| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3 V |
85 Cel |
50 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
20 mm |
NO |
16 |
IEEE1394A |
24.576 MHz |
30 |
260 |
20 mm |
CMOS |
3.3 V |
2 |
Bus Controllers |
.5 mm |
S-PQFP-G144 |
1 |
Not Qualified |
YES |
e4 |
|||||||||||||||||||||||||||||
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
176 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
64 |
3.3,3.3/5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA176,17X17,32 |
3 V |
70 Cel |
100 MBps |
0 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
15 mm |
ALSO REQUIRES 5V SUPPLY |
NO |
64 |
33 MHz |
20 |
220 |
15 mm |
CMOS |
3.3 V |
1 |
Bus Controllers |
PCI |
.8 mm |
S-PBGA-B176 |
3 |
Not Qualified |
YES |
e0 |
|||||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
2/5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
85 Cel |
.1875 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
16.585 mm |
ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY |
NO |
8 |
ASYNC, BIT |
24 MHz |
30 |
260 |
16.585 mm |
CMOS |
7.5 mA |
5 V |
2 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
NO |
e4 |
|||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
2/5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
85 Cel |
.1875 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
16.585 mm |
ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY |
NO |
8 |
ASYNC, BIT |
24 MHz |
30 |
260 |
16.585 mm |
CMOS |
7.5 mA |
5 V |
2 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
NO |
e4 |
|||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
3.3/5 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
3 V |
70 Cel |
50 MBps |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1.2 mm |
14 mm |
ALSO REQUIRES 5V SUPPLY |
NO |
32 |
IEEE1394 |
49.152 MHz |
NOT SPECIFIED |
260 |
14 mm |
CMOS |
3.3 V |
1 |
Bus Controllers |
.5 mm |
S-PQFP-G100 |
4 |
Not Qualified |
NO |
e4 |
||||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
FLATPACK, THIN PROFILE, FINE PITCH |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.2 mm |
7 mm |
NO |
0 |
NRZ |
100 MHz |
30 |
260 |
7 mm |
CMOS |
3.3 V |
1 |
PCI |
.5 mm |
S-PQFP-G48 |
2 |
Not Qualified |
YES |
e4 |
|||||||||||||||||||||||||||||||
|
|
Exar |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3.3/5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
.1875 MBps |
0 Cel |
Matte Tin (Sn) |
QUAD |
5.08 mm |
24.23 mm |
ALSO OPERATES AT 2.97 V MINIMUM SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
24 MHz |
30 |
245 |
24.23 mm |
CMOS |
5 V |
2 |
Serial IO/Communication Controllers |
PS/2 |
1.27 mm |
S-PQCC-J68 |
1 |
Not Qualified |
NO |
e3 |
||||||||||||||||||||||||||
|
|
Exar |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3.3/5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
.1875 MBps |
0 Cel |
MATTE TIN |
QUAD |
5.08 mm |
24.23 mm |
ALSO OPERATES AT 2.97 V MINIMUM SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
24 MHz |
24.23 mm |
CMOS |
5 V |
2 |
Serial IO/Communication Controllers |
PS/2 |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||||
|
|
Exar |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
4 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
MATTE TIN |
DUAL |
6.35 mm |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
7.372 MHz |
51.75 mm |
CMOS |
5 V |
2 |
8080; 8080A; 8085; 8086; 8088; Z80; Z8000; 68XX; 65XX; 8051; 68HC11 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||||
|
|
Exar |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
2.97 V |
70 Cel |
.125 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
10 mm |
ALSO OPERATES AT 3.3V SUPPLY AT 8MHZ |
NO |
8 |
NRZ |
ASYNC, BIT |
24 MHz |
10 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||
|
|
IXYS Corporation |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
0 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
100 Cel |
.512 MBps |
-40 Cel |
MATTE TIN |
QUAD |
4.57 mm |
0 |
16.585 mm |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |
NO |
8 |
NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC |
16.384 MHz |
20 |
260 |
16.585 mm |
CMOS |
15 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
Z-BUS |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
NO |
e3 |
0 |
|||||||||||||||||||||
|
|
IXYS Corporation |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
