AUTOMOTIVE Serial Communication Controllers 14

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Maximum Data Transfer Rate Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Additional Features Boundary Scan Peripherals External Data Bus Width Data Encoding or Decoding Method Communication Protocol Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) No. of Timers RAM Bytes Technology Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Drive Interface Standard Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

SJA1000T/N,112

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, LAN

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

SMALL OUTLINE

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

NO

8

NRZ

24 MHz

17.9 mm

CMOS

5 V

2

1.27 mm

R-PDSO-G28

Not Qualified

YES

e3

SJA1000T/N,118

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, LAN

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

SMALL OUTLINE

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

NO

8

NRZ

24 MHz

17.9 mm

CMOS

5 V

2

1.27 mm

R-PDSO-G28

Not Qualified

YES

e3

SJA1000/N1,112

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, LAN

AUTOMOTIVE

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

8

IN-LINE

4.5 V

125 Cel

.125 MBps

-40 Cel

TIN

DUAL

5.1 mm

15.24 mm

NO

8

NRZ

24 MHz

35.5 mm

CMOS

5 V

2

2.54 mm

R-PDIP-T28

Not Qualified

YES

e3

SJA1000T/N1,112

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, LAN

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

SMALL OUTLINE

4.5 V

125 Cel

.125 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

NO

8

NRZ

24 MHz

30

260

17.9 mm

CMOS

5 V

2

1.27 mm

R-PDSO-G28

1

Not Qualified

YES

e4

ADM8511X-CC-T-1

Infineon Technologies

SERIAL IO/COMMUNICATION CONTROLLER, LAN

AUTOMOTIVE

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

125 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1.6 mm

14 mm

NO

BIPH-LEVEL(MANCHESTER)

25 MHz

260

14 mm

CMOS

3.3 V

2

USB

.5 mm

S-PQFP-G100

3

Not Qualified

YES

e3

MCP2515-E/MLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

8

AEC-Q100

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

14

4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

4 mm

CMOS

10 mA

5 V

1

SPI

.5 mm

S-PQCC-N20

YES

e3

0

MCP2515-E/SOVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

AEC-Q100

0

SMALL OUTLINE

SOP18,.4

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2.65 mm

14

7.5 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

11.55 mm

CMOS

10 mA

5 V

1

SPI

1.27 mm

R-PDSO-G18

YES

e3

0

MCP2515-E/STVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

YES

e3

MCP2515T-E/MLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

8

AEC-Q100

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

14

4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

4 mm

CMOS

10 mA

5 V

1

SPI

.5 mm

S-PQCC-N20

YES

e3

0

MCP2515T-E/SOVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE

SOP18,.4

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

11.55 mm

CMOS

10 mA

5 V

1

SPI

1.27 mm

R-PDSO-G18

YES

e3

MCP2518FDT-H/SLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

SMALL OUTLINE

SOP14,.24

2.7 V

150 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

NO

SYNC; BIT ;BYTE

40 MHz

30

260

8.65 mm

CMOS

20 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

MCP2518FDT-E/QBBVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC14,.18X.12,30

2.7 V

125 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

.9 mm

3 mm

NO

0

SYNC; BIT ;BYTE

40 MHz

30

260

4.5 mm

CMOS

20 mA

3.3 V

1

SPI

.65 mm

R-PDSO-N14

YES

e3

MCP2518FDT-E/SLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE

SOP14,.24

2.7 V

125 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

NO

0

SYNC; BIT ;BYTE

40 MHz

30

260

8.65 mm

CMOS

20 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

MCP2518FDT-H/QBBVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC14,.18X.12,30

2.7 V

150 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

.9 mm

3 mm

NO

0

SYNC; BIT ;BYTE

40 MHz

30

260

4.5 mm

CMOS

20 mA

3.3 V

1

SPI

.65 mm

R-PDSO-N14

YES

e3

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.