SQUARE Serial Communication Controllers 408

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Low Power Mode	JESD-609 Code	No. of I/O Lines
LAN9252TI/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V	4	I2C, SPI	.5 mm	S-XQCC-N64		YES
LAN9252TI/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	16	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			10 mm	CMOS		3.3 V	4	I2C, SPI	.5 mm	S-PQFP-G64		YES
LAN9252TV/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	105 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V	4	I2C, SPI	.5 mm	S-XQCC-N64		YES
LAN9252T/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V	4	I2C, SPI	.5 mm	S-XQCC-N64		YES
LAN9252/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	16	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			10 mm	CMOS		3.3 V	4	I2C, SPI	.5 mm	S-PQFP-G64		YES
PI7C9X1170CZDEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V			0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel	4.125 MBps	-40 Cel		QUAD	.9 mm		4 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	0		ASYNC, BIT	64 MHz	30	260	4 mm	CMOS		3.3 V	1	I2C; IRDA; RS-232; RS-485; SPI	.5 mm	S-XQCC-N24		NO
PI7C9X760CZDEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	2.75 V			2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.25 V	85 Cel	4.125 MBps	-40 Cel		QUAD	.9 mm		4 mm	also operates with 3.3v @ 64mhz and 1.8v @ 32mhz and 24mhz	NO	0		ASYNC, BIT	250 MHz	NOT SPECIFIED	NOT SPECIFIED	4 mm	CMOS	6 mA	2.5 V	1	I2C; IRDA; RS-232; RS-485; SPI; UART	.5 mm	S-XQCC-N24		YES		8
PI7C9X752FAEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ,20	1.62 V	85 Cel	2 MBps	-40 Cel		QUAD	1.2 mm		7 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	8		ASYNC, BIT	80 MHz	NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS	15 mA	1.8 V		IRDA; RS-232; RS-485	.5 mm	S-PQFP-G48		NO
LAN7431-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V	4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
LAN7431-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V	4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
LAN7431T-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V	4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
LAN7431T-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V	4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
LAN7431T/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	70 Cel	256 MBps	0 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V	4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
MCP2515-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20		YES	e3	0
MCP2515T-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V	1	SPI	.5 mm	S-PQCC-N20		YES	e3	0
LAN9253T/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V	4	I2C; SPI	.5 mm	S-XQCC-N64		YES
LAN9253-I/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V	4	I2C; SPI	.5 mm	S-XQCC-N64		YES
LAN9253T-I/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V	4	I2C; SPI	.5 mm	S-XQCC-N64		YES
LAN9253T-V/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	105 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V	4	I2C; SPI	.5 mm	S-XQCC-N64		YES
LAN9253/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V	4	I2C; SPI	.5 mm	S-XQCC-N64		YES
Z16C3010AEG	Zilog	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	GULL WING	100	FQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16	FLATPACK, FINE PITCH	QFP100,.63SQ,20	4.5 V	105 Cel	1.25 MBps	-40 Cel	TIN	QUAD	1.8 mm		14 mm		NO	16			10 MHz	20	260	14 mm	CMOS	50 mA	5 V			.5 mm	S-PQFP-G100	3	YES	e3	13
BCM5720A0KFBG	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, LAN		BALL	169	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			55 Cel		0 Cel		BOTTOM				3.3V to 1.2V Voltage Regulator Control available	YES			SYNC, BIT, BYTE, ETHERNET	24 MHz		260		CMOS				PCI, SMBUS		S-PBGA-B169	3	YES
FT4232HAQ-REEL	FTDI	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.08 V	105 Cel	60 MBps	-40 Cel		QUAD	.8 mm		9 mm		YES			ASYNC, BIT; SYNC, BYTE	12 MHz	40	260	9 mm	CMOS		1.2 V	4	I2C; RS-232; RS-422; RS-485; SPI; UART; USB	.5 mm	S-XQCC-N64	3	YES		8
W6100	Wiznet	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8			FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.97 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1.6 mm		7 mm		NO	8		SYNC, BYTE; ETHERNET	70 MHz			7 mm	CMOS		3.3 V		SPI	.5 mm	S-PQFP-G48		YES

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.