MATTE TIN |
DUAL |
4.75 mm |
15.24 mm |
NO |
8 |
NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC |
8 MHz |
52.325 mm |
CMOS |
230 mA |
5 V |
2 |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
3 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
24.23 mm |
ENHANCED BIDIRECTIONAL PRINTER PORT |
NO |
8 |
ASYNC, BIT |
16 MHz |
30 |
260 |
24.23 mm |
CMOS |
50 mA |
5 V |
2 |
Serial IO/Communication Controllers |
IBM PC-AT |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
NO |
e4 |
||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
3 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
24.23 mm |
ENHANCED BIDIRECTIONAL PRINTER PORT |
NO |
8 |
ASYNC, BIT |
16 MHz |
30 |
260 |
24.23 mm |
CMOS |
5 V |
2 |
Serial IO/Communication Controllers |
IBM PC-AT |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
NO |
e4 |
|||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
3 V |
85 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
10 mm |
ALSO OPERATES AT 5 V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
16 MHz |
30 |
260 |
10 mm |
CMOS |
50 mA |
3.3 V |
4 |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
NO |
e4 |
||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
3.3/5 |
CHIP CARRIER |
LDCC68,1.0SQ |
3 V |
70 Cel |
.125 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
24.23 mm |
ALSO OPERATES AT 5 V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
16 MHz |
30 |
260 |
24.23 mm |
CMOS |
50 mA |
3.3 V |
4 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J68 |
3 |
Not Qualified |
NO |
e4 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
CAN ALSO OPERATE AT 2.5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
30 |
260 |
5 mm |
CMOS |
3.3 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
11.505 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
30 |
245 |
11.505 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J28 |
3 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||
|
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
3 |
FLATPACK, THIN PROFILE, FINE PITCH |
4.5 V |
105 Cel |
.375 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.2 mm |
7 mm |
ALSO OPERATES AT 1.8V/2.5V/3.3V NOMINAL SUPPLY |
NO |
8 |
ASYNC, BIT |
48 MHz |
30 |
260 |
7 mm |
CMOS |
40 mA |
5 V |
2 |
.5 mm |
S-PQFP-G48 |
2 |
YES |
e4 |
||||||||||||||||||||||||||||||
|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
ISO/TS-16949 |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.97 V |
70 Cel |
0 Cel |
QUAD |
1.6 mm |
7 mm |
NO |
0 |
ASYNC, BIT; SYNC, BYTE; UART |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
3.3 V |
1 |
IRDA; LPC; PCI |
.4 mm |
S-PQFP-G64 |
YES |
||||||||||||||||||||||||||||||||||||
|
|
Exar |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
FLATPACK, THIN PROFILE, FINE PITCH |
2.97 V |
85 Cel |
.78125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.2 mm |
7 mm |
ALSO OPERATES AT 3.3V SUPPLY |
NO |
8 |
ASYNC, BIT |
24 MHz |
7 mm |
CMOS |
5 V |
2 |
.5 mm |
S-PQFP-G48 |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
|
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
56 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.98 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC56,.31SQ,20 |
1.62 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1 mm |
8 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
8 mm |
CMOS |
1.8 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-XQCC-N56 |
3 |
YES |
8 |
||||||||||||||||||||||||||||||||||
|
|
Diodes Incorporated |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.75 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.25 V |
85 Cel |
4.125 MBps |
-40 Cel |
QUAD |
.9 mm |
4 mm |
also operates with 3.3v @ 64mhz and 1.8v @ 32mhz and 24mhz |
NO |
0 |
ASYNC, BIT |
250 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
CMOS |
6 mA |
2.5 V |
1 |
I2C; IRDA; RS-232; RS-485; SPI; UART |
.5 mm |
S-XQCC-N24 |
YES |
8 |
||||||||||||||||||||||||||||||||
|
|
Diodes Incorporated |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ,20 |
1.62 V |
85 Cel |
2 MBps |
-40 Cel |
QUAD |
1.2 mm |
7 mm |
ALSO OPERATES AT 1.8V AND 2.5V NOMINAL |
NO |
8 |
ASYNC, BIT |
80 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
15 mA |
1.8 V |
IRDA; RS-232; RS-485 |
.5 mm |
S-PQFP-G48 |
NO |
|||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
