INDUSTRIAL Serial Communication Controllers 321

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
TL16C2552IFN	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V			3	2/5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	85 Cel	.1875 MBps	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	4.57 mm		16.585 mm	ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY	NO	8		ASYNC, BIT	24 MHz	30	260	16.585 mm	CMOS	7.5 mA	5 V		2	Serial IO/Communication Controllers		1.27 mm	S-PQCC-J44	3	Not Qualified	NO	e4
Z8523016VEG	IXYS Corporation	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0		0	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	.512 MBps	-40 Cel	MATTE TIN	QUAD	4.57 mm	0	16.585 mm	MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO	NO	8	NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC	16.384 MHz	20	260	16.585 mm	CMOS	15 mA	5 V	0	2	Other Microprocessor ICs	Z-BUS	1.27 mm	S-PQCC-J44	3	Not Qualified	NO	e3	0
CS8900A-IQ3Z	Cirrus Logic	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V			20	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3.135 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT	20 MHz		260	14 mm	CMOS		3.3 V		2	Serial IO/Communication Controllers	ISA	.5 mm	S-PQFP-G100	3	Not Qualified	YES	e3
CY7C53120E2-10SXIT	Cypress Semiconductor	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			16		SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.997 mm		11.303 mm		NO	8	DIFF BIPHASE-LEVEL		10 MHz			20.4465 mm	CMOS		5 V		5			1.27 mm	S-PDSO-G32		Not Qualified	NO	e4
ENC28J60-I/SP	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	3.6 V	8	TS 16949	0	3.3	IN-LINE	DIP28,.6	3.1 V	85 Cel	1.25 MBps	-40 Cel	MATTE TIN	DUAL	4.572 mm	8192	15.24 mm		NO	0		SYNC; BIT ;BYTE	25 MHz			34.671 mm	CMOS	180 mA	3.3 V		1	Serial IO/Communication Controllers	SPI	2.54 mm	R-PDIP-T28		Not Qualified	YES	e3
TL16CP554AIPM	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	3 V	85 Cel	.125 MBps	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		10 mm	ALSO OPERATES AT 5 V SUPPLY	NO	8	NRZ	ASYNC, BIT	16 MHz	30	260	10 mm	CMOS	50 mA	3.3 V		4	Serial IO/Communication Controllers		.5 mm	S-PQFP-G64	3	Not Qualified	NO	e4
SC16C850IBS,151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel	.625 MBps	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		5 mm	CAN ALSO OPERATE AT 2.5V SUPPLY	NO	8		ASYNC, BIT	80 MHz	30	260	5 mm	CMOS		3.3 V		1	Serial IO/Communication Controllers		.5 mm	S-PQCC-N32	1	Not Qualified	YES	e4
SC16IS741IPW,118	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	95 Cel	.625 MBps	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.1 mm		4.4 mm	CAN ALSO OPERATE AT 2.5V SUPPLY AT 48 MHZ	NO	0		ASYNC, BIT; I2C	80 MHz	30	260	5 mm	CMOS		3.3 V		1			.65 mm	R-PDSO-G16	1		YES	e4
SC16IS741IPW,128	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			0	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	3 V	95 Cel	.625 MBps	-40 Cel		DUAL	1.1 mm		4.4 mm	CAN ALSO OPERATE AT 2.5V SUPPLY AT 48 MHZ	NO	0		ASYNC, BIT; I2C	80 MHz	30	260	5 mm	CMOS		3.3 V		1	Serial IO/Communication Controllers		.65 mm	R-PDSO-G16	1	Not Qualified	YES
SC16IS850LIBS,128	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			2	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.65 V	85 Cel	.625 MBps	-40 Cel		QUAD	1 mm		4 mm		NO	8	NRZB	ASYNC, BIT; I2C	80 MHz	30	260	4 mm	CMOS		1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQCC-N24	1	Not Qualified	YES
SC16IS850LIBS,151	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			2	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.65 V	85 Cel	.625 MBps	-40 Cel		QUAD	1 mm		4 mm		NO	8	NRZB	ASYNC, BIT; I2C	80 MHz	30	260	4 mm	CMOS		1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQCC-N24	1	Not Qualified	YES
SC16IS850LIBS,157	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			2	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.65 V	85 Cel	.625 MBps	-40 Cel		QUAD	1 mm		4 mm		NO	8	NRZB	ASYNC, BIT; I2C	80 MHz	30	260	4 mm	CMOS		1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQCC-N24	1	Not Qualified	YES
SC16IS850LIPW,118	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			2	1.8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	1.65 V	85 Cel	.625 MBps	-40 Cel		DUAL	1.1 mm		4.4 mm		NO	8	NRZB	ASYNC, BIT; I2C	80 MHz	30	260	7.8 mm	CMOS		1.8 V		1	Serial IO/Communication Controllers		.65 mm	R-PDSO-G24	1	Not Qualified	YES
