24.576 MHz	30	260	14 mm	CMOS		1.8 V	2	Bus Controllers	PCI	.4 mm	S-PQFP-G128	3	Not Qualified	YES	e4
TSB43AB22APDTG4	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32	1.8,3,3.3,3.3/5	FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	3 V	70 Cel	50 MBps	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.2 mm	14 mm		NO	32		IEEE1394	24.576 MHz	30	260	14 mm	CMOS		3.3 V	1	Bus Controllers	PCI	.4 mm	S-PQFP-G128	3	Not Qualified	YES	e4	2
ADM6996F-AA-T-1	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1.9 V				FLATPACK, FINE PITCH		1.7 V		12.5 MBps			QUAD	3.4 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO		NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz		220	20 mm	CMOS		1.8 V	7			.5 mm	R-PQFP-G128	3	Not Qualified	NO
ADM6995LCX-AC-T-1	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, FINE PITCH		1.71 V		12.5 MBps			QUAD	3.4 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO		NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz		260	20 mm	CMOS		1.8 V	5			.5 mm	R-PQFP-G128	3	Not Qualified	NO
ADM6996LCX-AC-T-1	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, FINE PITCH		1.71 V		12.5 MBps			QUAD	3.4 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO		NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz		260	20 mm	CMOS		1.8 V	6			.5 mm	R-PQFP-G128		Not Qualified	NO
ADM6996FCX-AC-T-1	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, FINE PITCH		1.71 V		12.5 MBps			QUAD	3.4 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO		NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz		260	20 mm	CMOS		1.8 V	6			.5 mm	R-PQFP-G128		Not Qualified	NO
ADM6996FHX-AC-T-1	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	HFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, HEAT SINK/SLUG, FINE PITCH		1.71 V		12.5 MBps		MATTE TIN	QUAD	3.4 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO		NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz			20 mm	CMOS		1.8 V	6			.5 mm	R-PQFP-G128		Not Qualified	NO	e3
ADM6996LHX-AC-T-1	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	HFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, HEAT SINK/SLUG, FINE PITCH		1.71 V		12.5 MBps		MATTE TIN	QUAD	3.4 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	NO		NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz			20 mm	CMOS		1.8 V	6			.5 mm	R-PQFP-G128		Not Qualified	NO	e3
KSZ8841-16MVLI-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.5 V		15		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	3.1 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1.6 mm	14 mm		YES	16	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz			14 mm	CMOS		3.3 V				.4 mm	S-PQFP-G128			YES
LAN91C113-NU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V		16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	2.97 V	85 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm	14 mm		NO	16	NRZ; BIPH-LEVEL(MANCHESTER)	BIT, BYTE, ETHERNET	25 MHz			14 mm	CMOS	140 mA	3.3 V	7		680X0; 683XX	.4 mm	S-PQFP-G128			YES	e3

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.