SERIAL IO/COMMUNICATION CONTROLLER, LAN Serial Communication Controllers 64

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Maximum Data Transfer Rate Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Additional Features Boundary Scan Peripherals External Data Bus Width Data Encoding or Decoding Method Communication Protocol Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) No. of Timers RAM Bytes Technology Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Drive Interface Standard Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

LAN7850/8JX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

NO LEAD

56

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.26 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

1.1 V

70 Cel

125 MBps

0 Cel

QUAD

1 mm

8 mm

YES

0

ASYNC, BIT; SYNC, BYTE

25 MHz

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

183 mA

1.2 V

2

USB

.5 mm

S-PQCC-N56

YES

LAN7850T-I/8JX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.26 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

1.1 V

85 Cel

125 MBps

-40 Cel

QUAD

1 mm

8 mm

YES

0

ASYNC, BIT; SYNC, BYTE

25 MHz

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

183 mA

1.2 V

2

USB

.5 mm

S-PQCC-N56

YES

LAN9252T/PT

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

70 Cel

12.5 MBps

0 Cel

MATTE TIN

QUAD

1.2 mm

10 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

10 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-PQFP-G64

YES

LAN9252TI/ML

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

TS 16949

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

9 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-XQCC-N64

YES

LAN9252TI/PT

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

85 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1.2 mm

10 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

10 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-PQFP-G64

YES

LAN9252TV/ML

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

TS 16949

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

105 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

9 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-XQCC-N64

YES

LAN9252T/ML

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

TS 16949

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

70 Cel

12.5 MBps

0 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

9 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-XQCC-N64

YES

LAN9252/PT

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

70 Cel

12.5 MBps

0 Cel

MATTE TIN

QUAD

1.2 mm

10 mm

YES

16

NRZI

SYNC, BYTE; ETHERNET

25 MHz

10 mm

CMOS

3.3 V

4

I2C, SPI

.5 mm

S-PQFP-G64

YES

MCP2517FD-H/SLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

AEC-Q100; TS 16949

0

SMALL OUTLINE

SOP14,.25

2.7 V

150 Cel

1 MBps

-40 Cel

DUAL

1.75 mm

2048

3.9 mm

NO

0

CAN FD

40 MHz

8.65 mm

CMOS

20 mA

1

SPI

1.27 mm

R-PDSO-G14

YES

2

LAN9253T/R4X

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1.26 V

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.14 V

70 Cel

12.5 MBps

0 Cel

QUAD

1 mm

9 mm

YES

16

NRZI

SYNC, BYTE

25 MHz

9 mm

CMOS

1.2 V

4

I2C; SPI

.5 mm

S-XQCC-N64

YES

LAN9253-I/R4X

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1.26 V

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.14 V

85 Cel

12.5 MBps

-40 Cel

QUAD

1 mm

9 mm

YES

16

NRZI

SYNC, BYTE

25 MHz

9 mm

CMOS

1.2 V

4

I2C; SPI

.5 mm

S-XQCC-N64

YES

LAN9253T-I/R4X

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1.26 V

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.14 V

85 Cel

12.5 MBps

-40 Cel

QUAD

1 mm

9 mm

YES

16

NRZI

SYNC, BYTE

25 MHz

9 mm

CMOS

1.2 V

4

I2C; SPI

.5 mm

S-XQCC-N64

YES

LAN9253T-V/R4X

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1.26 V

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.14 V

105 Cel

12.5 MBps

-40 Cel

QUAD

1 mm

9 mm

YES

16

NRZI

SYNC, BYTE

25 MHz

9 mm

CMOS

1.2 V

4

I2C; SPI

.5 mm

S-XQCC-N64

YES

LAN9253/R4X

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1.26 V

16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.14 V

70 Cel

12.5 MBps

0 Cel

QUAD

1 mm

9 mm

YES

16

NRZI

SYNC, BYTE

25 MHz

9 mm

CMOS

1.2 V

4

I2C; SPI

.5 mm

S-XQCC-N64

YES

BCM5720A0KFBG

Broadcom

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

55 Cel

0 Cel

BOTTOM

3.3V to 1.2V Voltage Regulator Control available

YES

SYNC, BIT, BYTE, ETHERNET

24 MHz

260

CMOS

PCI, SMBUS

S-PBGA-B169

3

YES

ENC28J60/SO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

8

TS 16949

0

SMALL OUTLINE

SOP28,.4

3.1 V

70 Cel

1.25 MBps

0 Cel

DUAL

2.65 mm

8192

7.5 mm

NO

0

SYNC, BIT, BYTE, ETHERNET

25 MHz

17.9 mm

CMOS

180 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G28

YES

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.