TL16C752CIPFBRQ1	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100	3		FLATPACK, THIN PROFILE, FINE PITCH		4.5 V	105 Cel	.375 MBps	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.2 mm		7 mm	ALSO OPERATES AT 1.8V/2.5V/3.3V NOMINAL SUPPLY	NO	8		ASYNC, BIT	48 MHz	30	260	7 mm	CMOS	40 mA	5 V		2			.5 mm	S-PQFP-G48	2		YES	e4
SCH3226I-SY	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8		0		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,11X11,25	2.97 V	85 Cel	.1875 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	256	8 mm		NO	0		SYNC, BYTE	33 MHz			8 mm	CMOS	1 mA	3 V	0	6		PCI; UART	.65 mm	S-PBGA-B100			YES	e1	40
XR16C2850IMTR-F	Exar	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			3		FLATPACK, THIN PROFILE, FINE PITCH		2.97 V	85 Cel	.78125 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		7 mm	ALSO OPERATES AT 3.3V SUPPLY	NO	8		ASYNC, BIT	24 MHz			7 mm	CMOS		5 V		2			.5 mm	S-PQFP-G48			YES	e3
LAN7800T-I/VSX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	8				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	2.97 V	85 Cel	625 MBps	-40 Cel	MATTE TIN	QUAD	.9 mm	512	6 mm		NO				25 MHz			6 mm	CMOS		3.3 V		10			.4 mm	S-XQCC-N48			YES	e3	8
LAN7850T-I/8JX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V			0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.1 V	85 Cel	125 MBps	-40 Cel		QUAD	1 mm		8 mm		YES	0		ASYNC, BIT; SYNC, BYTE	25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	CMOS	183 mA	1.2 V		2		USB	.5 mm	S-PQCC-N56			YES
FT4232H-56Q-TRAY	FTDI	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	56	HQCCN	SQUARE	UNSPECIFIED	YES	1.98 V					CHIP CARRIER, HEAT SINK/SLUG	LCC56,.31SQ,20	1.62 V	85 Cel	1.5 MBps	-40 Cel		QUAD	1 mm		8 mm		YES			ASYNC, BIT; SYNC, BYTE	12 MHz	40	260	8 mm	CMOS		1.8 V		4		I2C; RS-232; RS-422; RS-485; SPI; UART; USB	.5 mm	S-XQCC-N56	3		YES		8
PI7C9X1170ACLEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.97 V	85 Cel	4.125 MBps	-40 Cel		DUAL	1.2 mm		4.4 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	0		ASYNC, BIT	64 MHz	30	260	7.8 mm	CMOS		3.3 V		1		I2C; IRDA; RS-232; RS-485; SPI	.65 mm	R-PDSO-G24			NO
PI7C9X1170BCLEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.97 V	85 Cel	4.125 MBps	-40 Cel		DUAL	1.2 mm		4.4 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	0		ASYNC, BIT	64 MHz	30	260	5 mm	CMOS		3.3 V		1		I2C; IRDA; RS-232; RS-485; SPI	.65 mm	R-PDSO-G16			NO
PI7C9X1170CZDEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V			0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel	4.125 MBps	-40 Cel		QUAD	.9 mm		4 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	0		ASYNC, BIT	64 MHz	30	260	4 mm	CMOS		3.3 V		1		I2C; IRDA; RS-232; RS-485; SPI	.5 mm	S-XQCC-N24			NO
PI7C9X752FAEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3		FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ,20	1.62 V	85 Cel	2 MBps	-40 Cel		QUAD	1.2 mm		7 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	8		ASYNC, BIT	80 MHz	NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS	15 mA	1.8 V				IRDA; RS-232; RS-485	.5 mm	S-PQFP-G48			NO
LAN7431-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431T-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431T-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
MCP2515-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1		SPI	1.27 mm	R-PDSO-G18			YES	e3	0
MCP2515-I/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm	14	4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V		1		SPI	.65 mm	R-PDSO-G20			YES	e3	0
MCP2515T-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1		SPI	1.27 mm	R-PDSO-G18			YES	e3	0
XR16C850IJTR-F	Maxlinear	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	J BEND	44	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			3		CHIP CARRIER		2.97 V	85 Cel	.25 MBps	-40 Cel		QUAD	4.57 mm		16.585 mm		NO	8	NRZ	ASYNC, BIT	36 MHz			16.585 mm	CMOS		3.3 V		1		ISA	1.27 mm	R-PQCC-J44			YES
2746391	Phoenix Contact	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	16		RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							4.5 V	85 Cel		-40 Cel		DUAL					NO			UART					CMOS		5 V				UART		R-PDSO-G16			NO
Z16C3010AEG	Zilog	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	GULL WING	100	FQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16		FLATPACK, FINE PITCH	QFP100,.63SQ,20	4.5 V	105 Cel	1.25 MBps	-40 Cel	TIN	QUAD	1.8 mm		14 mm		NO	16			10 MHz	20	260	14 mm	CMOS	50 mA	5 V					.5 mm	S-PQFP-G100	3		YES	e3	13

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.