256 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
10 mm |
ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X |
YES |
0 |
SYNC, BYTE; ETHERNET |
25 MHz |
30 |
260 |
10 mm |
CMOS |
1.2 V |
4 |
PCI |
.5 mm |
S-XQCC-N72 |
3 |
YES |
e3 |
||||||||||||||||||||||||||||||
|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
AEC-Q100; TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
105 Cel |
256 MBps |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1 mm |
10 mm |
ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X |
YES |
0 |
SYNC, BYTE; ETHERNET |
25 MHz |
30 |
260 |
10 mm |
CMOS |
1.2 V |
4 |
PCI |
.5 mm |
S-XQCC-N72 |
3 |
YES |
e3 |
||||||||||||||||||||||||||||||
|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
256 MBps |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1 mm |
10 mm |
ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X |
YES |
0 |
SYNC, BYTE; ETHERNET |
25 MHz |
30 |
260 |
10 mm |
CMOS |
1.2 V |
4 |
PCI |
.5 mm |
S-XQCC-N72 |
3 |
YES |
e3 |
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|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
AEC-Q100; TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
105 Cel |
256 MBps |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1 mm |
10 mm |
ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X |
YES |
0 |
SYNC, BYTE; ETHERNET |
25 MHz |
30 |
260 |
10 mm |
CMOS |
1.2 V |
4 |
PCI |
.5 mm |
S-XQCC-N72 |
3 |
YES |
e3 |
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|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
70 Cel |
256 MBps |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1 mm |
10 mm |
ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X |
YES |
0 |
SYNC, BYTE; ETHERNET |
25 MHz |
30 |
260 |
10 mm |
CMOS |
1.2 V |
4 |
PCI |
.5 mm |
S-XQCC-N72 |
3 |
YES |
e3 |
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|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
DUAL |
1.2 mm |
4.4 mm |
NO |
0 |
NRZ |
SYNC; BIT ;BYTE |
40 MHz |
6.5 mm |
CMOS |
10 mA |
5 V |
1 |
SPI |
.65 mm |
R-PDSO-G20 |
YES |
e3 |
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|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
GULL WING |
18 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
SMALL OUTLINE |
SOP18,.4 |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
NO |
0 |
NRZ |
SYNC; BIT ;BYTE |
40 MHz |
11.55 mm |
CMOS |
10 mA |
5 V |
1 |
SPI |
1.27 mm |
R-PDSO-G18 |
YES |
e3 |
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|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
SMALL OUTLINE |
SOP14,.24 |
2.7 V |
150 Cel |
1 MBps |
-40 Cel |
MATTE TIN |
DUAL |
1.75 mm |
3.9 mm |
NO |
SYNC; BIT ;BYTE |
40 MHz |
30 |
260 |
8.65 mm |
CMOS |
20 mA |
3.3 V |
1 |
SPI |
1.27 mm |
R-PDSO-G14 |
YES |
e3 |
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|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.18X.12,30 |
2.7 V |
125 Cel |
1 MBps |
-40 Cel |
MATTE TIN |
DUAL |
.9 mm |
3 mm |
NO |
0 |
SYNC; BIT ;BYTE |
40 MHz |
30 |
260 |
4.5 mm |
CMOS |
20 mA |
3.3 V |
1 |
SPI |
.65 mm |
R-PDSO-N14 |
YES |
e3 |
||||||||||||||||||||||||||||||
|
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
SMALL OUTLINE |
SOP14,.24 |
2.7 V |
125 Cel |
1 MBps |
-40 Cel |
MATTE TIN |
DUAL |
1.75 mm |
3.9 mm |
NO |
0 |
SYNC; BIT ;BYTE |
40 MHz |
30 |
260 |
8.65 mm |
CMOS |
20 mA |
3.3 V |
1 |
SPI |
1.27 mm |
R-PDSO-G14 |
YES |
e3 |
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|
|
Maxlinear |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CHIP CARRIER |
2.97 V |
85 Cel |
.25 MBps |
-40 Cel |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
36 MHz |
16.585 mm |
CMOS |
3.3 V |
1 |
ISA |
1.27 mm |
R-PQCC-J44 |
YES |
||||||||||||||||||||||||||||||||||||
|
|
Phoenix Contact |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
16 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4.5 V |
85 Cel |
-40 Cel |
DUAL |
NO |
UART |
CMOS |
5 V |
UART |
R-PDSO-G16 |
NO |
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|
|
FTDI |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.08 V |
105 Cel |
60 MBps |
-40 Cel |
QUAD |
.8 mm |
9 mm |
YES |
ASYNC, BIT; SYNC, BYTE |
12 MHz |
40 |
260 |
9 mm |
CMOS |
1.2 V |
4 |
I2C; RS-232; RS-422; RS-485; SPI; UART; USB |
.5 mm |
S-XQCC-N64 |
3 |
YES |
8 |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.